Two Packaging Solutions for High Temperature SiC Diode Sensors
2014 ◽
Vol 778-780
◽
pp. 1063-1066
◽
Keyword(s):
A partially electrically isolated package with a gold wire and fully isolated solution with a metallic piston, respectively, are designed and tested for high temperature sensors (400°C) based on SiC Schottky barrier diodes (SBD). Electrical behavior and sensor performance are very close for both packaging solutions. The stress due to contact pressure and higher cost are some disadvantages for pressure contact technology.
1974 ◽
Vol 17
(8)
◽
pp. 869-876
◽
2014 ◽
Vol 2014
(HITEC)
◽
pp. 000058-000060
2003 ◽
Vol 433-436
◽
pp. 685-688
2004 ◽
Vol 457-460
◽
pp. 997-1000
◽
2014 ◽
Vol 53
(4S)
◽
pp. 04EP04
◽
Keyword(s):
2021 ◽
Vol 39
(4)
◽
pp. 040402
2003 ◽
Vol 433-436
◽
pp. 823-826
◽