scholarly journals Investigation of latent heat of melting and thermal conductivity of the low-melting Bi-Sn-Zn eutectic alloy

2020 ◽  
Vol 57 (04) ◽  
pp. 267-273
Author(s):  
I. Manasijevic ◽  
Lj. Balanovic ◽  
D. Minic ◽  
M. Gorgievski ◽  
U. Stamenkovic
Keyword(s):  
Thermal Conductivity ◽  
Latent Heat ◽  
Eutectic Alloy ◽  
Latent Heat Of Melting

scholarly journals Thermal characterization of the In–Sn–Zn eutectic alloy

10.30544/456 ◽  
2020 ◽  
Vol 25 (04) ◽  
pp. 325-334
Author(s):  
Dragan Manasijević ◽  
Ljubiša Balanović ◽  
Vladan Ćosović ◽  
Duško Minić ◽  
Milena Premović ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Melting Temperature ◽  
Latent Heat ◽  
Eutectic Alloy ◽  
Metallic Phase ◽  
Flash Method ◽  
Nominal Composition ◽  
Scanning Calorimetry ◽  
Latent Heat Of Melting

Thermal properties, including melting temperature, latent heat of melting, specific heat capacity and thermal conductivity, of a low-melting In–Sn–Zn eutectic alloy were investigated in this work. The In–Sn–Zn eutectic alloy with nominal composition 52.7In-44.9Sn-2.4Zn (at.%) was prepared by the melting of pure metals under an argon atmosphere. The conducted assessment consisted of both theoretical and experimental approaches. Differential scanning calorimetry (DSC) was used for the measurement of melting temperature and latent heat, and the obtained results were compared with the results of thermodynamic calculations. The measured melting temperature and the latent heat of melting for the In–Sn–Zn eutectic alloy are 106.5±0.1 °C and 28.3±0.1 Jg-1, respectively. Thermal diffusivity and thermal conductivity of the In–Sn–Zn eutectic alloy were studied by the xenon-flash method. The determined thermal conductivity of the investigated eutectic alloy at 25 °C is 42.2±3.4 Wm-1K-1. Apart from providing insight into the possibility for application of the investigated alloy as the metallic phase-change material, the obtained values of thermal properties can also be utilized as input parameters for various simulation processes such as casting and soldering.

Thermal Conductivity Enhancement in a Latent Heat Storage Device

2013 ◽  
Vol 860-863 ◽  
pp. 590-593
Author(s):  
Cha Xiu Guo ◽  
Ding Bao Wang ◽  
Gao Lin Hu
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Solid State ◽  
Liquid Phase ◽  
Phase Change ◽  
Latent Heat ◽  
Heat Storage ◽  
Storage Device ◽  
Latent Heat Storage ◽  
Conductivity Enhancement

High conductivity porosity materials are proposed to enhance the phase change materials (PCM) in order to solve the problem of low conductivity of PCM in the latent heat storage device (LHSD), and two-dimensional numerical simulation is conducted to predict the performance of the PCM by CFD software. During the phase change process, the PCM is heated from the solid state to the liquid phase in the process of melting and from the liquid phase to the solid state in the solidification process. The results show that porosity materials can improve heat transfer rate effectively, but the effect of heat transfer of Al foam is superior to that of graphite foam although the heat storage capacity is almost the same for both. The heat transfer is enhanced and the solidification time of PCM is decreased since the effective thermal conductivity of composite PCM is increased.

scholarly journals Propagation of a Boundary of Fusion

1952 ◽  
Vol 1 (1) ◽  
pp. 42-47 ◽  
Author(s):  
Stewart Paterson
Keyword(s):  
Thermal Conductivity ◽  
Boundary Condition ◽  
Latent Heat ◽  
Phase 1 ◽  
Unit Mass ◽  
Phase 2 ◽  
Moving Surface ◽  
Partial Differentiation ◽  
Image Position ◽  
Definite Temperature

We consider a volume of material, divided into two regions 1 and 2. each of density ρ, by a moving surface S. On S a change of phase occurs, at a definite temperature (which we may take to be zero) and with absorption or liberation of a latent heat L per unit mass. If θl, kl, K1 are the temperature, thermal conductivity and diffusivity of phase 1, and θ2, k2, K2 corresponding quantities for phase 2, the surface S is the isothermaland the boundary condition on this surface isSubscript letters denote partial differentiation.

scholarly journals Thermal Conductivity and Density Evaluation of Nanosuspension as Latent Heat Storage Material

Netsu Bussei ◽  
2019 ◽  
Vol 33 (4) ◽  
pp. 151-158
Author(s):  
Shin-ichi Morita ◽  
Fumiya Irie ◽  
Katsuma Hirano ◽  
Yasutaka Hayamizu ◽  
Takanobu Yamada ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Latent Heat ◽  
Heat Storage ◽  
Storage Material ◽  
Latent Heat Storage ◽  
Heat Storage Material ◽  
Density Evaluation
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