scholarly journals A Ceramic Diffusion Bonding Method for Passive LC High-Temperature Pressure Sensor

Sensors ◽  
2018 ◽  
Vol 18 (8) ◽  
pp. 2676
Author(s):  
Chen Li ◽  
Boshan Sun ◽  
Yanan Xue ◽  
Jijun Xiong
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Pressure Sensors ◽  
Alumina Ceramic ◽  
Harsh Environments ◽  
Ceramic Substrates ◽  
Integrated Technology ◽  
All Ceramic ◽  
Test Platform ◽  
Bonding Method

Alumina ceramic is a highly promising material for fabricating high-temperature pressure sensors. In this paper, a direct bonding method for fabricating a sensitive cavity with alumina ceramic is presented. Alumina ceramic substrates were bonded together to form a sensitive cavity for high-temperature pressure environments. The device can sense pressure parameters at high temperatures. To verify the sensitivity performance of the fabrication method in high-temperature environments, an inductor and capacitor were integrated on the ceramic substrate with the fabricated sensitive cavity to form a wireless passive LC pressure sensor with thick-film integrated technology. Finally, the fabricated sensor was tested using a system test platform. The experimental results show that the sensor can realize pressure measurements above 900 °C, confirming that the fabricated sensitive cavity has excellent sealing properties. Therefore, the direct bonding method can potentially be used for developing all-ceramic high-temperature pressure sensors for application in harsh environments.

scholarly journals Hierarchical network enabled flexible textile pressure sensors with ultra-high sensitivity, ultra-wide linearity and high-temperature resistance

2021 ◽  
Author(s):  
Meiling Jia ◽  
Chenghan Yi ◽  
Yankun Han ◽  
Xin Li ◽  
Guoliang Xu ◽  
...  
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Pressure Sensor ◽  
High Performance ◽  
Full Range ◽  
Pressure Sensors ◽  
Fiber Surface ◽  
High Sensitivity ◽  
Harsh Environments ◽  
Point To Point

Abstract Thin, lightweight, and flexible textile pressure sensors with the ability to precisely detect the full range of faint pressure (< 100 Pa), low pressure (in the range of KPa) and high pressure (in the range of MPa) are in significant demand to meet the requirements for applications in daily activities and more meaningfully in some harsh environments, such as high temperature and high pressure. However, it is still a major challenge to fulfill these requirements simultaneously in a single pressure sensor. Herein, a high-performance pressure sensor enabled by polyimide fiber fabric with functionalized carbon-nanotube (PI/FCNT) is obtained via a facile electrophoretic deposition (EPD) approach. High-density FCNT is evenly wrapped and chemically bonded to the fiber surface during the EPD process, forming a conductive hierarchical fiber/FCNT matrix. Benefiting from the abundant yet firm contacting points, point-to-point contacting mode, and high elastic modulus of both PI and CNT, the proposed PI/FCNT pressure sensor exhibits ultra-high sensitivity (3.57 MPa− 1), ultra-wide linearity (3.24 MPa), exceptionally broad sensing range (~ 45 MPa), and long-term stability (> 4000 cycles). Furthermore, under a high working temperature of 200 ºC, the proposed sensor device still shows an ultra-high sensitivity of 2.64 MPa− 1 within a wide linear range of 7.2 MPa, attributing to its intrinsic high-temperature-resistant properties of PI and CNT. Thanks to these merits, the proposed PI/FCNT(EPD) pressure sensor could serve as an E-skin device to monitor the human physiological information, precisely detect tiny and extremely high pressure, and can be integrated into an intelligent mechanical hand to detect the contact force under high-temperature (> 300 ºC), endowing it with high applicability in the fields of real-time health monitoring, intelligent robots, and harsh environments.

scholarly journals Hierarchical network enabled flexible textile pressure sensor with ultra-broad response range and high-temperature resistance

