Dielectric, mechanical and thermal properties of novel core–shell CuPc@MWCNTs/PEN composite films

2013 ◽  
Vol 25 (2) ◽  
pp. 1089-1096 ◽  
Author(s):  
Ya Long ◽  
Xiaobo Liu
2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Chaitra Venkatesh ◽  
Yuanyuan Chen ◽  
Zhi Cao ◽  
Shane Brennan ◽  
Ian Major ◽  
...  

Abstract Poly (lactic acid)/halloysite nanotube (PLA/HNT) nanocomposites have been studied extensively over the past few years owing to the interesting properties of the polymer, PLA, and the nanoclay, HNT, individually and as composites. In this paper, the influence of the screw speed during extrusion was investigated and was found to have a significant impact on the mechanical and thermal performance of the extruded PLA/HNT nanocomposites. To determine the effect of screw speed on PLA/HNT nanocomposites, 5 and 10 wt% of HNTs were blended into the PLA matrix through compounding at screw speeds of 40, 80, and 140 rpm. Virgin PLA was compounded for comparison. The resultant polymer melt was quench cooled onto a calendar system to produce composite films which were assessed for mechanical, thermal, chemical, and surface properties. Results illustrate that in comparison to 40 and 80 rpm, the virgin PLA when compounded at 140 rpm, indicated a significant increase in the mechanical properties. The PLA/HNT 5 wt% nanocomposite compounded at 140 rpm showed significant improvement in the dispersion of HNTs in the PLA matrix which in turn enhanced the mechanical and thermal properties. This can be attributed to the increased melt shear at higher screw speeds.


RSC Advances ◽  
2016 ◽  
Vol 6 (95) ◽  
pp. 92596-92604 ◽  
Author(s):  
Shadpour Mallakpour ◽  
Marzieh Adnany Sadaty

In the present investigation, TiO2 nanoparticles (NPs) were used for improving the thermal, mechanical and optical properties of poly(vinyl chloride) (PVC) matrix.


e-Polymers ◽  
2020 ◽  
Vol 20 (1) ◽  
pp. 226-232 ◽  
Author(s):  
Peng Li ◽  
Jiajun Yu ◽  
Shaohua Jiang ◽  
Hong Fang ◽  
Kunming Liu ◽  
...  

AbstractAll-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.


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