Study on failure mechanism of a plain irrigation reservoir soil bank slope under wind wave erosion

2021 ◽  
Author(s):  
Zipeng Qin ◽  
Yuanming Lai ◽  
Yan Tian
2018 ◽  
Vol 61 (5) ◽  
pp. 1677-1689
Author(s):  
Yavuz Ozeren ◽  
Daniel G. Wren ◽  
Hakan Yasarer

Abstract. On-farm irrigation reservoirs, together with tailwater recovery systems, are commonly used to store water in the Mississippi River Valley alluvial floodplain to supplement limited groundwater resources. The inner slopes of the earthen embankments that enclose these reservoirs are subjected to continuous erosion due to wind-generated waves. Various methods have been used to protect the embankments, but none of them have been shown to be both sustainable and cost-effective. In an effort to assess levee protection strategies, a range of treatment techniques, including levee configurations and surface treatments, were applied on the embankments of the University of Arkansas Pine Bluff (UAPB) Lonoke Demonstration Reservoir in 2007. The treatment techniques included 17 different slope configurations along the east and west embankments and five chemical and mechanical treatments along the north and south embankments. Embankment erosion was measured by comparing new surveys conducted in 2015 and 2017 with as-built information provided by the USDA Natural Resources Conservation Service (NRCS). The change in levee profile between the surveys and the as-built profiles was used to quantify the effectiveness of the treatment methods for protection against wave action. An artificial neural network (ANN) prediction model was developed to establish relationships between erosion parameters (eroded area and maximum retreat) and four independent variables (existence of berm, face slope, maximum effective fetch, and probability of wind speed). Data from 27 sections were used for training, and data from seven sections were used for testing. Almost all of the slope treatments were significantly eroded over the eight to ten years that elapsed between construction and the surveys. Although having a berm did not significantly reduce the total eroded volume, in most cases it delayed the bank retreat. For any two identical slope configurations, the one with the longest fetch typically had at least slightly higher erosion and retreat. In general, milder slopes performed better than steeper slopes. The survey results showed that geo-synthetic fabric, fly ash, and soil cement were more effective at reducing wave erosion than the other treatment methods. Keywords: Embankment erosion, Irrigation reservoir, Levee erosion, Wave erosion.


2021 ◽  
Author(s):  
Chenyang Ma ◽  
Li Wu ◽  
Miao Sun ◽  
Dexing Lei

Abstract Underwater drilling blasting technique is often adopted to clear away the obstructed reef and dredge-cut in the mountainous waterway dredging engineering. However, the vibration of the underwater blasting and excavation of the riverbed has a certain influence on the stability of bank slopes. Combined with the partial bank collapse phenomenon in the waterway regulation project between two dams in the Three Gorges reservoir area, the change of pore water pressure of unsaturated soil under heavy rainfall and the increase of permanent displacement of soil under blasting vibration in the reservoir area are discussed. This paper explains the weakening effect of rainfall infiltration and blasting vibration on the stability of the bank slope. By studying the law of slope failure deformation under the separate action and coupling action, it is found that rainfall infiltration promotes the increase of slope permanent displacement and the blasting vibration enlarges the infiltration area of the soil, which demonstrated the accelerated failure mechanism of the rainfall-blasting slope.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2008 ◽  
Vol 11 (-1) ◽  
pp. 188-201 ◽  
Author(s):  
Piotr Bogacz ◽  
Jarosława Kaczmarek ◽  
Danuta Leśniewska

Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


Author(s):  
Sarven Ipek ◽  
David Grosjean

Abstract The application of an individual failure analysis technique rarely provides the failure mechanism. More typically, the results of numerous techniques need to be combined and considered to locate and verify the correct failure mechanism. This paper describes a particular case in which different microscopy techniques (photon emission, laser signal injection, and current imaging) gave clues to the problem, which then needed to be combined with manual probing and a thorough understanding of the circuit to locate the defect. By combining probing of that circuit block with the mapping and emission results, the authors were able to understand the photon emission spots and the laser signal injection microscopy (LSIM) signatures to be effects of the defect. It also helped them narrow down the search for the defect so that LSIM on a small part of the circuit could lead to the actual defect.


Author(s):  
John Butchko ◽  
Bruce T. Gillette

Abstract Autoclave Stress failures were encountered at the 96 hour read during transistor reliability testing. A unique metal corrosion mechanism was found during the failure analysis, which was creating a contamination path to the drain source junction, resulting in high Idss and Igss leakage. The Al(Si) top metal was oxidizing along the grain boundaries at a faster rate than at the surface. There was subsurface blistering of the Al(Si), along with the grain boundary corrosion. This blistering was creating a contamination path from the package to the Si surface. Several variations in the metal stack were evaluated to better understand the cause of the failures and to provide a process solution. The prevention of intergranular metal corrosion and subsurface blistering during autoclave testing required a materials change from Al(Si) to Al(Si)(Cu). This change resulted in a reduced corrosion rate and consequently prevented Si contamination due to blistering. The process change resulted in a successful pass through the autoclave testing.


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