Temperature dependence of aging drift in CuNi films on alumina ceramic substrates

1993 ◽  
Vol 140 (1) ◽  
pp. K21-K24 ◽  
Author(s):  
W. Brückner ◽  
J. Schumann ◽  
H. Griessmann
Sensors ◽  
2018 ◽  
Vol 18 (8) ◽  
pp. 2676
Author(s):  
Chen Li ◽  
Boshan Sun ◽  
Yanan Xue ◽  
Jijun Xiong

Alumina ceramic is a highly promising material for fabricating high-temperature pressure sensors. In this paper, a direct bonding method for fabricating a sensitive cavity with alumina ceramic is presented. Alumina ceramic substrates were bonded together to form a sensitive cavity for high-temperature pressure environments. The device can sense pressure parameters at high temperatures. To verify the sensitivity performance of the fabrication method in high-temperature environments, an inductor and capacitor were integrated on the ceramic substrate with the fabricated sensitive cavity to form a wireless passive LC pressure sensor with thick-film integrated technology. Finally, the fabricated sensor was tested using a system test platform. The experimental results show that the sensor can realize pressure measurements above 900 °C, confirming that the fabricated sensitive cavity has excellent sealing properties. Therefore, the direct bonding method can potentially be used for developing all-ceramic high-temperature pressure sensors for application in harsh environments.


Author(s):  
E. Ermantraut ◽  
H. Muller ◽  
W. Eberhardt ◽  
P. Ninz ◽  
F. Kern ◽  
...  

1991 ◽  
Vol 226 ◽  
Author(s):  
Guo-Quan Lu ◽  
Boris Mogilevsky ◽  
Tapan K. Gupta

AbstractThe bending curvatures of tri-material plates have been measured using in situ laser reflection technique at temperatures ranging from 20°C to 160°C. The tri-material structures are formed by attaching silicon wafers to ceramic substrates with die-attach adhesives from solder-like (elastic modulus ≈ 24 GPa) to gel-like (elastic modulus ≈ 0.003 GPa) characteristics. The temperature dependence of curvature as a result of the thermal expansion mismatch is measured. The structure bonded by the gel-like adhesive has substantially lower, about a factor of ten less, bending than the structures attached by the other two types of adhesives. We found good agreements between the measurements and the theoretical derivations by Suhir[1] for the bending curvature of finite tri-material assembly.


2010 ◽  
Vol 101 (2) ◽  
pp. 271-278 ◽  
Author(s):  
X. C. Wang ◽  
H. Y. Zheng ◽  
P. L. Chu ◽  
J. L. Tan ◽  
K. M. Teh ◽  
...  

Ceramics ◽  
2020 ◽  
Vol 3 (4) ◽  
pp. 428-439
Author(s):  
Lea Schmidtner ◽  
Mathias Herrmann ◽  
Christos G. Aneziris

The technology of multi-wire sawing is well established in the production of silicon wafers but can also be applied in the production of ceramic substrates. In this study, the influence of the Al2O3-grain size of the alumina ceramic on the efficiency of the multi-wire slurry process was investigated. The grain size of HIPed alumina ceramics was changed by heat treatment processes at 1350 °C and 1400 °C. A B4C slurry was used for the investigation of the cutting of high purity alumina ceramic. With increasing grain size of the ceramic, the efficiency of the sawing process increases. The analysis of the as-cut surface morphology of the substrates shows a change in material removal from trans- to intergranular micro-fracture with increasing grain size. Furthermore, grain coarsening leads to substrates with increased roughness values and reduced biaxial strength.


1989 ◽  
Vol 40 (7) ◽  
pp. 835-839 ◽  
Author(s):  
Tetsuya OSAKA ◽  
Yukihiro TAMIYA ◽  
Kazuhisa NAITO ◽  
Kaori SAKAGUCHI

Carbon ◽  
2012 ◽  
Vol 50 (8) ◽  
pp. 3092-3095 ◽  
Author(s):  
Ender Suvacı ◽  
Yasemin Çelik ◽  
Alicia Weibel ◽  
Alain Peigney ◽  
Emmanuel Flahaut

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