At the limit of device miniaturization

2008 ◽  
pp. 75-85
Author(s):  
Tomasz Dietl
Keyword(s):  
Device Miniaturization

scholarly journals Device miniaturization and lithography in giga-bit-era DRAMs.

1994 ◽  
Vol 7 (3) ◽  
pp. 407-416 ◽  
Author(s):  
TORU KAGA
Keyword(s):  
Device Miniaturization

scholarly journals Device Miniaturization using Butterfly Grating-Assisted MMI Couplers

2008 ◽  
Vol 19 (1) ◽  
pp. 25-30
Author(s):  
Kwang-Chun Ho
Keyword(s):  
Device Miniaturization

scholarly journals Fabrication of Polymer Nanofiber-Conducting Polymer Fabric and Noncontact Motion Sensing Platform

2018 ◽  
Vol 915 ◽  
pp. 207-212
Author(s):  
Mustafa Umut Mutlu ◽  
Osman Akin ◽  
Mustafa M. Demir ◽  
Ümit Hakan Yildiz
Keyword(s):  
Electrostatic Interactions ◽  
Conductive Polymer ◽  
Sensor Technology ◽  
Wearable Sensor ◽  
Motion Sensing ◽  
Free Standing ◽  
Sensing Platform ◽  
Sensor Platform ◽  
Polymer Nanofiber ◽  
Device Miniaturization

Conductive polymer-electrospun polymer nanofiber network was combined to host iron oxide nanoparticles providing micrometer thick sensing interface. The sensor has fabricated as free-standing fabric exhibiting 10 to 100 KOhm base resistivity upon bias applied. The moving object has been sensed through the electrostatic interactions between fibers and object. The sensing range has been found to be 1-5 cm above the surface of fabric. By the controlled combination of conductive polymers electrospun polymer nanofibers effective device miniaturization has been provided without loss of performance. The noncontact motion sensor platform has unique flexibility and light weight holding a potential for wearable sensor technology.

Quad Band Planar Inverted F Antenna for Smart Phone

2014 ◽  
Vol 573 ◽  
pp. 394-399
Author(s):  
R. Manikandan ◽  
P.K. Jawahar
Keyword(s):  
High Frequency ◽  
Smart Phone ◽  
Analysis And Design ◽  
High Frequency Structure Simulator ◽  
Low Profile ◽  
Resonance Frequencies ◽  
Theoretical Predictions ◽  
Communication Devices ◽  
Device Miniaturization ◽  
Good Agreement

In recent years, the demand for compact handheld communication devices has grown significantly. For device miniaturization antenna size is to be reduced. Micro strip and PIFA have been used for past few years. Since it has low profile geometry it can be embedded into devices. This project is to develop a Quad band small size Planar Inverted F Antenna (PIFA) for the operation in modern multi-band mobile transceiver system. Various techniques for analysis and design of such antenna investigated in this project. The design curve is used to design Quad band Planar inverted F Antenna to operate at the 900, 1800, 2100 and 3500 MHz bands. Since High Frequency Structure Simulator (HFSS) simulation result agrees well with the theoretical predictions, this project also designed through HFSS. An antenna designed at the four desired band and optimized to adjust the four resonance frequencies using HFSS simulation. The substrate FR4 (εr=4.4 & tanδ = 0.02) are in good agreement with the simulation result. Further bandwidth enhancements by making defects in the substrate at particular area were need of much reflection.

Electronic tuning of magnetic permeability in Co2Z hexaferrite toward high frequency electromagnetic device miniaturization

2011 ◽  
Vol 98 (20) ◽  
pp. 202502 ◽  
Author(s):  
Yajie Chen ◽  
Andrew Daigle ◽  
Trifon Fitchorov ◽  
Bolin Hu ◽  
Michael Geiler ◽  
...  
Keyword(s):  
Magnetic Permeability ◽  
High Frequency ◽  
Electromagnetic Device ◽  
Electronic Tuning ◽  
Device Miniaturization

scholarly journals A Study on High Voltage SiC-IGBT Device Miniaturization

2013 ◽  
Vol 26 (11) ◽  
pp. 785-789
Author(s):  
Sung-Su Kim ◽  
Sang-Mo Koo
Keyword(s):  
High Voltage ◽  
Device Miniaturization

scholarly journals Spatial Statistical Models: An Overview under the Bayesian Approach

Axioms ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 307
Author(s):  
Francisco Louzada ◽  
Diego Carvalho do Nascimento ◽  
Osafu Augustine Egbon
Keyword(s):  
Data Storage ◽  
Dependence Structure ◽  
Statistical Tool ◽  
The Past ◽  
Prior Specification ◽  
Spatial Domains ◽  
Hidden Patterns ◽  
Global And Local ◽  
Device Miniaturization ◽  
The Internet Of Things

Spatial documentation is exponentially increasing given the availability of Big Data in the Internet of Things, enabled by device miniaturization and data storage capacity. Bayesian spatial statistics is a useful statistical tool to determine the dependence structure and hidden patterns in space through prior knowledge and data likelihood. However, this class of modeling is not yet well explored when compared to adopting classification and regression in machine-learning models, in which the assumption of the spatiotemporal independence of the data is often made, that is an inexistent or very weak dependence. Thus, this systematic review aims to address the main models presented in the literature over the past 20 years, identifying the gaps and research opportunities. Elements such as random fields, spatial domains, prior specification, the covariance function, and numerical approximations are discussed. This work explores the two subclasses of spatial smoothing: global and local.

scholarly journals Scaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper

2020 ◽  
Vol 8 (1) ◽  
Author(s):  
Bin Zhang ◽  
W. J. Meng
Keyword(s):  
Grain Size ◽  
Flow Stress ◽  
Metal Forming ◽  
Mechanical Response ◽  
Extrusion Process ◽  
Increasing Demand ◽  
First Time ◽  
Device Miniaturization ◽  
Scaling Anomaly ◽  
Microstructural Examination

Abstract The continuing trend of device miniaturization brings increasing demand for small metal parts and, consequently, significant interest in microscale metal forming technologies. In this work, the influence of grain size on mechanical response in microscale axisymmetric reverse extrusion of Cu 110 alloy was investigated in detail. A characteristic plastic strain associated with material deformation in the extrusion process was, for the first time to the best of our knowledge, defined, measured, and used to evaluate the material's bulk flow stress at this corresponding strain. This flow stress was then used to scale measured mechanical response in reverse extrusion and help identify deviations from scaling behavior expected in continuum plasticity. A scaling anomaly was indeed observed, indicating a dependence of mechanical response on both the initial grain size and the characteristic dimension of microforming operations. Detailed microstructural examination of grains in extruded Cu parts was conducted, and points to directions for future study to better understand mechanisms behind the observed scaling anomaly.

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