scholarly journals Development of Fabrication Process for Large-Displacement Polymer MEMS with Stacked Movable Structures Based on Hot Embossing and Polishing

2011 ◽  
Vol 14 (6) ◽  
pp. 507-512
Author(s):  
Satoshi Amaya ◽  
Viet Dzung Dao ◽  
Susumu Sugiyama
Keyword(s):  
Hot Embossing ◽  
Fabrication Process ◽  
Large Displacement ◽  
Polymer Mems

Sub-100nm Hybrid Stamp Fabrication by Hot Embossing

2006 ◽  
Vol 510-511 ◽  
pp. 462-465 ◽  
Author(s):  
Sung Hoon Hong ◽  
Ki Yeon Yang ◽  
Heon Lee
Keyword(s):  
Cost Effectiveness ◽  
Surface Energy ◽  
Nanoimprint Lithography ◽  
Low Cost ◽  
Hot Embossing ◽  
Fabrication Process ◽  
Structured Materials ◽  
Mechanical Hardness ◽  
Low Surface Energy ◽  
Uv Transmittance

The fabrication of nano-structured materials using nanoimprint lithography has become more prevalent in recent years, due to its cost effectiveness and readiness. However, One of the biggest drawback of this technique is the fabrication of the imprinting stamp, which is expensive and difficult to fabricate. This paper describes a method of replication original Si or quartz made imprinting template into a polymer stamp which has many advantages, such as the simplicity and low cost of the fabrication process and the flexibility of the resulting stamp. Using the hot embossing method, PVC based imprint stamp with sub 100nm patterns can be fabricated. Due to its high UV transmittance, reasonable mechanical hardness and low surface energy, PVC based nanosized template can be used as a stamp for UV-NIL and sub 100nm patterns were successfully transferred by the UV-NIL process with PVC based imprint stamp.

scholarly journals High Throughput Fabrication Process for Polymer MEMS using Molding and Printed Pattern Transfer

2011 ◽  
Vol 25 ◽  
pp. 876-879 ◽  
Author(s):  
K. Kurihara ◽  
S. Takamatsua ◽  
T. Kobayashi ◽  
H. Takagi ◽  
R. Maeda
Keyword(s):  
High Throughput ◽  
Fabrication Process ◽  
Pattern Transfer ◽  
Polymer Mems

Experimental Study on Hot Embossing of Micro/Nano Grating

2009 ◽  
Vol 60-61 ◽  
pp. 450-455 ◽  
Author(s):  
Yong Liang ◽  
Chong Liu ◽  
Huan Li Sun ◽  
Jing Min Li ◽  
Jun Shan Liu ◽  
...  
Keyword(s):  
Experimental Study ◽  
Methyl Methacrylate ◽  
Silicon Substrate ◽  
Hot Embossing ◽  
Mems Devices ◽  
High Quality ◽  
Novel Method ◽  
Temperature And Pressure ◽  
Polymer Mems ◽  
Pmma Polymer

During hot embossing process of polymer MEMS devices, the parameters such as temperature, pressure and time are important for the duplication precision of patterns. In this work, a novel method of hot embossing lithography for replication of multiple nano bar structure mould was conducted. The effects of hot embossing temperature and pressure on fabrication precision were studied. Linewidth of the pattern on the mould is from 71nm to 980nm. The replicas of nano bar structure were fabricated on the PMMA (polymer methyl methacrylate) layer with silicon substrate. The effects of hot embossing and demoulding temperature on replicating quality were also discussed. Experimental results indicate that higher demoulding temperature help to lessen PMMA leftover and improve the duplication quality. The hot embossing and dmoulding temperature of 110°C～120°C and 60°C～70°C were obtained to produce high quality duplication of multiple nano bar structures. Micro-grating replicas were also fabricated and demonstrated in this paper.

Discrete Microparts Production Using Through-Thickness Hot Embossing and Rubber-Assisted Ejection

2008 ◽  
Author(s):  
Ramasubramani Kuduva-Raman-Thanumoorthy ◽  
Donggang Yao
Keyword(s):  
Injection Molding ◽  
Hot Embossing ◽  
Fabrication Process ◽  
Surface Structures ◽  
Micro Injection Molding ◽  
Ejection Mechanism ◽  
Intermittently Connected

The hot embossing process has so far been mainly developed for replication of surface structures on thermoplastic substrates. Because of the lack of a through-thickness action, fabrication of discrete microparts such as microgears is considered difficult. In this study, an embossing mold having 13 microcavities was used in a through-thickness embossing process with a rubber-assisted ejection mechanism. Microparts made of HDPE and ABS with each part weighing approximately 0.9 and 1.4 mg, respectively, were produced. When in the mold, embossed microparts were intermittently connected to each other through thin residual films of a thickness approximately 20–30 μm on one surface. The residual films were detached from the microparts during ejection. Because no resin delivery path, e.g., runner and gate, is needed for microcavities on the mold, this micropart fabrication process could replace micro injection molding in numerous applications.

scholarly journals Influence of Distribution Size of Micro Energy Director Array on Ultrasonic Precise Sealing of Polymer MEMS Device

CONVERTER ◽  
2021 ◽  
pp. 50-58
Author(s):  
Miaomiao Zhang
Keyword(s):  
Hot Embossing ◽  
Wetting Behavior ◽  
Mems Device ◽  
Energy Director ◽  
Polymer Mems

In order to improve the quality and precision of ultrasonic precision sealing of polymer MEMS device, micro energy director array was proposed on the sealing surface of polymer MEMS device, the influence of the distribution size of micro energy director array to ultrasonic precise sealing was studied. Based on the experiment of PMMA micro-pipe sealing, five kinds of micro energy directors with different distribution sizes were made on the sealing surface by hot embossing technique. The method of ultrasonic precise sealing based on efficiency’s feedback was used and the influence of micro energy director array’s distribution size on the quality of ultrasonic sealing was summarized through the observation on the rule of wetting behavior of micro energy director array.

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