Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer
2016 ◽
Vol 47
(9)
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pp. 4767-4776
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2016 ◽
Vol 63
(12)
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pp. 5060-5063
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2021 ◽
Vol 29
(6)
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pp. 630-637
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