Ultrascaled InAlN/GaN High Electron Mobility Transistors with Cutoff Frequency of 400 GHz

2013 ◽  
Vol 52 (8S) ◽  
pp. 08JN14 ◽  
Author(s):  
Yuanzheng Yue ◽  
Zongyang Hu ◽  
Jia Guo ◽  
Berardi Sensale-Rodriguez ◽  
Guowang Li ◽  
...  
1999 ◽  
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pp. L154-L156 ◽  
Author(s):  
Tetsuya Suemitsu ◽  
Tetsuyoshi Ishii ◽  
Haruki Yokoyama ◽  
Takatomo Enoki ◽  
Yasunobu Ishii ◽  
...  

2002 ◽  
Vol 41 (Part 2, No. 4B) ◽  
pp. L437-L439 ◽  
Author(s):  
Keisuke Shinohara ◽  
Yoshimi Yamashita ◽  
Akira Endoh ◽  
Kohki Hikosaka ◽  
Toshiaki Matsui ◽  
...  

2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  

Author(s):  
Yu-Chen Lai ◽  
Yi-Nan Zhong ◽  
Ming-Yan Tsai ◽  
Yue-Ming Hsin

AbstractThis study investigated the gate capacitance and off-state characteristics of 650-V enhancement-mode p-GaN gate AlGaN/GaN high-electron-mobility transistors after various degrees of gate stress bias. A significant change was observed in the on-state capacitance when the gate stress bias was greater than 6 V. The corresponding threshold voltage exhibited a positive shift at low gate stress and a negative shift when the gate stress was greater than 6 V, which agreed with the shift observation from the I–V measurement. Moreover, the off-state leakage current increased significantly after the gate stress exceeded 6 V during the off-state characterization although the devices could be biased up to 1000 V without breakdown. The increase in the off-state leakage current would lead to higher power loss.


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