Investigation of Heat Transfer Enhancement Effect on Normal and Nano Coated Wick Structure Heat Pipes-A Comparative Assessment

2020 ◽  
Vol 51 ◽  
pp. 191-198
Author(s):  
N. Manikanda Prabu ◽  
S. Nallusamy ◽  
G. Sureshkannan
Keyword(s):  
Heat Transfer ◽  
Electronic Devices ◽  
Research Work ◽  
Heat Pipes ◽  
Enhancement Effect ◽  
Heat Transfer Capacity ◽  
Wick Structure ◽  
Improve Heat Transfer ◽  
Super Conducting ◽  
The Stability

Removal of heat generation is an important characteristic needs to be considered in electromechanical and electronic devices which improve the stability and feasibility of system. Despite numerous cooling methods, heat pipes are recent updating in research line. Heat pipes are one of the super conducting medium of heat energy and it is being used as an equipment to absorb more heat through phase change process of cooling medium circulated in it. It ensures the direct enhancement in heat transfer capacity and characteristics. Nowadays, improvement of the thermal performance in heat pipes getting up with various technologies, especially combination of heat pipe and Nano fluids. It has been experimentally practiced and various results are observed by previous researches that wick structure also a part of reason in improvement. The aim of this research work is to analyze the influence of wick material to improve heat transfer characteristics in heat pipes. In addition, combination of nano coated wick material with heat pipes is comparatively analyzed. From the final observed results it was found that, the best combination of wick material is supporting the better cooling requirements in electronic devices.

An Experimental Investigation on Micro Heat Pipe with a Trapezium-Grooved Wick Structure

2010 ◽  
Vol 29-32 ◽  
pp. 1695-1700
Author(s):  
Shi Gang Wang ◽  
Xi Bing Li ◽  
Bai Rui Tao ◽  
Hong Xia Zhang
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Optimum Design ◽  
Heat Pipes ◽  
Micro Heat Pipe ◽  
Capillary Limit ◽  
Heat Transfer Capacity ◽  
Wick Structure ◽  
Micro Heat Pipes

Through combination of experimental investigation with theoretical optimum design, this paper determined the crucial factors in affecting the heat transfer capacity in micro heat pipes with a trapezium-grooved wick structure are capillary limit and entrainment limit, and verified the validity of the heat transfer models thus built.

scholarly journals Heat Pipe System as a Component of Spacecraft Electronics

2021 ◽  
pp. 363-377
Author(s):  
Nikita Yu. Sokolov ◽  
Vladimir A. Kulagin ◽  
Dmitry A. Nesterov
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Electronic Devices ◽  
Heat Pipes ◽  
Optimization Method ◽  
Maximum Temperature ◽  
Pipe System ◽  
Heat Transfer Capacity ◽  
The Mathematical Model ◽  
Flat Heat Pipe

We report on the results of optimizing a single flat heat pipe into an arrangement of heat pipes. A comparison is drawn at the same temperatures and occupied volumes and for a specific maximum temperature of radio-electronic devices. The end result of our studies is that the limiting heat transfer capacity has been found for a single heat pipe and two- and three-level heat pipe assemblies with various heat transfer media. Versatility of the mathematical model enhanced by the optimization method has been proved

Theoretical Investigation of Heat Pipes Operating at Low Vapor Pressures

1968 ◽  
Vol 90 (4) ◽  
pp. 547-552 ◽  
Author(s):  
E. K. Levy
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Dimensional Analysis ◽  
Theoretical Investigation ◽  
Heat Pipes ◽  
Vapor Pressures ◽  
One Dimensional ◽  
Evaporator Section ◽  
Heat Transfer Capacity ◽  
Theoretical Results

A one-dimensional analysis of a compressible vapor flowing within the evaporator section of a heat pipe is presented. Comparisons between the theoretical results and existing heat pipe data show that the presence of gasdynamic choking can limit the heat transfer capacity of a heat pipe operating at sufficiently low vapor pressures.

Heat transfer capacity of channel heat pipes with triangular capillary structure

1985 ◽  
Vol 49 (4) ◽  
pp. 1181-1185 ◽  
Author(s):  
V. D. Portnov ◽  
T. M. Grigor'eva
Keyword(s):  
Heat Transfer ◽  
Heat Pipes ◽  
Capillary Structure ◽  
Heat Transfer Capacity

scholarly journals Critical Review on Nanofluids: Preparation, Characterization, and Applications

2016 ◽  
Vol 2016 ◽  
pp. 1-22 ◽  
Author(s):  
Mohamoud Jama ◽  
Tejvir Singh ◽  
Seifelislam Mahmoud Gamaleldin ◽  
Muammer Koc ◽  
Ayman Samara ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Properties ◽  
High Performance ◽  
Two Phase ◽  
Heat Transfer Fluids ◽  
Thermal And Electrical Properties ◽  
Improve Heat Transfer ◽  
The Stability ◽  
New Generation

Heat transfer fluids are a crucial parameter that affects the size and costs of heat exchangers. However, the available coolants like water and oils have low thermal conductivities, which put many limitations to the development of heat transfer to achieve high performance cooling. The need for development of new classes of fluids which enhance the heat transfer capabilities attracted the attention of many researchers. In the last few decades, modern nanotechnology developed nanoparticles, which have unique thermal and electrical properties that could help improve heat transfer using nanofluids. A “nanofluid” is a fluid with suspended fine nanoparticles which increases the heat transfer properties compared with the original fluid. Nanofluids are considered a new generation of heat transfer fluids and are considered two-phase fluids of liquid solid mixtures. The efficiency of the fluid could be improved by enhancing its thermal properties, especially the thermal conductivity, and it is expected that the nanofluids will have a greater thermal conductivity than the base fluids. This paper reviews the preparation of metallic and nonmetallic nanofluids along with the stability of the produced nanofluids. Physical and thermal properties as well as a range of applications are also discussed in detail.

