Improved passivation depth of porous fluorescent 6H-SiC with Si/C faces using atomic layer deposition

We investigated the effects of different growth facets of 6H-SiC and different voltage waveforms on the porous structure and luminescence properties. The structure formed on the surface after anodic etching significantly changed because of the difference in the growth plane, whereas dendritic and columnar pores were observed inside the Si- and C-face samples. These large porous structures were shown to promote the penetration depth of the atomic-layer-deposited Al2O3 films, and a recorded passivation depth of 30-µm layer was confirmed in C-face porous SiC. From the results using fluorescence microscope and PL spectra measurement, it was concluded that the pulsed-voltage etching was preferable for fabricating uniform porous structures compared with the constant-voltage etching. However, the enhancement of the luminescence intensity needs to be further improved to realize high luminescent efficiency in porous fluorescent SiC.

Nanocluster-Based Ultralow-Temperature Driven Oxide Gate Dielectrics for High-Performance Organic Electronic Devices

The development of novel dielectric materials with reliable dielectric properties and low-temperature processibility is crucial to manufacturing flexible and high-performance organic thin-film transistors (OTFTs) for next-generation roll-to-roll organic electronics. Here, we investigate the solution-based fabrication of high-k aluminum oxide (Al2O3) thin films for high-performance OTFTs. Nanocluster-based Al2O3 films fabricated by highly energetic photochemical activation, which allows low-temperature processing, are compared to the conventional nitrate-based Al2O3 films. A wide array of spectroscopic and surface analyses show that ultralow-temperature photochemical activation (<60 °C) induces the decomposition of chemical impurities and causes the densification of the metal-oxide film, resulting in a highly dense high-k Al2O3 dielectric layer from Al-13 nanocluster-based solutions. The fabricated nanocluster-based Al2O3 films exhibit a low leakage current density (<10−7 A/cm2) at 2 MV/cm and high dielectric breakdown strength (>6 MV/cm). Using this dielectric layer, precisely aligned microrod-shaped 2,7-dioctyl[1]benzothieno [3,2-b][1] benzothiophene (C8-BTBT) single-crystal OTFTs were fabricated via solvent vapor annealing and photochemical patterning of the sacrificial layer.