Thermal Performance and Ambient Airside Pressure Drop Prediction for Automotive Charge Air Cooler Using 1-D Simulation

2021 ◽  
Author(s):  
Shankar Ganesan ◽  
Rohit Chandra pauriyal ◽  
Rajesh Thiyagarajan
Keyword(s):  
Pressure Drop ◽  
Thermal Performance ◽  
Air Cooler

scholarly journals Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2041
Author(s):  
Eva C. Silva ◽  
Álvaro M. Sampaio ◽  
António J. Pontes
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Additive Manufacturing ◽  
Pressure Drop ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sinks ◽  
Trapezoidal Shape ◽  
Computational Fluid Dynamics Simulations ◽  
Dynamics Simulations

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.

scholarly journals Simulation approach on turbulent thermal performance factor of Al2O3-Cu/water hybrid nanofluid in circular and non-circular ducts

2021 ◽  
Vol 3 (3) ◽  
Author(s):  
Ing Jiat Kendrick Wong ◽  
Ngieng Tze Angnes Tiong
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Pressure Drop ◽  
Thermal Performance ◽  
Heat Transfer Performance ◽  
Pure Water ◽  
Hybrid Nanofluid ◽  
Performance Factor ◽  
Thermal Performance Factor ◽  
The Heat Transfer Coefficient

AbstractThis paper presents the numerical study of thermal performance factor of Al2O3-Cu/water hybrid nanofluid in circular and non-circular ducts (square and rectangular). Turbulent regime is studied with the Reynolds number ranges from 10000 to 100000. The heat transfer performance and flow behaviour of hybrid nanofluid are investigated, considering the nanofluid volume concentration between 0.1 and 2%. The thermal performance factor of hybrid nanofluid is evaluated in terms of performance evaluation criteria (PEC). This present numerical results are successfully validated with the data from the literature. The results indicate that the heat transfer coefficient and Nusselt number of Al2O3-Cu/water hybrid nanofluid are higher than those of Al2O3/water nanofluid and pure water. However, this heat transfer enhancement is achieved at the expense of an increased pressure drop. The heat transfer coefficient of 2% hybrid nanofluid is approximately 58.6% larger than the value of pure water at the Reynolds number of 10000. For the same concentration and Reynolds number, the pressure drop of hybrid nanofluid is 4.79 times higher than the pressure drop of water. The heat transfer performance is the best in the circular pipe compared to the non-circular ducts, but its pressure drop increment is also the largest. The hybrid nanofluid helps to improve the problem of low heat transfer characteristic in the non-circular ducts. In overall, the hybrid nanofluid flow in circular and non-circular ducts are reported to possess better thermal performance factor than that of water. The maximum attainable PEC is obtained by 2% hybrid nanofluid in the square duct at the Reynolds Number of 60000. This study can help to determine which geometry is efficient for the heat transfer application of hybrid nanofluid.

Heat Transfer Enhancement in a Rectangular (AR = 3:1) Channel With V-Shaped Dimples

2012 ◽  
Vol 135 (1) ◽  
Author(s):  
C. Neil Jordan ◽  
Lesley M. Wright
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Nusselt Number ◽  
Liquid Crystal ◽  
Pressure Drop ◽  
Heat Transfer Enhancement ◽  
Thermal Performance ◽  
Secondary Flows ◽  
Transfer Enhancement ◽  
Reduced Pressure

An alternative to ribs for internal heat transfer enhancement of gas turbine airfoils is dimpled depressions. Relative to ribs, dimples incur a reduced pressure drop, which can increase the overall thermal performance of the channel. This experimental investigation measures detailed Nusselt number ratio distributions obtained from an array of V-shaped dimples (δ/D = 0.30). Although the V-shaped dimple array is derived from a traditional hemispherical dimple array, the V-shaped dimples are arranged in an in-line pattern. The resulting spacing of the V-shaped dimples is 3.2D in both the streamwise and spanwise directions. A single wide wall of a rectangular channel (AR = 3:1) is lined with V-shaped dimples. The channel Reynolds number ranges from 10,000–40,000. Detailed Nusselt number ratios are obtained using both a transient liquid crystal technique and a newly developed transient temperature sensitive paint (TSP) technique. Therefore, the TSP technique is not only validated against a baseline geometry (smooth channel), but it is also validated against a more established technique. Measurements indicate that the proposed V-shaped dimple design is a promising alternative to traditional ribs or hemispherical dimples. At lower Reynolds numbers, the V-shaped dimples display heat transfer and friction behavior similar to traditional dimples. However, as the Reynolds number increases to 30,000 and 40,000, secondary flows developed in the V-shaped concavities further enhance the heat transfer from the dimpled surface (similar to angled and V-shaped rib induced secondary flows). This additional enhancement is obtained with only a marginal increase in the pressure drop. Therefore, as the Reynolds number within the channel increases, the thermal performance also increases. While this trend has been confirmed with both the transient TSP and liquid crystal techniques, TSP is shown to have limited capabilities when acquiring highly resolved detailed heat transfer coefficient distributions.

