Excimer-laser-assisted RF glow-discharge deposition of amorphous and microcrystalline silicon thin films

1994 ◽  
Vol 58 (5) ◽  
pp. 507-512 ◽  
Author(s):  
N. Layadi ◽  
P. Roca i Cabarrocas ◽  
M. Gerri ◽  
W. Marine ◽  
J. Spousta
2003 ◽  
Vol 762 ◽  
Author(s):  
T. Allen ◽  
I. Milostnaya ◽  
D. Yeghikyan ◽  
K. Leong ◽  
F. Gaspari ◽  
...  

AbstractIn the D.C. saddle field glow discharge deposition the transition from amorphous to microcrystalline silicon thin films occurs when the silane concentration in the gas phase drops below 10%. We report here the results of Raman spectroscopy, SEM, TEM, and HRTEM studies of the film morphology. We estimate the average crystallite size to be in the range of 5 to 7 nm and the crystalline volume fraction of 25 to 35%.


1997 ◽  
Vol 467 ◽  
Author(s):  
W. Futako ◽  
K. Fukutani ◽  
I. Shimizu

ABSTRACTSilicon thin films were prepared by “Chemical Annealing” where the deposition of thin layer (<3 nm thick) by RF glow discharge of SiH4 and the treatment with hydrogen atoms (H) or triplet state of argon (3Ar) were repeated alternatating. Consequently, wide gap a-Si:H with the gap of 2.1 eV was made by H-treatmentat rather low substrate temperature (Ts<150 °C), while a-Si:H with the gap narrower than 1.6 eV was obtained by the treatment with 3Ar at high Ts (>300 °C), resulting from the release of excessive hydrogen. Both the wider or the narrower gap films exhibited low defect density lower than 1016 cm−3 and obvious improvements in the stability for light soaking.


1993 ◽  
Vol 32 (Part 1, No. 9A) ◽  
pp. 3729-3733 ◽  
Author(s):  
Ahalapitiya Hewage Jayatissa ◽  
Yoichiro Nakanishi ◽  
Yoshinori Hatanaka

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