Modeling, Design and Simulation of Power Electronic Devices and Circuits

2002 ◽  
pp. 465-481
Author(s):  
W. Fichtner
Keyword(s):  
Electronic Devices ◽  
Power Electronic

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals New Sensor for Medium- and High-Voltage Measurement

Energies ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4654
Author(s):  
Andrzej Wetula ◽  
Andrzej Bień ◽  
Mrunal Parekh
Keyword(s):  
Finite Element Method ◽  
Electronic Devices ◽  
Finite Element Method Simulation ◽  
Laboratory Model ◽  
Power Electronic ◽  
Proof Of Concept ◽  
Voltage Measurement ◽  
Medium Voltage ◽  
Narrow Frequency Band ◽  
Further Development

Measurements of medium and high voltages in a power grid are normally performed with large and bulky voltage transformers or capacitive dividers. Besides installation problems, these devices operate in a relatively narrow frequency band, which limits their usability in modern systems that are saturated with power electronic devices. A sensor that can be installed directly on a wire and can operate without a galvanic connection to the ground may be used as an alternative voltage measurement device. This type of voltage sensor can complement current sensors installed on a wire, forming a complete power acquisition system. This paper presents such a sensor. Our sensor is built using two dielectric elements with different permeability coefficients. A finite element method simulation is used to estimate the parameters of a constructed sensor. Besides simulations, a laboratory model of a sensor was built and tested in a medium-voltage substation. Our results provide a proof of concept for the presented sensor. Some errors in voltage reconstruction have been traced to an oversimplified data acquisition and transmission system, which has to be improved during the further development of the sensor.

scholarly journals Series Compensation of Transmission Systems: A Literature Survey

Energies ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1717
Author(s):  
Camilo Andrés Ordóñez ◽  
Antonio Gómez-Expósito ◽  
José María Maza-Ortega
Keyword(s):  
Steady State ◽  
Power Systems ◽  
Power System ◽  
Case Studies ◽  
Electronic Devices ◽  
Literature Survey ◽  
Power Electronic ◽  
Transmission Systems ◽  
Series Compensation ◽  
Near Future

This paper reviews the basics of series compensation in transmission systems through a literature survey. The benefits that this technology brings to enhance the steady state and dynamic operation of power systems are analyzed. The review outlines the evolution of the series compensation technologies, from mechanically operated switches to line- and self-commutated power electronic devices, covering control issues, different applications, practical realizations, and case studies. Finally, the paper closes with the major challenges that this technology will face in the near future to achieve a fully decarbonized power system.

Fault Prediction of Power Electronic Devices in Mobile UPS System

2021 ◽  
Author(s):  
Yu Wang ◽  
Leigang Nie ◽  
Yongnan Dang ◽  
Gaofeng Deng ◽  
Jiangwei Li ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Fault Prediction ◽  
Power Electronic

Topology Optimization of High Power Electronic Devices

2001 ◽  
pp. 119-131
Author(s):  
Ronald H. W. Hoppe ◽  
Svetozara Petrova ◽  
Volker Schulz
Keyword(s):  
Topology Optimization ◽  
High Power ◽  
Electronic Devices ◽  
Power Electronic

Near field resonant inductive coupling to power electronic devices dispersed in water

2012 ◽  
Vol 178 ◽  
pp. 217-222 ◽  
Author(s):  
Johannes Kuipers ◽  
Harry Bruning ◽  
Simon Bakker ◽  
Huub Rijnaarts
Keyword(s):  
Near Field ◽  
Electronic Devices ◽  
Inductive Coupling ◽  
Power Electronic

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

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