2021 ◽  
Author(s):  
Meiling Jia ◽  
Chenghan Yi ◽  
Yankun Han ◽  
Xin Li ◽  
Guoliang Xu ◽  
...  
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Pressure Sensor ◽  
Full Range ◽  
Pressure Sensors ◽  
Fiber Surface ◽  
Harsh Environments ◽  
Temperature Resistance ◽  
High Temperature Resistance ◽  
Fiber Fabric

Abstract Thin, lightweight, and flexible textile pressure sensors with the ability to detect the full range of faint pressure (<100 Pa), low pressure (in the range of KPa) and high pressure (in the range of MPa) are in significant demand to meet the requirements for applications in daily activities and more meaningfully in some harsh environments, such as high temperature and high pressure. However, it is still a significant challenge to fulfill these requirements simultaneously in a single pressure sensor. Herein, a high-performance pressure sensor enabled by polyimide fiber fabric with functionalized carbon-nanotube (PI/FCNT) is obtained via a facile electrophoretic deposition (EPD) approach. High-density FCNT is evenly wrapped and chemically bonded to the fiber surface during the EPD process, forming a conductive hierarchical fiber/FCNT matrix. Benefiting from the large compressible region of PI fiber fabric, abundant yet firm contacting points, point-to-point contacting mode, and high elastic modulus of both PI and CNT, the proposed PI/FCNT pressure sensor can be customized and modulated to achieve both a wide linear ranges, ultra-broad sensing range, long-term stability and high-temperature resistance. Thanks to these merits, the proposed PI/FCNT(EPD) pressure sensor could monitor the human physiological information, detect tiny and extremely high pressure, can be integrated into an intelligent mechanical hand to detect the contact force under high-temperature (>300 ºC), endowing it with high applicability in the fields of real-time health monitoring, intelligent robots, and harsh environments.

scholarly journals Study on the Stability of the Electrical Connection of High-Temperature Pressure Sensor Based on the Piezoresistive Effect of P-Type SiC

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 216
Author(s):  
Yongwei Li ◽  
Ting Liang ◽  
Cheng Lei ◽  
Qiang Li ◽  
Zhiqiang Li ◽  
...  
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Pressure Sensors ◽  
Extreme Environment ◽  
Maximum Temperature ◽  
Piezoresistive Effect ◽  
Electrical Connection ◽  
Contact Stability ◽  
The Stability ◽  
P Type

In this study, a preparation method for the high-temperature pressure sensor based on the piezoresistive effect of p-type SiC is presented. The varistor with a positive trapezoidal shape was designed and etched innovatively to improve the contact stability between the metal and SiC varistor. Additionally, the excellent ohmic contact was formed by annealing at 950 °C between Ni/Al/Ni/Au and p-type SiC with a doping concentration of 1018cm−3. The aging sensor was tested for varistors in the air of 25 °C–600 °C. The resistance value of the varistors initially decreased and then increased with the increase of temperature and reached the minimum at ~450 °C. It could be calculated that the varistors at ~100 °C exhibited the maximum temperature coefficient of resistance (TCR) of ~−0.35%/°C. The above results indicated that the sensor had a stable electrical connection in the air environment of ≤600 °C. Finally, the encapsulated sensor was subjected to pressure/depressure tests at room temperature. The test results revealed that the sensor output sensitivity was approximately 1.09 mV/V/bar, which is better than other SiC pressure sensors. This study has a great significance for the test of mechanical parameters under the extreme environment of 600 °C.

scholarly journals A Novel Interdigital Capacitor Pressure Sensor Based on LTCC Technology

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Qiulin Tan ◽  
Mingliang Yang ◽  
Tao Luo ◽  
Wei Liu ◽  
Chao Li ◽  
...  
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Screen Printing ◽  
Room Temperature ◽  
Mutual Inductance ◽  
Ceramic Technology ◽  
Harsh Environments ◽  
Chemical Corrosion ◽  
Interdigital Capacitor ◽  
Lc Circuit

