Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties.

The development of three-dimensional printed circuit boards requires research on new materials which can easily be deformed. Conducting pastes are well suited for deformation even after they are applied to the dielectric carrier. This paper deals with measurements of the electrical conductivity of these conducting pastes. Two different conductivity measurement techniques are explained and carried out. The resulting measurements give an overview of the conductivity of several measured samples.

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Effects of Lignin Derivatives on Cross-Link Density and Dielectric Properties in the Epoxy-Based Insulating Materials for Printed Circuit Boards

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2013.2253836 ◽

2013 ◽

Vol 3 (6) ◽

pp. 1057-1062 ◽

Cited By ~ 4

Author(s):

Gen Komiya ◽

Takahiro Imai ◽

Akihiko Happoya ◽

Tsuyoshi Fukumoto ◽

Hirohisa Sagae ◽

...

Keyword(s):

Dielectric Properties ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Cross Link ◽

Insulating Materials ◽

Printed Circuit ◽

Link Density ◽

Cross Link Density

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Two-Dimensional Modeling of Multilayer Multimaterial Circuit Boards by Using an EQLAM Multilayer Model

Volume 1: 20th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C ◽

10.1115/detc2005-84620 ◽

2005 ◽

Author(s):

Yuqi Wang ◽

K. H. Low ◽

K. H. Hoon

Keyword(s):

Printed Circuit Boards ◽

Resin Composite ◽

Circuit Boards ◽

Electronic Density ◽

Static Tests ◽

Printed Circuit ◽

Epoxy Resin Composite ◽

Materials Used ◽

Woven Glass Fiber ◽

Multilayer Circuit Boards

The materials used in the field of printed circuit boards are becoming increasingly complex as they are common to make use of numerous combination of metallic and composite plies. The potential for utilization of circuit boards is generally verified through the numerical simulation, especially for the multilayer printed circuit boards with high electronic density. This paper provides a numerical model intended to describe numerically the behavior of multilayer multimaterial circuit boards. Two parts are considered in the developed model: one is elastic-plastic damaging model that is presented to describe the metallic ply in the multilayer circuit boards; another is degenerated bi-phase model that is presented to describe composite ply. With the combination of equivalent laminate (EQLAM) method, the degenerated bi-phase successfully models the woven glass-fiber/epoxy-resin composite ply. These two plies are the basic components of multilayer circuit boards. Meanwhile, with the verification of static tests and dynamic tests, the reliability of presented model is confirmed.

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