scholarly journals A novel catalytic-type gas sensor based on alumina ceramic substrates loaded with catalysts and printed electrodes

Author(s):  
Hao Li ◽  
Ruijie Wu ◽  
Huabin Liu ◽  
Liying Han ◽  
Wenjing Yuan ◽  
...  
Sensors ◽  
2018 ◽  
Vol 18 (8) ◽  
pp. 2676
Author(s):  
Chen Li ◽  
Boshan Sun ◽  
Yanan Xue ◽  
Jijun Xiong

Alumina ceramic is a highly promising material for fabricating high-temperature pressure sensors. In this paper, a direct bonding method for fabricating a sensitive cavity with alumina ceramic is presented. Alumina ceramic substrates were bonded together to form a sensitive cavity for high-temperature pressure environments. The device can sense pressure parameters at high temperatures. To verify the sensitivity performance of the fabrication method in high-temperature environments, an inductor and capacitor were integrated on the ceramic substrate with the fabricated sensitive cavity to form a wireless passive LC pressure sensor with thick-film integrated technology. Finally, the fabricated sensor was tested using a system test platform. The experimental results show that the sensor can realize pressure measurements above 900 °C, confirming that the fabricated sensitive cavity has excellent sealing properties. Therefore, the direct bonding method can potentially be used for developing all-ceramic high-temperature pressure sensors for application in harsh environments.


Author(s):  
E. Ermantraut ◽  
H. Muller ◽  
W. Eberhardt ◽  
P. Ninz ◽  
F. Kern ◽  
...  

2010 ◽  
Vol 101 (2) ◽  
pp. 271-278 ◽  
Author(s):  
X. C. Wang ◽  
H. Y. Zheng ◽  
P. L. Chu ◽  
J. L. Tan ◽  
K. M. Teh ◽  
...  

1993 ◽  
Vol 140 (1) ◽  
pp. K21-K24 ◽  
Author(s):  
W. Brückner ◽  
J. Schumann ◽  
H. Griessmann

Ceramics ◽  
2020 ◽  
Vol 3 (4) ◽  
pp. 428-439
Author(s):  
Lea Schmidtner ◽  
Mathias Herrmann ◽  
Christos G. Aneziris

The technology of multi-wire sawing is well established in the production of silicon wafers but can also be applied in the production of ceramic substrates. In this study, the influence of the Al2O3-grain size of the alumina ceramic on the efficiency of the multi-wire slurry process was investigated. The grain size of HIPed alumina ceramics was changed by heat treatment processes at 1350 °C and 1400 °C. A B4C slurry was used for the investigation of the cutting of high purity alumina ceramic. With increasing grain size of the ceramic, the efficiency of the sawing process increases. The analysis of the as-cut surface morphology of the substrates shows a change in material removal from trans- to intergranular micro-fracture with increasing grain size. Furthermore, grain coarsening leads to substrates with increased roughness values and reduced biaxial strength.


1989 ◽  
Vol 40 (7) ◽  
pp. 835-839 ◽  
Author(s):  
Tetsuya OSAKA ◽  
Yukihiro TAMIYA ◽  
Kazuhisa NAITO ◽  
Kaori SAKAGUCHI

Carbon ◽  
2012 ◽  
Vol 50 (8) ◽  
pp. 3092-3095 ◽  
Author(s):  
Ender Suvacı ◽  
Yasemin Çelik ◽  
Alicia Weibel ◽  
Alain Peigney ◽  
Emmanuel Flahaut

2004 ◽  
Vol 833 ◽  
Author(s):  
Lisa Woodward ◽  
Paul Woo ◽  
Mircea Capanu ◽  
Ivo Koutsaroff ◽  
C. R. Selvakumar ◽  
...  

ABSTRACTThe growth of the wireless industry over the past ten years has created a need for good quality passive components, and in particular high Q factor inductors. There has been a large amount of work aimed at improving the quality factors of inductors on both silicon and ceramic/insulating substrates. KAIST and other research groups have explored a MEMS technique, releasing the inductor coil to create an air gap between the coil and underpass, on silicon [1]. Typically the inductor coil has been separated by a 50 to 100μm air gap and has required special processing such as a dual exposure photoresist mold [1]. In the present work, suspended inductor coils have been fabricated and characterized on an alumina ceramic substrate [2]. The gap used was only 1μm and this was enough to increase the self-resonance frequency by up to 4GHz after release. The inductor coils were created in 6–10μm thick electroplated gold and the underpass in an aluminum layer. A sacrificial LPCVD oxide layer was used as the released dielectric. In the present study a range of inductance from 1 to 30nH was explored before and after release. The Q factors achieved in this work range from 40 to 70 in the 2 to 10 GHz range, which are some of the best Q factors reported for planar inductors (see Table I). In addition, since the architecture allowed the use of three metal layers, released transformers were also fabricated. They showed promising high frequency performance, which also will be presented. Minimum insertion loss better then –2dB was achieved between 10–12 GHz. The above described process is simple, precise, and manufacturable with the ability to extend the useful range of inductors to higher frequencies (1–10 GHz).


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