Experimental Study on Flow Behavior and Heat Transfer Enhancement with Distinct Dimpled Gas Turbine Blade Internal Cooling Channel

2021 ◽  
pp. 1-28
Author(s):  
Farah Nazifa Nourin ◽  
Ryoichi S. Amano
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Transfer Enhancement ◽  
Gas Turbine ◽  
Turbine Blade ◽  
Thermal Performance ◽  
Diameter Ratio ◽  
Internal Cooling ◽  
Cooling Channel ◽  
Transfer Enhancement

Abstract The study presents the investigation on heat transfer distribution along a gas turbine blade internal cooling channel. Six different cases were considered in this study, using the smooth surface channel as a baseline. Three different dimples depth-to-diameter ratios with 0.1, 0.25, and 0.50 were considered. Different combinations of partial spherical and leaf dimples were also studied with the Reynolds numbers of 6,000, 20,000, 30,000, 40,000, and 50,000. In addition to the experimental investigation, the numerical study was conducted using Large Eddy Simulation (LES) to validate the data. It was found that the highest depth-to-diameter ratio showed the highest heat transfer rate. However, there is a penalty for increased pressure drop. The highest pressure drop affects the overall thermal performance of the cooling channel. The results showed that the leaf dimpled surface is the best cooling channel based on the highest Reynolds number's heat transfer enhancement and friction factor. However, at the lowest Reynolds number, partial spherical dimples with a 0.25 depth to diameter ratio showed the highest thermal performance.

Optimal Shapes of Fully Embedded Channels for Conjugate Cooling

1999 ◽  
Author(s):  
T. S. Fisher ◽  
K. E. Torrance
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Wall Thickness ◽  
Thermal Performance ◽  
Channel Width ◽  
Optimal Boundary ◽  
Optimal Shapes ◽  
Optimal Distance ◽  
Channel Boundary ◽  
Boundary Curvature

Abstract Optimal shapes and geometries are determined for systems involving liquid and gas coolants. The shape of the channel boundary, channel width, and wall thickness are varied to minimize overall thermal resistance under flow constraints involving pressure drop and pump work. The effect of boundary curvature is studied systematically by employing a parameterized boundary shape that spans from rounded rectangles to ellipses to rounded diamonds. The results indicate that increased channel boundary curvature can decrease the optimal distance between channels, and that the optimal boundary shapes of fully embedded channels can be non-rectangular. In particular, elliptic and nearly elliptic shapes are found to produce equivalent optimal thermal performance as rounded rectangular shapes under practical conditions.

A Micromachined Manifold Microchannel Cooler

2009 ◽  
Author(s):  
Lauren Boteler ◽  
Nicholas Jankowski ◽  
Bruce Geil ◽  
Patrick McCluskey
Keyword(s):  
Pressure Drop ◽  
Aluminum Nitride ◽  
Thermal Performance ◽  
Performance Testing ◽  
Heat Sources ◽  
Temperature Uniformity ◽  
New Device ◽  
Alignment Procedure ◽  
Wide Range ◽  
Manifold Microchannel

An improved MEMS fabricated, manifold microchannel cooler has been developed for single phase liquid, forced convection. The manifold design uses multiple channel sizes to minimize pressure drop, maximize heat transfer, and improve temperature uniformity across the area of the cooled device. A significant reduction is achieved in thermal resistance between the device and the cooling fluid. This is a critical need in modern electronic components because of the increasing demand for higher power levels and packaging densities. This paper discusses improvements in fabrication, alignment procedure, and packaging in comparison to our previously published work. A wide range of microchannel dimensions have been fabricated and tested to show the effect of channel size on performance. Testing results of the thermal transfer rates will be presented using silicon diodes as heat sources. A 25 mm × 8 mm × 3 mm (thick) silicon cooler was fabricated to cool two 6 mm square devices. The cooler was microfabricated with a silicon three wafer stack and the channels were etched using standard MEMS processing techniques including DRIE. This new device has modified the authors previously published work in a number of ways. First, fabrication sequence has been modified for better depth uniformity and a new alignment technique has been used that incorporates micro ball bearings as passive alignment pins. Second, triangular shaped inlets have been incorporated to further reduce pressure drop. Third, an aluminum nitride layer was incorporated into the layer stack to achieve electrical isolation between the device and the fluid. Finally, thermal characterization has been improved by using aluminum nitride chip resistors as surrogate heat sources with improved reliability and temperature uniformity over the heated area. Dimensional improvements have also been made to improve fluidic performance and lessen the potential of clogging. The manifold channels are 500 μm wide and 1mm deep with a 50 μm fin width. The microchannels are 150 μm deep with a width of 80 μm and a fin width of 40 μm. The aluminum nitride is bonded onto the top of the silicon channels then the chip resistors are bonded with a silver polyimide paste onto the aluminum nitride. The devices fluidic and thermal performance was measured. We have demonstrated an improvement over the previously published manifold microchannel cooler while also demonstrating the use as a multichip module. The manifold microchannel design minimizes the pressure drop across the channel while maximizing cooling potential and temperature uniformity across the area of the device. The experimental results have shown very promising thermal performance of this multi-chip manifold microchannel cooler. Thermal resistances less than 0.4 C/W were measured at flow rates of 400 ccm with a pressure drop of 5.6 psi. Tests were performed with heat fluxes up to 331 W/cm2 with a measured chip temperature rise of only 53C. The results of the testing show very good thermal performance of this device.

