Photo-Excited Silicon-Based Spatial Terahertz Modulators

The increasing development of terahertz (THz) technology has led to various potential applications in THz imaging, spectroscopy and communications. These devices capable of actively manipulating the amplitude, phase and frequency of THz waves are thus gaining numerous interests. All-optical silicon-based spatial terahertz modulators (STMs), as a simple, cost-effective, and reconfigurable technique, are standing the focus of research. Beginning with a fundamental concept of THz radiation, this paper systematically summarized the modulation mechanism and theoretical model for this kind of STM, reviewed the recent advancements in THz functional devices implemented by this optical method and yet, discussed the performance-improved measures with an emphasis on the reflection reduction. Despite that, there has been considerable progress in realizing high-performance STMs, and novel design is urgent to realize higher modulation rate and more functionality.

A Dual Function Electro-Optical Silicon Field-Effect Transistor Molecular Sensor

We propose and demonstrate an approach that utilizes field-effect transistors (FETs) for real-time detection of interactions between molecules. In this approach, FET based sensors utilize two unique functions, high charge...

Comparative Study of Optical Silicon Nanomachining Experimental Results and MD Simulation Outputs

The high strength and good optical performance offered by optical grade silicon could be considered as the reason for its wide usage as optical materials in many industries including electronic, metrology, infrared (IR) optics and solar cells. Due to this, nanoscale manufacturing of these products requires superior quality and enhanced functional performance of the produced materials. Because recent studies have been focusing on correlating both surface and subsurface nature alterations with better functional performance, an MD study of the experiment was carried out in comparison with experiment to match the observed MD model features to the experimental result obtained. The MD study was observed to conform with the Ra result as obtained in the experiment.

Dicing Characterization on Optical Silicon Wafer Waveguide

Silicon wafers are a key component in integrated circuits which comprised of various electronic components that are arranged to perform a specific function. Wafer dicing is a mechanical process of removing material from a wafer by synthetic diamonds as abrasive particles. Chipping along the cut line crucial to the wafer dicing operation has been identified by semiconductor manufacturers as a relevant area for improvement. The purposed of this study is to characterize the effect of dicing operation on the optical silicon wafer coating material. The effect of the blade wear and silicon wafer kerf width will be analyzed in this work