scholarly journals Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

2017 ◽  
Vol 24 (1) ◽  
pp. 17-25
Author(s):  
Do-hyun Jung ◽  
Myung-hwan Roh ◽  
Jun-hyeong Lee ◽  
Kyung-heum Kim ◽  
Jae Pil Jung
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
High Temperature Operation

Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000045-000050 ◽  
Author(s):  
Sang Won Yoon ◽  
Michael D. Glover ◽  
H. Alan Mantooth ◽  
Koji Shiozaki
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Thermal Management ◽  
Transient Liquid Phase ◽  
Proof Of Concept ◽  
Bonding Quality ◽  
Tlp Bonding ◽  
Electrical Conductivities ◽  
High Temperature Operation ◽  
Attachment Bonding

This paper demonstrates the feasibility of double-sided die attachment bonding, a key technology for double-sided cooling structures, using copper-tin transient liquid phase (Cu-Sn TLP) bonding. Recently, double-sided cooling has drawn particular interest by providing a notable improvement in thermal management and increasing allowable power density for automotive power electronics. The use of TLP bonding for double-sided attachment avoids a number of complications in the assembly process, enables multiple attachments, and provides a high bonding quality and reliability at high temperature operation (because of its high re-melting temperature). In addition, Cu-Sn TLP facilitates high thermal and electrical conductivities, which exactly correspond to the aim of double-sided cooling. Cu-Sn TLP bonding is developed using silicon dummy dies and DBC (direct bonded copper) substrates. The feasibility of double-sided Cu-Sn TLP bonding is demonstrated by (1) proof-of-concept fabrication, (2) optical analysis using optical microscopy and SAM, and (3) material identification using SEM and EDX analysis.

Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

2004 ◽  
Vol 9 (6) ◽  
pp. 525-531 ◽  
Author(s):  
H. Duan ◽  
M. Koçak ◽  
K.-H. Bohm ◽  
V. Ventzke
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
Cu Foil

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

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