Experimental investigation of the particle size effect on heat transfer coefficient of Al2O3 nanofluid in a cylindrical microchannel heat sink

2019 ◽  
Vol 141 (2) ◽  
pp. 957-967 ◽  
Author(s):  
A. Heidarshenas ◽  
Z. Azizi ◽  
S. M. Peyghambarzadeh ◽  
S. Sayyahi
2019 ◽  
Vol 146 ◽  
pp. 346-355 ◽  
Author(s):  
Sedong Kim ◽  
Baasandulam Tserengombo ◽  
Soon-Ho Choi ◽  
Jungpil Noh ◽  
Sunchul Huh ◽  
...  

Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.


Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.


Author(s):  
Florentina Simionescu ◽  
Daniel K. Harris

Cooling of electronic devices requires the use of heat spreaders whose function is to allow the spreading of the heat flux lines in the 3-D space and to increase the exchange area with the coolant. The objective of this analysis is to estimate the convective heat transfer coefficient of a microchannel heat sink that corresponds to a maximum amount of heat removed from heat source placed on the top surface of the sink. This problem is solved using an optimal control technique in which we control the solution of the heat equation with the convective boundary condition, taking the heat transfer coefficient as the control. A conjugate gradient method is used to solve the optimal control problem. The results show that the temperature distributions corresponding to the controlled solution are lower than those corresponding to the uncontrolled solution. This study can provide guidance in designing micro heat pipe sinks, which have emerged as an effective technique for cooling electronic components.


Author(s):  
Y. Wang ◽  
S. J. Chung ◽  
J. P. Leonard ◽  
S. K. Cho ◽  
T. Phuoc ◽  
...  

This paper describes an experimental study on microchannel heat sink performance where ZnO nanoparticle suspended fluids are used as coolant. The microchannel heat sink has 65 parallel microchannels branched out from an inlet reservoir and then collected into an outlet reservoir. Its fabrication process is based on the standard photolithographic microfabrication technology. A main feature of the heat sink has an array of on-chip temperature sensors on the channel bottom surface along the channel. Thus, the channel wall temperatures are directly measured. Heat transfer coefficient for the nanofluid is measured and compared with that of DI water as reference. The experiments show that the heat transfer coefficient of the ZnO nanofluid is 13% higher than that of the base fluid at the Reynolds number of 3.8, although it is comparable with that of DI water at lower Re numbers. The experiments also show that the heat transfer coefficient as well as the Nusselt number increases as the Reynolds number increases.


2018 ◽  
Vol 24 (7) ◽  
pp. 19
Author(s):  
Maha Ali Hussein

An experimental investigation has been made to study the influence of using v-corrugated aluminum fin on heat transfer coefficient and heat dissipation in a heat sink. The geometry of fin is changed to investigate their performance. 27 circular perforations with 1 cm diameter were made. The holes designed into two ways, inline arrangement and staggered in the corrugated edges arrangement. The experiments were done in enclosure space under natural convection. Three different voltages supplied to the heat sink to study their effects on the fins performance. All the studied cases are compared with v-corrugated smooth solid fin. Each experiment was repeated two times to reduce the error and the data recorded after reaching the steady state conditions. The results showed that the v-corrugated fin dissipate heat twice and triple times than flat plate mentioned in past research with the same dimension. Also, the inline perforated fin gave higher enhancement percentage than solid one by 15, 32 and 36% for 110, 150 and 200 V voltages supplied. Finally, the staggered perforation arrangement gave the higher enhancement percentage with 22, 42 and 45% for the same voltages supply.  


Sign in / Sign up

Export Citation Format

Share Document