Measurements of Interface Fracture and Mechanical Properties of Low-K Dielectric Thin Films

2008 ◽  
pp. 917-918
Author(s):  
F. Atrash ◽  
D. Sherman
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Interface Fracture ◽  
Dielectric Thin Films ◽  
Low K

Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

2003 ◽  
Vol 429 (1-2) ◽  
pp. 201-210 ◽  
Author(s):  
Alex A Volinsky ◽  
Joseph B Vella ◽  
William W Gerberich
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Dielectric Thin Films ◽  
Low K

scholarly journals Nanoindentation of Silicate Low-K Dielectric Thin Films

2002 ◽  
Vol 716 ◽  
Author(s):  
Joseph B. Vella ◽  
Alex A. Volinsky ◽  
Indira S. Adhihetty ◽  
N.V. Edwards ◽  
William W. Gerberich
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Dielectric Constant ◽  
Elastic Modulus ◽  
Percolation Theory ◽  
Scratch Testing ◽  
Dielectric Thin Films ◽  
Cube Corner ◽  
Low K

AbstractThe capabilities of nanoindentation to characterize low-k organo silicate glass (OSG) thin films is explored as a relatively rapid and inexpensive metric of mechanical properties, adhesion strength, and fracture toughness. One method of decreasing the static dielectric constant of OSG interlayer dielectrics requires the introduction of porosity in the material which has a dramatic impact on its mechanical and toughness properties. Percolation theory is used to formulate a correlation between porosity and elastic modulus. Using cube corner diamond indentation and scratch testing fracture toughness calculations are also discussed.

Finite-Element Modeling and Quantitative Measurement Using Scanning Microwave Microscopy to Characterize Dielectric Films

2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang
Keyword(s):  
Thin Films ◽  
Dielectric Film ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Silicon Substrates ◽  
Fem Modeling ◽  
Dielectric Thin Films ◽  
Microwave Microscopy ◽  
Scanning Microwave Microscopy ◽  
Low K

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.

Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity

2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Chemical Vapor ◽  
Dielectric Materials ◽  
Free Standing ◽  
Dielectric Thin Films ◽  
X Ray ◽  
Chemical Vapor Deposited ◽  
Low K

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

Mechanical characterization of low-k and barrier dielectric thin films

2005 ◽  
Vol 82 (3-4) ◽  
pp. 368-373 ◽  
Author(s):  
N. Chérault ◽  
G. Carlotti ◽  
N. Casanova ◽  
P. Gergaud ◽  
C. Goldberg ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Characterization ◽  
Dielectric Thin Films ◽  
Low K

scholarly journals Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2284
Author(s):  
Y. K. Sa ◽  
Junghwan Bang ◽  
Junhyuk Son ◽  
Dong-Yurl Yu ◽  
Yun-Chan Kim
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Photoelectron Spectroscopy ◽  
Indentation Test ◽  
Chemical Degradation ◽  
Mechanical Instability ◽  
Uniform Size ◽  
Dielectric Thin Films ◽  
Self Organized ◽  
Low K

This paper reported the enhancement in thermo-mechanical properties and chemical stability of porous SiCOH dielectric thin films fabricated with molecularly scaled pores of uniform size and distribution. The resulting porous dielectric thin films were found to exhibit far stronger resistance to thermo-mechanical instability mechanisms common to conventional SiCOH dielectric thin films without forgoing an ultralow dielectric constant (i.e., ultralow-k). Specifically, the elastic modulus measured by nano-indentation was 13 GPa, which was substantially higher than the value of 6 GPa for a porous low-k film deposited by a conventional method, while dielectric constant exhibited an identical value of 2.1. They also showed excellent resistance against viscoplastic deformation, as measured by the ball indentation method, which represented the degree of chemical degradation of the internal bonds. Indentation depth was measured at 5 nm after a 4-h indentation test at 400 °C, which indicated an ~89% decrease compared with conventional SiCOH film. Evolution of film shrinkage and dielectric constant after annealing and plasma exposure were reduced in the low-k film with a self-organized molecular film. Analysis of the film structure via Fourier-transform infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS) indicated an increase in symmetric linear Si–O–Si molecular chains with terminal –CH3 bonds that were believed to be responsible for both the decrease in dipole moment/dielectric constant and the formation of molecular scaled pores. The observed enhanced mechanical and chemical properties were also attributed to this unique nano-porous structure.

An Electrical, Compositional, and Structural Study on Low-k Silsesquioxane Dielectric Thin Films

2005 ◽  
Vol 152 (7) ◽  
pp. F83 ◽  
Author(s):  
V. Ligatchev ◽  
T. K. Goh ◽  
S. Yu ◽  
Rusli
Keyword(s):  
Thin Films ◽  
Structural Study ◽  
Dielectric Thin Films ◽  
Low K
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