scholarly journals THIN THERMAL MANAGEMENT MODULES USING FLATTENED HEAT PIPES AND PIEZOELECTRIC FANS FOR ELECTRONIC DEVICES

2021 ◽  
Vol 17 (0) ◽  
Author(s):  
Randeep Singh ◽  
Jason Velardo ◽  
Mohammad Shahed Ahamed ◽  
Masataka Mochizuki ◽  
Abhijit Date ◽  
...  
Keyword(s):  
Thermal Management ◽  
Electronic Devices ◽  
Heat Pipes ◽  
Piezoelectric Fans

scholarly journals A Review On Transient Thermal Management of Electronic Devices

2021 ◽  
Author(s):  
John Mathew ◽  
Shankar Krishnan
Keyword(s):  
Thermal Management ◽  
Laser Diode ◽  
High Power ◽  
Electronic Devices ◽  
Thermal Response ◽  
Heat Pipes ◽  
Design Guidelines ◽  
Thermal Design ◽  
Laser Diode Arrays ◽  
Transient Thermal

Abstract Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

DEVELOPMENT OF MINIATURE HEAT PIPES FOR THERMAL MANAGEMENT OF ELECTRONICS IN ISRO SPACECRAFT

2018 ◽  
Author(s):  
Akhil Jaiswal ◽  
A. R. Anand ◽  
Simhachal Rao Chikkala ◽  
Venkata Raghavendra
Keyword(s):  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Management Of Electronics

Investigation of Heat Transfer Enhancement Effect on Normal and Nano Coated Wick Structure Heat Pipes-A Comparative Assessment

2020 ◽  
Vol 51 ◽  
pp. 191-198
Author(s):  
N. Manikanda Prabu ◽  
S. Nallusamy ◽  
G. Sureshkannan
Keyword(s):  
Heat Transfer ◽  
Electronic Devices ◽  
Research Work ◽  
Heat Pipes ◽  
Enhancement Effect ◽  
Heat Transfer Capacity ◽  
Wick Structure ◽  
Improve Heat Transfer ◽  
Super Conducting ◽  
The Stability

Removal of heat generation is an important characteristic needs to be considered in electromechanical and electronic devices which improve the stability and feasibility of system. Despite numerous cooling methods, heat pipes are recent updating in research line. Heat pipes are one of the super conducting medium of heat energy and it is being used as an equipment to absorb more heat through phase change process of cooling medium circulated in it. It ensures the direct enhancement in heat transfer capacity and characteristics. Nowadays, improvement of the thermal performance in heat pipes getting up with various technologies, especially combination of heat pipe and Nano fluids. It has been experimentally practiced and various results are observed by previous researches that wick structure also a part of reason in improvement. The aim of this research work is to analyze the influence of wick material to improve heat transfer characteristics in heat pipes. In addition, combination of nano coated wick material with heat pipes is comparatively analyzed. From the final observed results it was found that, the best combination of wick material is supporting the better cooling requirements in electronic devices.

Thermal Design and Testing of a Passive Helmet Heat Exchanger With Additively Manufactured Components

2018 ◽  
Author(s):  
Kailyn Cage ◽  
Monifa Vaughn-Cooke ◽  
Mark Fuge ◽  
Briana Lucero ◽  
Dusan Spernjak ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Design ◽  
Analytical Models ◽  
Small Scale ◽  
Dimensional System ◽  
Concept Design ◽  
Environmental Chamber

Additive manufacturing (AM) processes allow for complex geometries to be developed in a cost- and time-efficient manner in small-scale productions. The unique functionality of AM offers an ideal collaboration between specific applications of human variability and thermal management. This research investigates the intersection of AM, human variability and thermal management in the development of a military helmet heat exchanger. A primary aim of this research was to establish the effectiveness of AM components in thermal applications based on material composition. Using additively manufactured heat pipe holders, the thermal properties of a passive evaporative cooler are tested for performance capability with various heat pipes over two environmental conditions. This study conducted a proof-of-concept design for a passive helmet heat exchanger, incorporating AM components as both the heat pipe holders and the cushioning material targeting internal head temperatures of ≤ 35°C. Copper heat pipes from 3 manufactures with three lengths were analytically simulated and experimentally tested for their effectiveness in the helmet design. A total of 12 heat pipes were tested with 2 heat pipes per holder in a lateral configuration inside a thermal environmental chamber. Two 25-hour tests in an environmental chamber were conducted evaluating temperature (25°C, 45°C) and relative humidity (25%, 50%) for the six types of heat pipes and compared against the analytical models of the helmet heat exchangers. Many of the heat pipes tested were good conduits for moving the heat from the head to the evaporative wicking material. All heat pipes had Coefficients of Performance under 3.5 when tested with the lateral system. Comparisons of the analytical and experimental models show the need for the design to incorporate a re-wetting reservoir. This work on a 2-dimensional system establishes the basis for design improvements and integration of the heat pipes and additively manufactured parts with a 3-dimensional helmet.

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