A novel passive wireless pressure sensor is proposed based on LTCC (low temperature cofired ceramic) technology. The sensor employs a passive LC circuit, which is composed of a variable interdigital capacitor and a constant inductor. The inductor and capacitor were fabricated by screen-printing. Pressure measurement is tested using a wireless mutual inductance coupling method. The experimental sensitivity of the sensor is about 273.95 kHz/bar below 2 bar. Experimental results show that the sensor can be read out wirelessly by external antenna at 600°C. The max readout distance is 3 cm at room temperature. The sensors described can be applied for monitoring of gas pressure in harsh environments, such as environment with high temperature and chemical corrosion.

Static and Dynamic Pressure Measurements With Temperature Correction Using High Temperature Optical Pressure Sensors

2010 ◽  
Author(s):  
A. P. R. Harpin
Keyword(s):  
High Temperature ◽  
Gas Turbine ◽  
Dynamic Range ◽  
Dynamic Pressure ◽  
Measurement Techniques ◽  
Pressure Sensors ◽  
Real Life ◽  
Temperature Correction ◽  
Harsh Environments ◽  
Wide Range

We describe our range of high temperature (1100°C) pressure sensors capable of measuring both static pressures of several Bar as required by gas turbine and jet engines, and measuring dynamic pressure fluctuations with a total dynamic range of in excess of 100000. This is achieved by a combination of rugged sensor design and our proprietary optical interrogator. This allows operation in harsh environments, EMI immunity, and simultaneous interrogation of not only static and dynamic pressure, but also the temperature of the sensor. This allows the sensor to maintain high accuracy over a wide range of operating temperatures. To date sensors have not been able to offer operation temperatures this high whilst enabling accurate dynamic pressure readings at the locations required. Also the static pressure cannot be retrieved simultaneously in real time from the same sensor. Also the temperature coefficient of the sensor has to be taken into account by measuring the temperature the sensor is operating at. Oxsensis has addressed these issues and we will present results showing dynamic pressure and temperature and explain how we can measure the temperature of the sensor with our interrogation schemes. We will describe the form of the sensor and the test data confirming its suitability for harsh environments. We will also explain the optical interrogator performance and present simulated results. The interrogator may be realised by a slave cavity or preferably on an integrated optical platform. As these sensors are intended for hostile gas turbine and aerospace environments, we will also present data from real life engine trials that we have performed, and compare the data we obtained with existing measurement techniques. Tests on a combustor rig have tested the sensor up to 1000°C, demonstrating that using our sensors in an engine at these temperatures is a realistic prospect. We believe that the ruggedness and performance of these sensors together with our complimentary interrogators mean that they are of significant interest to instrumentation of gas turbine engines and in the future the development of sophisticated engine feedback and emission control schemes, both in land based and aerospace environments.

Design and Fabrication of Leadless Package Structure for Pressure Sensors

2021 ◽  
Author(s):  
Junwang Tian ◽  
Zhong Jin ◽  
Xin Tang ◽  
Wenxian Peng ◽  
Junfu Liu ◽  
...  
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Pressure Sensor ◽  
Silicone Oil ◽  
Pressure Sensors ◽  
Gold Wire ◽  
Electrical Signal ◽  
Back Side ◽  
Element Analysis ◽  
Silver Paste

Abstract Silicon piezoresistive pressure sensors can only operate below 125°C due to the leakage current of the PN junction. However, SOI high temperature pressure sensors use SiO2 for full dielectric isolation to solve this problem. At present, SOI high temperature pressure sensors mostly use lead bonding package structure, with gold wire to lead the electrical signal and silicone oil as the protection medium, but the working temperature of silicone oil is limited to about 150?. In this paper, the leadless package structure is designed by using pressure conduction on the back side of the chip and replacing the gold wire with conductive silver paste, and the materials and dimensions of the leadless package structure are determined. The reliability of the leadless package structure was verified by finite element analysis, and the results showed that the thermal stress caused by high and low temperature cycles in the leadless package is very small and does not affect the sensitivity of the pressure-sensitive chip. The size of the leadless package structure was optimized by Taguchi orthogonal method, and the maximum thermal stress was effectively reduced. Also, the key factors affecting the thermal stress of the leadless package in the package structure were identified by the variance number analysis method. The electrical signal conduction of the pressure sensor is achieved by a silver paste sintering process, and the data show that the sensitivity of the pressure sensor is 30.82 mV/MPa with a nonlinearity of less than 0.4% FS.

