Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength
2013 ◽
Vol 745-746
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pp. 582-586
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Keyword(s):
2014 ◽
Vol 989-994
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pp. 177-180
Keyword(s):
2011 ◽
Vol 492
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pp. 61-65
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