scholarly journals Experimental study on turbulent convective heat transfer, pressure drop, and thermal performance characterization of ZnO/water nanofluid flow in a circular tube

2014 ◽  
Vol 18 (4) ◽  
pp. 1315-1326 ◽  
Author(s):  
Ahmad Sajadi ◽  
Seyed Sadati ◽  
Masoud Nourimotlagh ◽  
Omid Pakbaz ◽  
Dariush Ashtiani ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Experimental Study ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Thermal Performance ◽  
Base Fluid ◽  
Circular Tube ◽  
Turbulent Regime ◽  
Nanofluid Flow ◽  
Volume Fractions

In this experimental study heat transfer and pressure drop behavior of ZnO/water nanofluid flow inside a circular tube with constant wall temperature condition is investigated where the volume fractions of nanoparticles in the base fluid are 1% and 2%. The experiments? Reynolds numbers ranged roughly from 5000 to 30000. The experimental measurements have been carried out in the fully-developed turbulent regime. The results indicated that heat transfer coefficient increases by 11% and 18% with increasing volume fractions of nanoparticles respectively to 1% and 2% vol. The measurements also showed that the pressure drop of nanofluids were respectively 45% and145% higher than that of the base fluid for volume fractions of 1% and 2% of nanoparticles. However experimental results revealed that overall thermal performance of nanofluid is higher than that of pure water by up to 16% for 2% vol. nanofluid. Also experimental results proved that existing correlations can accurately estimate nanofluids convective heat transfer coefficient and friction factor in turbulent regime, provided that thermal conductivity, heat capacity, and viscosity of the nanofluids are used in calculating the Reynolds, Prandtl, and Nusselt numbers.

A Numerical Study of the Thermal Performance of Two Stationary Insert Designs in Internal Compressible Flows

2009 ◽  
Author(s):  
Emad Y. Tanbour ◽  
Ramin K. Rahmani
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Transfer Enhancement ◽  
Forced Convection ◽  
Thermal Performance ◽  
Compressible Flows ◽  
Convection Heat Transfer ◽  
Convection Heat ◽  
Transfer Enhancement ◽  
Stationary Heat Transfer

Enhancement of the natural and forced convection heat transfer has been the subject of numerous academic and industrial studies. Air blenders, mechanical agitators, and static mixers have been developed to increase the forced convection heat transfer rate in compressible and incompressible flows. Stationary inserts can be efficiently employed as heat transfer enhancement devices in the natural convection systems. Generally, a stationary heat transfer enhancement insert consists of a number of equal motionless segments, placed inside of a pipe in order to control flowing fluid streams. These devices have low maintenance and operating costs, low space requirements and no moving parts. A range of designs exists for a wide range of specific applications. The shape of the elements determines the character of the fluid motion and thus determines thermal effectiveness of the insert. There are several key parameters that may be considered in the design procedure of a heat transfer enhancement insert, which lead to significant differences in the performance of various designs. An ideal insert, for natural conventional heat transfer in compressible flow applications, provides a higher rate of heat transfer and a thermally homogenous fluid with minimized pressure drop and required space. To choose an insert for a given application or in order to design a new insert, besides experimentation, it is possible to use Computational Fluid Dynamics to study the insert performance. This paper presents the outcomes of the numerical studies on industrial stationary heat transfer enhancement inserts and illustrates how a heat transfer enhancement insert can improve the heat transfer in buoyancy driven compressible flows. Using different measuring tools, thermal performance of two different inserts (twisted and helix) are studied. It is shown that the helix design leads to a higher rate of heat transfer, while causes a lower pressure drop in the flowfield, suggesting the insert effectiveness is higher for the helix design, compared to a twisted plate.

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