scholarly journals Complex Effects of Additives of Cl- and Glue on Surface Morphology of Copper Foil for Printed Wiring Boards Electrodeposited at High Speed.

1996 ◽  
Vol 11 (7) ◽  
pp. 494-499 ◽  
Author(s):  
Tetsuya OSAKA ◽  
Akira SAKAKIBARA ◽  
Keiu TAMURA ◽  
Takayuki HOMMA ◽  
Yutaka OKINAKA
Keyword(s):  
Surface Morphology ◽  
High Speed ◽  
Copper Foil ◽  
Printed Wiring Boards

Process Design and Control Method of Laser Via Hole Drilling of Printed Wiring Boards Based on High Speed Camera Monitor

2017 ◽  
Author(s):  
Koji Kanki ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa
Keyword(s):  
High Speed ◽  
Copper Foil ◽  
Control Method ◽  
Irradiation Time ◽  
Hole Drilling ◽  
Drilling Process ◽  
High Speed Camera ◽  
Printed Wiring Boards ◽  
Laser Method ◽  
Direct Laser

In recent years, the performance and miniaturization of portable information devices have rapidly advanced. The build-up process is often used in the manufacturing of printed wiring boards (PWBs) for high-density circuits. At present, CO2 laser beams are generally used in the build-up process to drill blind via holes (BVHs) that connect copper foils. The Cu direct-laser method is often used in this process, which irradiates laser to drill the copper foil and insulation layer simultaneously. Cu direct-laser involves a complex phenomenon because it drills copper and resin, with different decomposition points, at the same time. However, only few studies have been made in this field. This report focuses on monitoring Cu direct-laser drilling with a high-speed camera. We drilled holes with four different laser power outputs, 25 W, 50 W, 75 W, and 95 W and measured the size of the drilled holes. During the drilling process, the camera captured the emission of scattering materials in the PWBs. We have processed the images obtained from the camera to observe the scattering material. As a result, we found out that changes in the amount of scattering occur on four occasions: when the outer copper foil is drilled through, when the drilled depth reaches the inner copper foil, when the increase rate of the hole diameter is reduced, and when the inner copper foil is drilled through. Based on these results, the suitable laser irradiation time can be determined for different drilling conditions.

Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil

2010 ◽  
Vol 48 (10) ◽  
pp. 951-956 ◽  
Author(s):  
Tae-Gyu Woo ◽  
Il-Song Park ◽  
Woo-Yong Jeon ◽  
Eun-Kwang Park ◽  
Kwang-Hee Jung ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Copper Foil ◽  
Physical Property

scholarly journals Surface Forming Criteria of Ti-6AL-4V Titanium Alloy under Laser Loading

2021 ◽  
Vol 11 (12) ◽  
pp. 5406
Author(s):  
Fei Yin ◽  
Xia Ye ◽  
Hongbing Yao ◽  
Pengyu Wei ◽  
Xumei Wang ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Surface Morphology ◽  
High Speed ◽  
Yttrium Aluminum Garnet ◽  
Laser Energy ◽  
Target Material ◽  
Nanosecond Laser ◽  
Laser Shock ◽  
Shock Condition ◽  
Key Factor

In order to study the spallation phenomenon of titanium alloy under the shock of nanosecond laser, the Neodymium-Yttrium-Aluminum Garnet laser was used to carry out laser shock experiments on the surface of titanium alloy. By observing and measuring the surface morphology of the target material, the forming factors and the changes of the surface morphology under different parameter settings, the forming criteria of the titanium alloy were obtained. The results show that under the single variable method, the change of laser energy can affect the target shape variable, and there is a positive correlation between them. When the thickness was greater than or equal to 0.08 mm, no obvious cracks were found in the targets. Moreover, the number of impact times was the key factor for the target deformation; with the growth of impact times, the target deformation gradually became larger until the crack appeared. The larger the diameter of the spot, the more likely the target was to undergo plastic deformation. The surface of titanium alloy with a thickness of 0.08 mm appeared to rebound under specific laser shock condition. The changes in the back of the target material were observed in real time through a high-speed camera, and the plasma induced by the laser was observed in the process. This study is based on the results of previous studies to obtain the titanium alloy forming criteria, which provides a basis for the setting of laser parameters and the thickness of the target when the nanosecond laser impacts the Ti-6AL-4V target.

