Thermal properties of fats and oils. II. Heat capacity and latent heat of cottonseed oil

1944 ◽  
Vol 21 (10) ◽  
pp. 297-300 ◽  
Author(s):  
G. D. Oliver ◽  
W. S. Singleton ◽  
S. S. Todd ◽  
A. E. Bailey

2021 ◽  
Vol 7 ◽  
Author(s):  
Law Torres Sevilla ◽  
Jovana Radulovic

This paper studies the influence of material thermal properties on the charging dynamics in a low temperature Thermal Energy Storage, which combines sensible and latent heat. The analysis is based on a small scale packed bed with encapsulated PCMs, numerically solved using COMSOL Multiphysics. The PCMs studied are materials constructed based on typical thermal properties (melting temperature, density, specific heat capacity (solid and liquid), thermal conductivity (solid and liquid) and the latent heat) of storage mediums in literature. The range of values are: 25–65°C for the melting temperature, 10–500 kJ/kg for the latent heat, 600–1,000 kg/m3 for the density, 0.1–0.4 W/mK (solid and liquid) for the thermal conductivity and 1,000–2,200 J/kgK (solid and liquid) for the specific heat capacity. The temperature change is monitored at three different positions along the tank. The system consists of a 2D tank with L/D ratio of 1 at a starting temperature of 20°C. Water, as the heat transfer fluid, enters the tank at 90°C. Results indicate that latent heat is a leading parameter in the performance of the system, and that the thermal properties of the PCM in liquid phase influence the overall heat absorption more than its solid counterpart.



Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3241
Author(s):  
Krzysztof Powała ◽  
Andrzej Obraniak ◽  
Dariusz Heim

The implemented new legal regulations regarding thermal comfort, the energy performance of residential buildings, and proecological requirements require the design of new building materials, the use of which will improve the thermal efficiency of newly built and renovated buildings. Therefore, many companies producing building materials strive to improve the properties of their products by reducing the weight of the materials, increasing their mechanical properties, and improving their insulating properties. Currently, there are solutions in phase-change materials (PCM) production technology, such as microencapsulation, but its application on a large scale is extremely costly. This paper presents a solution to the abovementioned problem through the creation and testing of a composite, i.e., a new mixture of gypsum, paraffin, and polymer, which can be used in the production of plasterboard. The presented solution uses a material (PCM) which improves the thermal properties of the composite by taking advantage of the phase-change phenomenon. The study analyzes the influence of polymer content in the total mass of a composite in relation to its thermal conductivity, volumetric heat capacity, and diffusivity. Based on the results contained in this article, the best solution appears to be a mixture with 0.1% polymer content. It is definitely visible in the tests which use drying, hardening time, and paraffin absorption. It differs slightly from the best result in the thermal conductivity test, while it is comparable in terms of volumetric heat capacity and differs slightly from the best result in the thermal diffusivity test.



Author(s):  
Dinesh Varshney ◽  
Dinesh Choudhary

In this paper, we develop a theoretical model for quantitative analysis of temperature-dependent heat capacity calculation of the magnetoresistance compounds RMnO 3 ( R = La , Nd ). The results on heat capacity obtained by us are in good agreement with the measured values. An effective interionic interaction potential (EIoIP) with the long-range Coulomb, van der Waals (vdW) interaction and short-range repulsive interaction up to second neighbor ions within the Hafemeister and Flygare approach was formulated to estimate the Debye and Einstein temperature and was found to be consistent with the available experimental data. In addition, the properties studied are the cohesive energy, molecular force constant, Restrahlen frequency and Gruneisen parameter. After characterizing thermal properties, a systematic investigation of elastic behavior has been undertaken and it has been found that the elastic moduli are decreasing continuously with increasing temperature.



Author(s):  
A. M. Savchenko ◽  
Yu. V. Konovalov ◽  
A. V. Laushkin

The purpose of this work is to show that during mixing, two hidden (latent) processes proceed simultaneously and compensate each other: the first initiates an increase in the average heat capacity, equal in magnitude to the entropy of mixing, which requires energy absorption to ensure a constant temperature, the second initiates simultaneous latent heat release by strengthening interatomic bonds. The passage of these two processes during mixing shows the identity of the vibrational and configurational (statistical) entropy.



Author(s):  
Yener Usul ◽  
Mustafa Özçatalbaş

Abstract Increasing demand for usage of electronics intensely in narrow enclosures necessitates accurate thermal analyses to be performed. Conduction based FEM (Finite Element Method) is a common and practical way to examine the thermal behavior of an electronic system. First step to perform a numerical analysis for any system is to set up the correct analysis model. In this paper, a method for obtaining the coefficient of thermal conductivity and specific heat capacity of a PCB which has generally a complex composite layup structure composed of conductive layers, and dielectric layers. In the study, above mentioned properties are obtained performing a simple nondestructive experiment and a numerical analysis. In the method, a small portion of PCB is sandwiched from one side at certain pressure by jaws. A couple of linear temperature profiles are applied to the jaws successively. Unknown values are tuned in the analysis model until the results of FEM analysis and experiment match. The values for the coefficient of thermal conductivity and specific heat capacity which the experiment and numerical analysis results match can be said to be the actual values. From this point on, the PCB whose thermal properties are determined can be analyzed numerically for any desired geometry and boundary condition.





1985 ◽  
Vol 38 (4) ◽  
pp. 617 ◽  
Author(s):  
JG Collins ◽  
SJ Collocott ◽  
GK White

The linear thermal expansion coefficient a from 2 to 100 K and heat capacity per gram cp from 0�3 to 30 K are reported for fully-stabilized zirconia containing a nominal 16 wt.% (9 mol.%) of yttria. The heat capacity below 7 K has been analysed into a linear (tunnelling?) term, a Schottky term centred at 1�2 K, a Debye term (e~ = 540 K), and a small T5 contribution. The expansion coefficient is roughly proportional to T from 5 to 20 K and gives a limiting lattice Griineisen parameter 'Yo ::::: 5, which agrees with that calculated from elastic data.



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