Study of Off-State Breakdown and Hot-Carrier improvement by Suppression of Kirk Effect in LDMOS with Gradual Junction Structure

2012 ◽  
Author(s):  
C. R. Yan ◽  
J. F. Chen ◽  
C. Y. Lin ◽  
H. T. Hsiu ◽  
Y. C. Liao ◽  
...  
2000 ◽  
Vol 10 (01) ◽  
pp. 119-128
Author(s):  
ENRICO ZANONI ◽  
GAUDENZIO MENEGHESSO ◽  
ALDO DI CARLO ◽  
PAOLO LUGLI ◽  
LORENZO ROSSI

The operating voltage of advanced microwave devices is currently limited by impact-ionization and breakdown effects. An extended study of the effects of hot carriers on the breakdown behavior and reliability of GaAs-based and InP-based HEMTs (high electron mobility transistors) has been carried out by means of pulsed measurements, electroluminescence spectroscopy and microscopy and Monte Carlo simulations. We show that the parasitic bipolar effect, which explains kink effects in HEMTs, can also induce regenerative phenomena eventually leading to on-state breakdown. Results concerning the effects of hot carrier aging on GaAs-based and InP-based HEMTs are summarized.


2018 ◽  
Vol 201 ◽  
pp. 05001
Author(s):  
Shao-Ming Yang ◽  
Gene Sheu ◽  
Chiu-Chung Lai ◽  
Ravi Deivasigamani

In VDMOS device the anti-JFET concentration has important role for determining the breakdown voltage and on-resistance of the device. Because higher N-drift doping concentration can provide the very best on-resistance of the device but also decrease breakdown voltage. It also has a proportional relationship with threshold voltage degradation. In this paper, we report the anti-JFET implantation energy influence effect electric potential distribution, the highest impact ionization shifted from the silicon surface to deeper. It will have less hot carrier impact, and we have found higher breakdown voltage. The anti-JEFT implantation is critical for on-resistance off-state breakdown voltage optimization, However the high field and high impact ionization near the gate region will cause severe hot carrier Injection problem. The general expectation of high voltage VDMOS transistor is to have higher breakdown voltage, less degradation due to hot carrier injection and better on-resistance.


2001 ◽  
Vol 120 (5) ◽  
pp. A110-A110
Author(s):  
A HOPKINS ◽  
S WALS ◽  
P VERKADE ◽  
P BOQUET ◽  
A NUSRAT

1981 ◽  
Vol 42 (C7) ◽  
pp. C7-51-C7-56
Author(s):  
K. Aoki ◽  
T. Kobayashi ◽  
K. Yamamoto

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-779-C4-782 ◽  
Author(s):  
C. BERGONZONI ◽  
R. BENECCHI ◽  
P. CAPRARA

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-651-C4-655 ◽  
Author(s):  
R. BELLENS ◽  
P. HEREMANS ◽  
G. GROESENEKEN ◽  
H. E. MAES

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-787-C4-790
Author(s):  
P. T.J. BIERMANS ◽  
T. POORTER ◽  
H. J.H. MERKS-EPPINGBROEK

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