Fabrication and characterization of nano-SiC/ thermoplastic polyurethane hybrid heating membranes based on fine silver filaments

Polymer blending is a method to provide nanocomposite nanofibers with improved strength and minimal defects. Chitosan exhibits biocompatibility, biodegradability, antimicrobial activity, and wound healing properties. A combination of gelatin and thermoplastic polyurethane (TPU) blends was explored as a means to improve the morphological deficiencies of chitosan nanofibers and facilitate its electrospinnability. The morphology of the electrospun chitosan, chitosan/gelatin, and chitosan/gelatin/TPU blend nanofibers were characterized using scanning electron microscopy (SEM), while the miscibility and thermal behavior of the blends were determined using differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy/attenuated total reflectance (FTIR/ATR). The optimum results were achieved in blend with 3 wt% chitosan, 8 wt% gelatin, and 5 wt% TPU, which resulted nanofibers with a mean diameter of 100.6 nm ± 17.831 nm.

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Fabrication and characterization of piezoresistive flexible pressure sensors based on poly(vinylidene fluoride)/thermoplastic polyurethane filled with carbon black‐polypyrrole

Polymer Composites ◽

10.1002/pc.26327 ◽

2021 ◽

Author(s):

Mayara C. Bertolini ◽

Sithiprumnea Dul ◽

Elaine C. Lopes Pereira ◽

Bluma G. Soares ◽

Guilherme M. O. Barra ◽

...

Keyword(s):

Carbon Black ◽

Vinylidene Fluoride ◽

Thermoplastic Polyurethane ◽

Pressure Sensors ◽

Poly Vinylidene Fluoride ◽

Fabrication And Characterization ◽

Flexible Pressure Sensors

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Fabrication and Characterization of Screen Printed Stretchable Carbon Interconnects

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2017-nor-mosallaei ◽

2017 ◽

Vol 2017 (NOR) ◽

pp. 1-6 ◽

Cited By ~ 1

Author(s):

Mahmoud Mosallaei ◽

Behnam Khorramdel ◽

Mari Honkanen ◽

Pekka Iso-Ketola ◽

Jukka Vanhala ◽

...

Keyword(s):

Thermoplastic Polyurethane ◽

Electronic Devices ◽

Soft Robotics ◽

Single Strain ◽

Implantable Electronics ◽

Fabrication And Characterization ◽

Deformable Materials ◽

Stretchable Interconnects ◽

New Generation

Abstract Electronic devices that are deformable in arbitrary directions would open up a new generation of applications such as epidermal electronics, implantable electronics and soft robotics. It would not be feasible to fabricate them with conventional rigid materials. To make the electronics stretchable, one can miniaturize the functional units and link them by stretchable interconnects. In this paper, we report a method for fabrication and characterization of stretchable interconnects using deformable materials based on carbon ink and thermoplastic polyurethane. The static resistances of interconnects were on average 296 Ω/□, and half of the samples withstood single strain up to 108 % elongation. Fabricated samples survived a 1000 cycles strain test up to 40 % of stretching.

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