A Study and Review on Frequency Band Notch Characteristics in Reconfigurable MIMO-UWB Antennas

Author(s):  
Vanka Saritha ◽  
C. Chandrasekhar
Keyword(s):  
2021 ◽  
pp. 52-59
Author(s):  
K. S Chakradhar ◽  
◽  
V. Malleswara Rao

From this current paper, 3 separate elliptical slotted ultra- wide band (UWB) antennas are being proposed. These antennas have been designed with a standard PCB design process to be capable of integrating with radiofrequency or microwave circuitry. Two designs were presented in which the initial design comprised a half circular ring radiator and the remaining one considers a half elliptical ring radiator. The third design of the radiator is in the shape of a crescent. The impedance bandwidth of all these presented antenna designs varies from 2.5GHz and reaches to 14GHz with a S11 less than -10GHz. Here, every proposed antenna design also has a consistent radiation pattern across its frequency band of interest. The performance of the antenna is impressive for lower band frequency in UWB system, which differs in a range of 3.1GHz to 5.1GHz. Across the whole frequency band the antenna shows a 10db return loss bandwidth. The antenna is fabricated on RT-duroid substrate and fed with 50 Ω coupled tappered transmission line.


2020 ◽  
Vol E103.C (11) ◽  
pp. 588-596
Author(s):  
Masamune NOMURA ◽  
Yuki NAKAMURA ◽  
Hiroo TARAO ◽  
Amane TAKEI

2014 ◽  
Vol 73 (11) ◽  
pp. 993-1003 ◽  
Author(s):  
R. V. Golovashchenko ◽  
V. N. Derkach ◽  
M. K. Zaetz ◽  
V. G. Korzh ◽  
A. S. Plevako ◽  
...  
Keyword(s):  

2008 ◽  
Vol 67 (13) ◽  
pp. 1207-1215 ◽  
Author(s):  
V. K. Kiselyov ◽  
M. S. Yanovsky ◽  
V. I. Bezborodov ◽  
Ye. M. Kuleshov

Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


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