Simulation of Natural Aging in Al-Mg-Si Alloys

2015 ◽  
Vol 828-829 ◽  
pp. 468-473 ◽  
Author(s):  
Thomas Weisz ◽  
Piotr Warczok ◽  
Thomas Ebner ◽  
Ahmad Falahati ◽  
Ernst Kozeschnik
Keyword(s):  
Experimental Investigation ◽  
Room Temperature ◽  
Artificial Aging ◽  
Cluster Formation ◽  
Natural Aging ◽  
Room Temperature Aging ◽  
Negative Effect ◽  
Aging Mechanisms ◽  
Microalloying Elements ◽  
Temperature Aging

Natural aging during storage of Al-Mg-Si alloys at room temperature can significantly reduce the maximum strengthening potential (T6) during artificial aging and, therefore, is a key topic in aluminium research and industry. Many different strategies to understand and reduce the negative effect of natural aging have been investigated during the last decades, including analysis of different thermal pre-treatments and considering the effect of different microalloying elements. From these investigations, the vacancy evolution and the formation of clusters containing Mg and Si were found to be the governing aging mechanisms behind natural aging. In this work, we present a model to simulate and predict the behavior of these alloys when subjected to room temperature aging after solutionizing and demonstrate the effects of different thermal routes and chemical composition variations. In the implemented model, the evolution of excess quenched-in vacancies and the effect of solute vacancy traps are considered. Special emphasis is placed on co-cluster formation and its contribution to strengthening. The thermokinetic software MatCalc is used for the simulations and the results of the simulations are validated by experimental investigation.

The Heat Treatment of Rheo-High Pressure Die Cast Al-Zn-Mg Alloy 7017

2012 ◽  
Vol 192-193 ◽  
pp. 155-160 ◽  
Author(s):  
Heinrich Möller ◽  
Gonasagren Govender
Keyword(s):  
Heat Treatment ◽  
High Pressure ◽  
Room Temperature ◽  
Artificial Aging ◽  
Solution Treatment ◽  
Mg Alloy ◽  
Aging Response ◽  
Die Cast ◽  
Room Temperature Aging ◽  
Temperature Aging

The CSIR rheocasting system was successfully used to produce high pressure die cast plates of medium-strength, weldable, wrought Al-Zn-Mg alloy 7017. A solution treatment at 450oC for 5 h leads to insufficient dissolution of Mg and Zn, resulting in inadequate T6 mechanical properties after artificial aging. However, a solution treatment at 470oC for 5 h, followed by water quenching and artificial aging at 120oC for 24 h results in tensile properties comparable to those of wrought alloy 7017 plate and extrusions. The alloy also shows a strong room temperature aging response, making it ideal to be used after welding without any further heat treatment.

scholarly journals Effect of Cold Rolling on Cluster(1) Dissolvability during Artificial Aging and Formability during Natural Aging in Al-0.6Mg-1.0Si-0.5Cu Alloy

Metals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 92
Author(s):  
Naoto Kirekawa ◽  
Kaisei Saito ◽  
Minho O ◽  
Equo Kobayashi
Keyword(s):  
Cold Rolling ◽  
Artificial Aging ◽  
Cluster Formation ◽  
Solution Treatment ◽  
Natural Aging ◽  
Tensile Tests ◽  
Scanning Calorimetry ◽  
Hardness Tests ◽  
Negative Effect ◽  
Cold Rolled

Natural aging after solution treatment has a negative effect on the precipitation strengthening of Al–Mg–Si alloys since Cluster(1) formed at a room temperature cannot be dissolved or transformed into precipitates during artificial aging at 170 °C. In this study, cold rolling is focused on as an alternative solution to pre-aging, which is a conventional method to prevent Cluster(1) formation. It is known that excess vacancies are necessary for cluster formation. Cold rolling suppresses cluster formation because excess vacancies disappear at dislocations introduced by cold rolling. In addition, it is expected that cold rolling accelerates the precipitation behavior because the diffusion of solute atoms is promoted by introduced lattice defects. The transition of Cluster(1) was evaluated by Micro Vickers hardness tests, tensile tests, electrical conductivity measurements and differential scanning calorimetry analyses. Results showed the negative effect of natural aging was almost suppressed in 10% cold-rolled samples and completely suppressed in 30% cold-rolled samples since Cluster(1) dissolved during artificial aging at 170 °C due to lowering of the temperature of Cluster(1) dissolution by cold rolling. It was found that the precipitation in cold-rolled samples was accelerated since the hardness peak of 10% cold-rolled samples appeared earlier than T6 and pre-aged samples.

scholarly journals Effects of Room Temperature Aging on Adhesion of Electroless Plating Film on Silicon Using Gold Nanoparticle Catalysts

2019 ◽  
Vol 70 (3) ◽  
pp. 174-176
Author(s):  
Yuichi TAKASAKA ◽  
Ryo FUJII ◽  
Naoki YAMADA ◽  
Naoki FUKUMURO ◽  
Susumu SAKAMOTO ◽  
...  
Keyword(s):  
Gold Nanoparticle ◽  
Electroless Plating ◽  
Room Temperature ◽  
Nanoparticle Catalysts ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of various pre-treatments and cold rolling on room temperature aging of 6000 series aluminum alloys

2009 ◽  
Vol 59 (5) ◽  
pp. 254-260
Author(s):  
Takahiko Nakamura ◽  
Kenji Muramatsu ◽  
Masanori Nagai ◽  
Ryouhei Otsu ◽  
Shin-ya Komatsu
Keyword(s):  
Aluminum Alloys ◽  
Cold Rolling ◽  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging

Sn Whisker Growth in Cu(Top)-Sn(Bottom) Bilayer System upon Room Temperature Aging

2013 ◽  
Vol 785-786 ◽  
pp. 918-923 ◽  
Author(s):  
Lin Huang ◽  
Xue Nian Lin ◽  
Ren Wu Chen ◽  
Jiang Yong Wang
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
X Ray Diffraction ◽  
Sn Whisker ◽  
X Ray ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Sublayer Thickness ◽  
Temperature Aging ◽  
Scanning Electron

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

scholarly journals On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

2015 ◽  
Vol 515 ◽  
pp. 54-61 ◽  
Author(s):  
А.V. Fetisov ◽  
G.А. Kozhina ◽  
S.Kh. Estemirova ◽  
V.Ya. Mitrofanov
Keyword(s):  
Room Temperature ◽  
Aging Effects ◽  
Room Temperature Aging ◽  
Temperature Aging
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