scholarly journals Interfacial Characteristics of Copper/Diffusion Barrier/Low Dielectric Constant Material Systems at Elevated Temperatures

2002 ◽  
Vol 10 (2) ◽  
pp. 138-141
Author(s):  
J. S. CHEN ◽  
J. S. JENG ◽  
C. C. CHANG
Keyword(s):  
Dielectric Constant ◽  
Diffusion Barrier ◽  
Elevated Temperatures ◽  
Low Dielectric Constant ◽  
Copper Diffusion ◽  
Low Dielectric ◽  
Material Systems ◽  
Interfacial Characteristics

Low Dielectric Constant 3MS α-SiC:H as Cu Diffusion Barrier Layer in Cu Dual Damascene Process

2001 ◽  
Vol 40 (Part 1, No. 4B) ◽  
pp. 2663-2668 ◽  
Author(s):  
Soo Geun Lee ◽  
Yun Jun Kim ◽  
Seung Pae Lee ◽  
Hyeok-Sang Oh ◽  
Seung Jae Lee ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Low Dielectric Constant ◽  
Dual Damascene ◽  
Low Dielectric ◽  
Damascene Process ◽  
Diffusion Barrier Layer ◽  
Cu Diffusion Barrier

Characteristics of Copper Diffusion into Low Dielectric Constant Plasma Polymerized Cyclohexane Thin Films

2000 ◽  
Vol 39 (Part 2, No. 12B) ◽  
pp. L1327-L1329 ◽  
Author(s):  
Cheonman Shim ◽  
Jayoung Choi ◽  
Donggeun Jung ◽  
Nae-Eung Lee ◽  
Cheol-Woong Yang
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Copper Diffusion ◽  
Low Dielectric
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