KARAKTERISASI PISAU DARI BAHAN WIRE ROPE TEMPA MANUAL

Pisau banyak dijumpai pada pengolahan makanan, untuk pembuatan pisau dilakukan oleh pande besi tradisional memproduksi pisau dengan pengetahuan metalurgi yang terbatas dimana pisau yang dihasilkan berkualitas rendah. Kualitas pisau yang di produksi pande besi tradisional dapat ditingkatkan dengan cara pemilihan material dasar, proses pembuatan, perlakuan panas serta proses akhir yang tepat, dengan memanfaatkan berbagai limbah salah satunya wire rope. Wire rope terbuat dari kawat baja yang disebut piano wire memiliki baja karbon C : 0,8 %. dengan campuran boraks dan amonium klorida sebagai fluks ketika pencampuran untuk memudahkan peleburan. Kualitas pisau sangat dipengaruhi oleh tingkat kekerasan dan ketangguhan material pisau. Pengujian dilakukan meliputi pengujian komposisi kimia, uji metalografi, uji kekerasan. Bagian tepi pisau memiliki kekerasan 712 HV sedangkan pangkal pisau 241 HV dikarenakan proses heat treatment pada tepi tajam, sedangkan komposisi kimia Fe-98,6 %, C-0,42 %, Si-0,206 %, Mn-0,505 %, Cr-0,05% dan P-0,0149 %. Fasa yang terjadi pada tepi tajam lebih dominan martensite sedangkan pangkal pisau ferrite, menunjukan bahwa pisau dapat digunakan.

Fabrication of bilayer resin-bonded fixed abrasive wires using the pultrusion process

The fabrication of resin-bonded abrasive composite materials with constant cross-section was achieved by wire pultrusion wherein a piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry was cured at a moderate temperature. The bilayer resin-bonded fixed diamond wire with a diameter of about 191–205 μm with an inner layer of phenolic-modified epoxy resin and an outer layer of phenolic resin through the pultrusion method was presented. The results showed that when liquid resin slurry with higher diamond concentration during the pultrusion process was used, a larger wire diameter, less diamond spacing and higher diamond protrusion were obtained.

Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

Proposal for Abrasive Layer Fabrication on Thin Wire by Electrical Discharge Machining

This paper deals with a method of fabricating an abrasive layer on a thin wire by means of electrical discharge machining (EDM). An electrodeposited wire saw is useful for slicing a silicon ingot. However, strong acids are used in the production process and the depositing speed is slow. To overcome these problems, a fabrication process for an abrasive layer on a thin wire by EDM is proposed. The layer deposited by EDM with a green compact electrode is porous under certain electrical conditions so that the layer is composed of abrasive grit, pores and bond. A mixture of WC, Co, and the abrasive was compressed to make the green compact electrode. Two green compact electrodes were placed facing each other and were reciprocally fed during the process. The WC layer was deposited in 1s on an area in a preliminary experiment. The feed rate of 0.12-mm piano wire was set to 50mm/min. Al2O3abrasive powders with a size of 35-50µm were able to be contained in the WC layer on the wire. The deposit containing the abrasive firmly adhered. Because the deposited WC layer was very hard, tight gripping of the grit can be also expected. A copper block was cut with a raw piano wire, with wires with or without the abrasive deposited by EDM, and with electrodeposited or resinoid wire saws available on the market to compare their cutting performance. The initial tension was set to 5N and the cutting load was changed from 5.5 to 9.0N. The average feed speed of the wire was set to 8m/min. After 2000 reciprocating motions, the amounts machined with the deposited wire were larger than those with the wire saw available on the market. The deposited wire endured the same cutting load as the electrodeposited wire saw.

An Innovative Own-Weight Cantilever Method for Measuring Young’s Modulus in Flexible Thin Materials Based on Large Deflections

This report deals with an innovative method (Own-Weight Cantilever Method) to measure Young’s modulus of flexible thin materials. A newly developed method is based on the large deformation theory considering large deformation behaviors due to own-weight in flexible thin materials. Analytical solutions are derived by using Bessel Functions. By means of measuring the horizontal displacement or the vertical displacement at a free end of a cantilever, Young’s modulus can be easily obtained for various flexible thin and long materials. Measurements were carried out on a piano wire. The results confirm that the new method is suitable for flexible thin wires.

Aspire to Become TAKUMI - TAKUMI Present Status and Research Topics -

The construction of The Engineering Materials Diffractometer, TAKUMI of J-PARC has been finished on March 2009, and the commissioning has been started from September 2008 being parallel with the final stage of the construction. In the commissioning, after checking the validity and the stability of the detectors and the data acquisition system, powder diffraction data of an austenitic steel alloy with 10 mm diameter without beam collimation (high intensity mode) was measured, and the resolution Δd/d of 0.4% was confirmed, as designed. Further commissioning was done also with 2 mm diameter of annealed piano wire with combination of beam collimation (high resolution mode), and the resolution Δd/d of less than 0.2% was confirmed to be achieved. TAKUMI adopted an event mode data recording method. It was found that the recording method is very useful to manipulate data as we like, for instance, detector range, time of flight binning width and time resolved data, even the experiment has been finished.