Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrate Circuit Hardware Assurance

The supply chain of the semiconductor industry is experiencing painful growth and advancement in chip development with the help of recently passed U.S legislation and funding to address a chip shortage. However, it is not without some drawbacks, one of which is the challenge of maintaining control over the manufacturing quality throughout the entire process. As a result of this, physical inspection for hardware security is a necessity to assure the semiconductor devices. In this paper, various physical inspection methods are reviewed and scanning acoustic microscopy (SAM) is proved to be the ideal physical inspection method to minimize the possibility of counterfeits which might be the feasible solution in detecting counterfeits on a large scale.

Applications of Artificial Intelligence to Cryptography

This paper considers some recent advances in the field of Cryptography using Artificial Intelligence (AI) It specifically considers the applications of Machine Learning (ML) and Evolutionary Computing (EC) concepts used to generate ciphers. A short overview is given on Artificial Neural Networks (ANNs) and the principles of Deep Learning (DL) using Deep ANNs. In this context, the paper considers: (i) the implementation of EC and ANNs to generate unique and unclonable ciphers; (ii) ML strategies for detecting the genuine randomness (or otherwise) of binary streams for applications in Cryptanalysis. The paper aims to provide an overview on how AI can be applied for encrypting data and undertaking cryptanalysis of such data and other encrypted data classes in order to assess the cryptographic strength of an encryption algorithm. For example, to detect patterns of intercepted data streams that are signatures of encrypted data. An application is presented which includes authentication of high-value documents such as bank notes, using smartphones. Using an antenna of a smartphone to read (in the near field) an embedded flexible integrate circuit with a non-programmable coprocessor, ultra-strong encrypted information can be used on-line for validation.

Structure and Photoelectric Properties of Cu3N Thin Films by Reactive Magnetron Sputtering

Cu3N thin films can potentially be used for development of optical storage devices and integrate circuit of semiconductor. In this study the Cu3N films were deposited on glass substrate successfully by reactive direct current magnetron sputtering at different N2/(N2+Ar) flow ratio. The results showed that the nitrogen partial pressure affected the preferring orientation of the thin films when the sputtering power and substrate temperature was fixed. With increasing N2/(N2+Ar) flow ratio from 10% to 90%, Cu3N(111) orientation with rich-copper changed to Cu3N(100) orientation with rich nitrogen, the transmittance of the thin films improved gradually, and the corresponding optical band gap (Eg) increased from 1.10 eV to 1.21eV. The resistivity of copper nitrogen films changed from 5.62Ω.cm to 3.00×103Ω.cm at the scope of 10%~90% of N2/(N2+Ar) flow ratio.

Implementation of 3D Modeling and Visualization for CAE Industry Application

For industry CAE applications, a set of software platform was developed under OpenGL environment including modeling, meshing and visualization functions. Experiments for building an integrate circuit showed that: this platform is able to building and visualization of complex 3D models, and it provides a good basis for further development of available industry CAE software.

A Novel Method for POP Stacking Warpage

With the miniaturization of portable products, integrate circuit becomes thinner, the effect of warpage on Package-on-Package (POP) stacking assemble on integrate circuit have become more distinct. It will lead to the deformation of the chip substrate and the more serious effectiveness of the solder joint. Consequently, in this paper, a novel method by adding fixed metal pillars in the middle of POP stacking substrates can well suppress warpage problems caused by the uneven heating reflow materials. Finally, this new method is feasible by analyzing the stress of warp model.

Design of the Instrument of Measuring Moisture Ratio in Textile Fibre Based on Integrate Circuit CAV424

The paper discusses a new instrument design method about quickly measuring moisture ratio in textile fibre based on the relation of moisture ratio and its relatively dielectric medium constant. Introduces the integrate circuit CAV424 used for capacitance to voltage signal convert; the test-result shows that the instrument can substitute traditional methods to improve fibre moisture testing technique in textile industries.

Quantization of Mesoscopic Quartz Piezoelectric Crystal Equivalent Circuit

By using the advanced quantum theory of mesoscopic circuits, a mesoscopic quartz piezoelectric crystal equivalent circuit is quantized. The energy spectrum and wave functions of the system are obtained with perturbative method and the current quantum fluctuation are calculated as an application. The detail characters of energy spectrum and wave functions in the system would be helpful to the design of integrate circuit.

QUANTIZATION OF MESOSCOPIC QUARTZ PIEZOELECTRIC CRYSTAL EQUIVALENT CIRCUIT

In the framework of an advanced quantum theory for mesoscopic electric circuits in accord with the discreteness of electric charges, a mesoscopic quartz piezoelectric crystal equivalent circuit is quantized. To resolve the finite difference Schrödinger equation, an improved parameter perturbative method is proposed when WKB and perturbative method are inapplicable. With this method, the energy spectrum and wavefunctions of the system are obtained and used to calculate current quantum fluctuation as an application. The new method would be helpful to the application of the mesoscopic circuits quantum theory. Besides, the detail characters of energy spectrum and wavefunctions in the system would be helpful to the design of integrate circuit.

Dynamic Analysis of Wafer Slicing by Using Multi Wire Saw

Multi wire saw is the important basis of integrate circuit, optoelectronic, photovoltaic industry, and it becomes a promising technology for semiconductor wafer production because of its advantage of slicing large ingot into thin wafers with high efficiency and good quality. In the process of moving, the inevitable wiresaw vibration is directly related to the whole process with both benefit and harm. This paper analyses the wire vibration behavior in cutting area, the dynamic model is built by modeling the interaction between the dynamics of wire and hydrodynamic characteristics of slurry flow, available modal analysis provides closed form expressions for the steady state response, obtain the vibration of wire subject to different process parameters on wire saw manufacturing process.