Measurement of Mechanical Dissipation in SMAs by Infrared Thermography

2016 ◽  
pp. 9-14 ◽  
Author(s):  
Didier Delpueyo ◽  
Xavier Balandraud ◽  
Michel Grédiac ◽  
Sergiu Stanciu ◽  
Nicanor Cimpoesu
Keyword(s):  
Infrared Thermography ◽  
Mechanical Dissipation

Measuring Facial Skin Temperature Changes Caused by Mental Work-Load with Infrared Thermography

2016 ◽  
Vol 136 (11) ◽  
pp. 1581-1585 ◽  
Author(s):  
Tota Mizuno ◽  
Takeru Sakai ◽  
Shunsuke Kawazura ◽  
Hirotoshi Asano ◽  
Kota Akehi ◽  
...  
Keyword(s):  
Skin Temperature ◽  
Infrared Thermography ◽  
Work Load ◽  
Facial Skin ◽  
Mental Work ◽  
Temperature Changes ◽  
Mental Work Load

Detection and characterisation of buried objects using infrared thermography enhanced by microwave heating

2002 ◽  
Author(s):  
Arnaud Jacotin ◽  
Elodie Bachelier ◽  
Francois Liousse ◽  
Pierre Millan
Keyword(s):  
Microwave Heating ◽  
Infrared Thermography ◽  
Buried Objects

1040 Use of doppler ultrasound and infrared thermography to evaluate scrotal insulation in Braford bulls

2016 ◽  
Vol 94 (suppl_5) ◽  
pp. 498-499
Author(s):  
F. A. Barca Junior ◽  
C. Koetz Junior ◽  
G. R. Pereira ◽  
S. R. Menegassi ◽  
F. Morotti ◽  
...  
Keyword(s):  
Infrared Thermography ◽  
Doppler Ultrasound ◽  
Scrotal Insulation

Analysis of the Visualization Region in Near-Wall Fluid Layer by High-Speed Infrared Thermography

2020 ◽  
Vol 75 (2) ◽  
pp. 143-147
Author(s):  
A. M. Shagiyanova ◽  
E. Yu. Koroteeva ◽  
I. A. Znamenskaya ◽  
M. E. Dashyan ◽  
L. A. Blagonravov ◽  
...  
Keyword(s):  
Infrared Thermography ◽  
High Speed ◽  
Fluid Layer ◽  
Near Wall

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

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