scholarly journals A High Temperature Capacitive Pressure Sensor Based on Alumina Ceramic for in Situ Measurement at 600 °C

Sensors ◽  
2014 ◽  
Vol 14 (2) ◽  
pp. 2417-2430 ◽  
Author(s):  
Qiulin Tan ◽  
Chen Li ◽  
Jijun Xiong ◽  
Pinggang Jia ◽  
Wendong Zhang ◽  
...  
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Alumina Ceramic ◽  
In Situ Measurement ◽  
Capacitive Pressure Sensor

scholarly journals Hermeticity Analysis on SiC Cavity Structure for All-SiC Piezoresistive Pressure Sensor

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 379
Author(s):  
Baohua Tian ◽  
Haiping Shang ◽  
Lihuan Zhao ◽  
Dahai Wang ◽  
Yang Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Pressure Sensors ◽  
Absolute Pressure ◽  
Microstructure Observation ◽  
Thermal Expansion Coefficients ◽  
Piezoresistive Pressure Sensor ◽  
Cavity Structure ◽  
Sic Wafer ◽  
Temperature Applications

The hermeticity performance of the cavity structure has an impact on the long-term stability of absolute pressure sensors for high temperature applications. In this paper, a bare silicon carbide (SiC) wafer was bonded to a patterned SiC substrate with shallow grooves based on a room temperature direct bonding process to achieve a sealed cavity structure. Then the hermeticity analysis on the SiC cavity structure was performed. The microstructure observation demonstrates that the SiC wafers are tightly bonded and the cavities remain intact. Moreover, the tensile testing indicates that the tensile strength of bonding interface is ~8.01 MPa. Moreover, the quantitative analysis on the airtightness of cavity structure through leakage detection shows a helium leak rate of ~1.3 × 10−10 Pa⋅m3/s, which satisfies the requirement of the specification in the MIL-STD-883H. The cavity structure can also avoid an undesirable deep etching process and the problem caused by the mismatch of thermal expansion coefficients, which can be potentially further developed into an all-SiC piezoresistive pressure sensor employable for high temperature applications.

A Full Printed Flexible Pressure Sensor with Improved Temperature Performance based on Optimized Curing Mechanism

2021 ◽  
Author(s):  
Jingnan Ma ◽  
Mengmeng Liang ◽  
Wei Wang
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Flexible Electronics ◽  
Material Selection ◽  
Pressure Sensors ◽  
Functional Materials ◽  
Temperature Performance ◽  
Curing Mechanism ◽  
Flexible Pressure Sensor ◽  
Flexible Pressure Sensors

Printable flexible pressure sensors have many important applications in wearable systems. One major challenge of such a sensor is to maintain sensing properties in high temperature. By optimizing the curing mechanism of the flexible pressure sensor functional materials, this paper proposes a new method of achieving high temperature properties for a full printed sensor. The establishment of curing theory is mainly studied. The printing process of this kind of sensor is systematically stated and tested to check whether it can continue to function at high temperatures. Ultimately a fully-printed flexible pressure sensor with good temperature performance is achieved. The paper focuses around the technical route of “material selection—theoretical analysis —function material preparation—design and preparation of device—device performance evaluation”. Suitable materials are used in flexible pressure sensors and the curing mechanism is established. This proposed technique can be extended to the development of other printable flexible sensors, which can lead to a huge impact on future applications of the flexible electronics.

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