Fabrication of Large Area, Ordered Nanoporous Structures on Various Substrates for Potential Electro-Optic Applications

Nanoporous structures have attracted great attention in electronics, sensor and storage devices, and photonics because of their large surface area, large volume to surface ratio, and potential for high-sensitivity sensor applications. Normally, electron or ion beam patterning can be used for nanopores fabrication by direct writing. However, direct writing is a rather expensive and time-consuming method due to its serial nature. Therefore, it may not translate to a preferred manufacturing process. In this research, a perfectly ordered large-area periodic pattern in an area of approximately 1 cm2 has been successfully fabricated on various substrates including glass, silicon, and polydimethylsiloxane, using a two-step process comprising visible light-based multibeam interference lithography and subsequent pattern transfer processes of reactive ion etching and nanomolding. Additionally, the multibeam interference lithography templated anodized aluminum oxide process has been described. Since the fabrication area in multibeam interference lithography can be extended by using a larger beam size, it is highly cost effective and manufacturable. Furthermore, although not described here, an electrodeposition process can be utilized as a pattern transfer process. This large-area perfectly ordered nanopore array will be very useful for high-density electronic memory and photonic bandgap and metamaterial applications.

Pattern transfer of large-scale thin membranes with controllable self-delamination interface for integrated functional systems

Direct transfer of pre-patterned device-grade nano-to-microscale materials highly benefits many existing and potential, high performance, heterogeneously integrated functional systems over conventional lithography-based microfabrication. We present, in combined theory and experiment, a self-delamination-driven pattern transfer of a single crystalline silicon thin membrane via well-controlled interfacial design in liquid media. This pattern transfer allows the usage of an intermediate or mediator substrate where both front and back sides of a thin membrane are capable of being integrated with standard lithographical processing, thereby achieving deterministic assembly of the thin membrane into a multi-functional system. Implementations of these capabilities are demonstrated in broad variety of applications ranging from electronics to microelectromechanical systems, wetting and filtration, and metamaterials.

A Channel Self-Alignment process for High-Voltage VDMOSFETs in 4H-SiC

In this paper, we describe a channel self-alignment process to produce High-Voltage VDMOSFETs in 4H-SiC. We use polysilicon as a mask for two injection methods, Because the oxidation rate of polysilicon is different from that of silicon carbide, we can generate a certain thickness of silicon oxide flank wall by controlling the oxidation rate and time. Therefore, there will be a certain distance between the N+ source region and the Pbase region, and this distance is the length of the channel. Obviously, no pattern transfer occurs between the two ion implantation processes, so the channel is self-aligned. As long as the thickness of the side wall is controlled accurately, the channel length of sub-micron can be obtained.

Silicon Metalens Fabrication from Electron Beam to UV-Nanoimprint Lithography

This study presents the design and manufacture of metasurface lenses optimized for focusing light with 1.55 µm wavelength. The lenses are fabricated on silicon substrates using electron beam lithography, ultraviolet-nanoimprint lithography and cryogenic deep reactive-ion etching techniques. The designed metasurface makes use of the geometrical phase principle and consists of rectangular pillars with target dimensions of height h = 1200 nm, width w = 230 nm, length l = 354 nm and periodicity p = 835 nm. The simulated efficiency of the lens is 60%, while the master lenses obtained by using electron beam lithography are found to have an efficiency of 45%. The lenses subsequently fabricated via nanoimprint are characterized by an efficiency of 6%; the low efficiency is mainly attributed to the rounding of the rectangular nanostructures during the pattern transfer processes from the resist to silicon due to the presence of a thicker residual layer.

Tunable Wettability Pattern Transfer Photothermally Achieved on Zinc with Microholes Fabricated by Femtosecond Laser

A quickly tunable wettability pattern plays an important role in regulating the surface behavior of liquids. Light irradiation can effectively control the pattern to achieve a specific wettability pattern on the photoresponsive material. However, metal oxide materials based on light adjustable wettability have a low regulation efficiency. In this paper, zinc (Zn) superhydrophobic surfaces can be obtained by femtosecond-laser-ablated microholes. Owing to ultraviolet (UV) irradiation increasing the surface energy of Zn and heating water temperature decreasing the surface energy of water, the wettability of Zn can be quickly tuned photothermally. Then, the Zn superhydrophobic surfaces can be restored by heating in the dark. Moreover, by tuning the pattern of UV irradiation, a specific wettability pattern can be transferred by the Zn microholes, which has a potential application value in the field of new location-controlled micro-/nanofluidic devices, such as microreactors and lab-on-chip devices.