Nucleation and Heterointerface Structure of InAs Epilayers Grown on InP Substrates

1992 ◽  
Vol 280 ◽  
Author(s):  
K. S. Chandra Sekhar ◽  
A. K. Ballal ◽  
L. Salamanca-Riba ◽  
D. L. Partin
Keyword(s):  
Surface Morphology ◽  
Electronic Properties ◽  
Growth Temperature ◽  
High Speed ◽  
Interface Roughness ◽  
Structural Defects ◽  
Lower Growth ◽  
Substrate Interface ◽  
Film Substrate ◽  
Inp Substrates

ABSTRACTHeteroepitaxial growth of indium arsenide films on indium phosphide substrates is being actively pursued since the electronic properties of these films make them promising materials for optoelectronic and other high speed devices. The various structural aspects of the film that affect their electronic properties are structural defects like dislocations, film-substrate interface roughness and chemical inhomogeneities. In InAs films, electrons accumulate at the film-air interface, making surface morphology an important factor that decides the electronic properties. The InAs films used in this study were grown on InP substrates by metal organic vapor deposition, at different temperatures. A higher growth temperature not only resulted in poor surface morphology of the film, but also created a rough film-substrate interface. However, at all deposition temperatures, the film-substrate interfaces are sharp. At lower growth temperature, the interfaces were flat. Films grown at lower temperatures had good surface morphology and a flat and shaip heterointerface.

Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Hole Quality by Silica Fillers in Build-Up Layer

2011 ◽  
Author(s):  
Keiji Ogawa ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Kuniyoshi Obata ◽  
Tsukasa Ayuzawa
Keyword(s):  
Copper Foil ◽  
Fem Analysis ◽  
Printed Wiring Boards ◽  
The Finite Element Method ◽  
Silica Filler ◽  
Silica Fillers ◽  
Via Holes ◽  
Overhang Length ◽  
Novel Method ◽  
Direct Drilling

Microvia formation technology using lasers has become the dominant method for drilling microvia called blind via-holes (BVHs) in printed wiring boards (PWBs). Laser direct drilling (LDD), drilling directly outer copper foil by laser, has attracted attention as a novel method. In particular, when copper and resin with different processing thresholds are drilled at the same time, an overhang defect occurs on the drilled hole. However, the overhang generation mechanism has not been clarified. Therefore, we investigated it by detailed observation of the drilled-hole section. Moreover, the overhang length was estimated using the finite element method (FEM). Influences of surface treatment of outer copper foil and thermal properties of the build-up layer were evaluated experimentally and analytically. Consequently, an experiment with a prototype PWB with silica filler added in the build-up layer was carried out. Using the prototype PWBs, the overhang was reduced as shown in FEM analysis results.

Optimization of Feed Speed and Stroke for Step Micro Hole Drilling of Printed Wiring Boards by Response Surface Method

2012 ◽  
Vol 523-524 ◽  
pp. 509-514 ◽  
Author(s):  
Naoya Noguchi ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Yutaka Takeda
Keyword(s):  
Response Surface ◽  
Response Surface Method ◽  
High Speed ◽  
Hole Drilling ◽  
Feed Speed ◽  
Printed Wiring Boards ◽  
Step Cycle ◽  
Stroke Length ◽  
Surface Method ◽  
Micro Drilling

There have been few reports dealing with the drilling of printed wiring boards (PWBs) with micro-drills that are smaller than 0.2 mm in diameter, and super-high-speed spindles that are higher than 160,000 rpm. In these cases, preventing the micro-drill from breaking and keeping the position accuracy of the drilled hole has been difficult. We therefore focus on the high-speed step-drilling method and short stroke as a novel way of resolving these problems. On the other hand, determining the complicated combination of feed speed, rapid feed speed, and stroke length is difficult. Under these backgrounds, in this report we propose a fast-feed step cycle that use fast-feed command without the processing feed. Thus, we attempted to apply the response surface method to optimize these parameters. As a result, a proposed method was found to be effective to improve the drilled hole quality and drilling efficiency in such kinds of micro-drilling of the PWBs.

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