Heat transfer capacity of heat pipes: An application in coalfield wildfire in China

2018 ◽  
Vol 54 (6) ◽  
pp. 1755-1766 ◽  
Author(s):  
Bei Li ◽  
Jun Deng ◽  
Yang Xiao ◽  
Xiaowei Zhai ◽  
Chi-Min Shu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Pipes ◽  
Heat Transfer Capacity

scholarly journals Numerical Simulation of Heat Transfer Tube Characteristics of Refrigeration and Air Conditioning Based on Mixed Fractional Model

2021 ◽  
Vol 2074 (1) ◽  
pp. 012069
Author(s):  
Weihua Ding ◽  
Wei Chen
Keyword(s):  
Heat Transfer ◽  
Air Conditioning ◽  
Heat Transfer Performance ◽  
Enhancement Effect ◽  
Transfer Performance ◽  
Water Flow Velocity ◽  
Heat Transfer Tube ◽  
Transfer Tube ◽  
Heat Transfer Capacity ◽  
Performance Of Heat Transfer

Abstract The main parameters affecting the heat transfer performance of heat transfer tube heat exchanges include fin shape, fin spacing, fin thickness, tube row arrangement, tube diameter, dry and wet bulb temperature and flow rate. The air side heat transfer performance of heat transfer tube heat exchange and the influence of velocity field and temperature field distribution on heat transfer effect have been the focus of domestic and foreign scholars. In this paper, based on the mixed fraction model, CFD software is used to simulate the absorption process of gravity falling film outside the heat transfer tubes of refrigeration and air conditioning, and to study the flow and heat transfer characteristics of the process. The results show that, for the heat transfer tubes with the selected structure, the heat transfer capacity increases with the increase of water flow velocity, and the heat transfer enhancement effect of turbulence is enhanced. The heat transfer tubes have better comprehensive heat transfer performance than smooth tubes with the same diameter.

Effect of Increasing Wick Evaporation Area on Heat Transfer Performance for Loop Heat Pipes

2013 ◽  
Vol 711 ◽  
pp. 223-228 ◽  
Author(s):  
Shen Chun Wu ◽  
Jhih Huang Gao ◽  
Zih Yan Huang ◽  
Dawn Wang ◽  
Cho Jeng Huang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Surface Area ◽  
Heat Transfer Performance ◽  
Heat Pipes ◽  
Loop Heat Pipe ◽  
Transfer Performance ◽  
Loop Heat Pipes ◽  
Heat Transfer Capacity

This study investigates the effects of increasing the evaporating area of wick in a loop heat pipe (LHP). This work attempts to improve the performance of the loop heat pipe by increasing the number of grooves and thereby the surface area of the wick. The number of grooves is increased from eight to twelve. Experimental results show that increasing the number of grooves not only increases the surface area of the wick but also enhances LHP performance. When the evaporating surface area increases by 50%, which corresponds to increasing the number of grooves from eight to twelve, the heat transfer capacity increases from 310W to 470W and the thermal resistance is reduced from 0.21°C/W to 0.17°C/W. According to preliminary measurements, increasing the number of grooves in the loop heat pipe is highly promising for improving the heat transfer performance.

Hot Spot Elimination by Thin and Smart Heat Spreader

2015 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Masataka Mochizuki ◽  
Koichi Mashiko
Keyword(s):  
Heat Pipe ◽  
Hot Spot ◽  
Electronic Devices ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Metal Plate ◽  
Confined Space ◽  
Heat Spreader ◽  
Clock Speed ◽  
Wick Structure

Heat pipes are recognized as an excellent heat transport devices and extensively investigated for applications in electronic cooling. Different types of heat pipes have been developed such as micro/miniature heat pipes, loop heat pipes and so on, and these heat pipes have been widely applied in the field of electronics cooling such as notebook, desktop, data center; as well as aerospace, industrial cooling field. However, in recent years the application of heat pipe is widening to the filed of hand held mobile electronic devices such as smart phone, tablet pc, digital camera etc. With the development in technology these devices have different user friendly functions and capabilities, which requires the highest processor clock speed. In general, high clock speed of processor generates lot of heat which need to be spread or removed to eliminate the hot spot. It becomes a challenging task to cool such electronic devices as mentioned above with a very confined space and concentrated heat sources. Regarding to this challenge, ultra thin flat heat pipe is developed; this newly developed heat pipe consists of a special fiber wick structure which can ensure vapor spaces on the two sides of the wick structure. In this paper a novel thin spreader is proposed to eliminate the hot spot; generally the proposed heat spreader consists of 0.20mm thick metal plate and ultra thin heat pipe of 0.40mm thickness soldered in its body. Maximum thickness of this spreader is 0.63mm. Metal plate is 60mm × 110mm in size; and the ultra thin heat pipe can be fabricated from different original diameter ranges from 2.0mm to 3.0mm Cu tube. Theoretical and experimental analysis have been done to evaluate this thin spreader. In addition, some real application of this spreader will be introduced in this paper.

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