A Appropriate Flux Generating Conditions for Semiconductor Etching Simulation

Author(s):  
Seunghan Jeong ◽  
Oubong Gwun ◽  
Seongsik Shin
SIAM Review ◽  
2002 ◽  
Vol 44 (4) ◽  
pp. 678-695
Author(s):  
A. Madhukar ◽  
T. Parent ◽  
I. G. Rosen ◽  
C. Wang

2012 ◽  
Vol 1 (9) ◽  
pp. e30-e30 ◽  
Author(s):  
Chris Edwards ◽  
Amir Arbabi ◽  
Gabriel Popescu ◽  
Lynford L Goddard

1990 ◽  
Vol 204 ◽  
Author(s):  
F. A. Houle

ABSTRACTDoping effects on semiconductor etching rates have been proposed to be associated with field effects in the near-surface region. Detailed investigations of the chemistry of nand p-type Si and GaAs indicate that the majority carrier can also play an important role in determining the reactivity of surface intermediates, providing an independent mechanism for influencing the etch rate. A microscopic picture of central driving forces in semiconductor etching deduced from the doping cffects is proposed.


Talanta ◽  
2017 ◽  
Vol 171 ◽  
pp. 39-44 ◽  
Author(s):  
Roumen Zlatev ◽  
Margarita Stoytcheva ◽  
Benjamin Valdez ◽  
Rojelio Ramos

2003 ◽  
Vol 13 (1) ◽  
pp. 217-224 ◽  
Author(s):  
Jens Christian Claussen ◽  
Jürgen Carstensen ◽  
Marc Christophersen ◽  
Sergiu Langa ◽  
Helmut Föll

1996 ◽  
Vol 421 ◽  
Author(s):  
C. Constantine ◽  
D. Johnson ◽  
C. Barratt ◽  
R. J. Shul ◽  
G. B. Mcclellan ◽  
...  

AbstractInductively Coupled Plasma (ICP) sources are extremely promising for large-area, highion density etching or deposition processes. In this review we compare results for GaAs and GaN etching with both ICP and Electron Cyclotron Resonance (ECR) sources on the same singlewafer platform. The ICP is shown to be capable of very high rates with excellent anisotropy for fabrication of GaAs vias or deep mesas in GaAs or GaN waveguide structures.


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