scholarly journals Oxidation kinetics of hot-pressed silicon carbide

1976 ◽  
Vol 11 (11) ◽  
pp. 2175-2175
Author(s):  
S. C. Singhal
1998 ◽  
Vol 555 ◽  
Author(s):  
Peter A. DiFonzo ◽  
Mona Massuda ◽  
James T. Kelliher

AbstractThe stoichiometric composition and oxidation rates ( wet or dry ) of plasma enhanced chemical vapor deposited (PECVD) silicon carbide (SiC) films are effected by the deposition conditions of trimethylsilane (3MS) and carrier gas. We report the oxidation kinetics of SiC thin films deposited in a modified commercial PECVD reactor. A standard horizontal atmospheric furnace in the temperature range of 925–1100°C was used in the oxidation. Oxidized films were measured optically by commercially available interferometer and ellipsometer tools in addition to mechanically using a commercially available profilometer. Activation energies of the parabolic rates were in the range of 20.93 to 335.26 kJ/mol.


2020 ◽  
Vol 529 ◽  
pp. 151939 ◽  
Author(s):  
Hai Vu Pham ◽  
Yuji Nagae ◽  
Masaki Kurata ◽  
David Bottomley ◽  
Kenichiro Furumoto

1996 ◽  
Vol 79 (11) ◽  
pp. 2897-2911 ◽  
Author(s):  
C. Eric Ramberg ◽  
Gary Cruciani ◽  
Karl E. Spear ◽  
Richard E. Tressler ◽  
Charles F. Ramberg

2012 ◽  
Vol 120 (1401) ◽  
pp. 181-185 ◽  
Author(s):  
Bralee CHAYASOMBAT ◽  
Takeharu KATO ◽  
Tsukasa HIRAYAMA ◽  
Tomoharu TOKUNAGA ◽  
Katsuhiro SASAKI ◽  
...  

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