Thermal effects on through-silicon via (TSV) signal integrity

Author(s):  
Manho Lee ◽  
Jonghyun Cho ◽  
Joohee Kim ◽  
Jun So Pak ◽  
Hyungdong Lee ◽  
...  
Author(s):  
Manho Lee ◽  
Jun So Pak ◽  
Joungho Kim

2021 ◽  
Author(s):  
Seongguk Kim ◽  
Taein Shin ◽  
Hyunwook Park ◽  
Daehwan Lho ◽  
Keeyoung Son ◽  
...  

Author(s):  
Yunna Sun ◽  
Hui-Yeol Kim ◽  
Yan Wang ◽  
Guifu Ding ◽  
Junhong Zhao ◽  
...  

Author(s):  
Kyungjun Cho ◽  
Youngwoo Kim ◽  
Hyunsuk Lee ◽  
Jinwook Song ◽  
Junyong Park ◽  
...  

Author(s):  
K.C. Newton

Thermal effects in lens regulator systems have become a major problem with the extension of electron microscope resolution capabilities below 5 Angstrom units. Larger columns with immersion lenses and increased accelerating potentials have made solutions more difficult by increasing the power being handled. Environmental control, component choice, and wiring design provide answers, however. Figure 1 indicates with broken lines where thermal problems develop in regulator systemsExtensive environmental control is required in the sampling and reference networks. In each case, stability better than I ppm/min. is required. Components with thermal coefficients satisfactory for these applications without environmental control are either not available or priced prohibitively.


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