Competing Deformation Mechanisms in Nanocrystalline Metals

Author(s):  
Jakob Schiøtz ◽  
Søren L. Frederiksen
2013 ◽  
Vol 58 (4) ◽  
pp. 1207-1212
Author(s):  
E.S. Dzidowski

Abstract The causes of plane crashes, stemming from the subcritical growth of fatigue cracks, are examined. It is found that the crashes occurred mainly because of the negligence of the defects arising in the course of secondary metalworking processes. It is shown that it is possible to prevent such damage, i.e. voids, wedge cracks, grain boundary cracks, adiabatic shear bands and flow localization, through the use of processing maps indicating the ranges in which the above defects arise and the ranges in which safe deformation mechanisms, such as deformation in dynamic recrystallization conditions, superplasticity, globularization and dynamic recovery, occur. Thanks to the use of such maps the processes can be optimized by selecting proper deformation rates and forming temperatures.


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