Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization

2013 ◽  
Vol 52 (10S) ◽  
pp. 10MC07 ◽  
Author(s):  
Yeong-Hyeon Hwang ◽  
Won-Ju Cho ◽  
Yongtae Kim
Author(s):  
Marylyn Bennett-Lilley ◽  
Thomas T.H. Fu ◽  
David D. Yin ◽  
R. Allen Bowling

Chemical Vapor Deposition (CVD) tungsten metallization is used to increase VLSI device performance due to its low resistivity, and improved reliability over other metallization schemes. Because of its conformal nature as a blanket film, CVD-W has been adapted to multiple levels of metal which increases circuit density. It has been used to fabricate 16 MBIT DRAM technology in a manufacturing environment, and is the metallization for 64 MBIT DRAM technology currently under development. In this work, we investigate some sources of contamination. One possible source of contamination is impurities in the feed tungsten hexafluoride (WF6) gas. Another is particle generation from the various reactor components. Another generation source is homogeneous particle generation of particles from the WF6 gas itself. The purpose of this work is to investigate and analyze CVD-W process-generated particles, and establish a particle characterization methodology.


1999 ◽  
Vol 50 (1) ◽  
pp. 29-37 ◽  
Author(s):  
Masatoshi Nagai ◽  
Toshiji Suda ◽  
Katsuhiko Oshikawa ◽  
Naoya Hirano ◽  
Shinzo Omi

1993 ◽  
Vol 227 (2) ◽  
pp. 167-176 ◽  
Author(s):  
J.C. Dupuy ◽  
A. Essaadani ◽  
A. Sibai ◽  
C. Dubois ◽  
F.C. Dassapa ◽  
...  

2018 ◽  
Vol 61 (12) ◽  
pp. 1567-1574 ◽  
Author(s):  
Jie Zhang ◽  
Jinwei Chen ◽  
Yan Luo ◽  
Yihan Chen ◽  
Maryam Kiani ◽  
...  

2018 ◽  
Vol 30 (51) ◽  
pp. 1805655 ◽  
Author(s):  
Huimin Yu ◽  
Xin Yang ◽  
Xu Xiao ◽  
Ming Chen ◽  
Qinghua Zhang ◽  
...  

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