Hybrid Failure of Cemented Paste Backfill

The hybrid failure is a coupled failure mechanism under the action of tensile and shear stresses. The failure is critical in cemented paste backfill (CPB) since there are no visible signs prior to the failure. Few studies have been conducted on the coupled stress response of CPB. This is most likely due to a lack of suitable laboratory equipment and test procedures. This paper presents a new punching shear apparatus to evaluate the hybrid failure of CPB. We harness two-dimensional finite element analysis (FEA) for supplementing experimental study in providing stress transformation, deformation, and possible failure mechanisms. Our study suggests that the coupled stress is a combination of tensile and shear strength in function of the angle of the frustum. The strengths measured by the coupled stress are comparable to those measured by direct shear and tensile strength tests, in which the strength properties of CPB are curing time and binder content dependent. The FEA results substantiate the effectiveness of proposed model for predicting the hybrid failure of CPB.

Peristaltic Flow with Heat Transfer for Nano-Coupled Stress Fluid through Non-Darcy Porous Medium in the Presence of Magnetic Field

In this paper, the peristaltic motion of nano-coupled stress fluid through non-Darcy porous medium is investigated, and the heat transfer is taken into account. The system is stressed by an external magnetic field. The Ohmic and viscous couple stress dissipations, heat generation and chemical reaction are considered. This motion is modulated mathematically by a system of non-linear partial differential equations, which describe the fluid velocity, temperature and nanoparticles’ concentration. These equations are transformed to non-dimensional form with the associated appropriate boundary conditions. The homotopy perturbation method is used to find the solutions of these equations as a function of the physical parameters of the problem. The effects of the parameters on the obtained solutions are discussed numerically and illustrated graphically. It is found that these parameters play an important role to control the solutions. Significant outcomes from graphical elucidation envisage that the inclusion of more magnetic field strength increases the resistance of the fluid motion. Intensification of the couple stress parameter attenuates the temperature values, while it increases with increasing thermophoresis parameter.

Mechanical feedback and robustness of apical constrictions in Drosophila embryo ventral furrow formation

Formation of the ventral furrow in the Drosophila embryo relies on the apical constriction of cells in the ventral region to produce bending forces that drive tissue invagination. In our recent paper we observed that apical constrictions during the initial phase of ventral furrow formation produce elongated patterns of cellular constriction chains prior to invagination and argued that these are indicative of tensile stress feedback. Here, we quantitatively analyze the constriction patterns preceding ventral furrow formation and find that they are consistent with the predictions of our active-granular-fluid model of a monolayer of mechanically coupled stress-sensitive constricting particles. Our model shows that tensile feedback causes constriction chains to develop along underlying precursor tensile stress chains that gradually strengthen with subsequent cellular constrictions. As seen in both our model and available optogenetic experiments, this mechanism allows constriction chains to penetrate or circumvent zones of reduced cell contractility, thus increasing the robustness of ventral furrow formation to spatial variation of cell contractility by rescuing cellular constrictions in the disrupted regions.

Generalized Photo-Thermo-Microstretch Elastic Solid Semiconductor Medium Due To Excitation Process

A novel model in the theory of photo-thermoelasticity with microstretch properties is studied. The plasma-elastic-thermal plane waves are propagated in a linear isotropic generalized photo-thermo-microstretch elastic semiconductor solid medium. The photothermal excitation occurs in the context of the microinertia of microelement process during two dimensions (2D) deformation. The harmonic wave techniques are used to get the solutions for the basic variables. The analytical solution of the main physical fields; carrier intensity, normal displacement components, temperature, stress load force, microstress and tangential coupled stress can be obtained. Some graphics illustrated when using the plasma, thermal and mechanical load boundary conditions, which they apply at the outer free surface of the elastic medium. Some semiconductor materials as silicon (Si) and Germanium (Ge) are used to make the numerical simulation and some comparisons in different thermal memories are made. The main physical variables with new parameters are discussed theoretically and shown graphically.