Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

2005 ◽  
Vol 34 (8) ◽  
pp. 1165-1171 ◽  
Author(s):  
M. J. Yim ◽  
H -J. Kim ◽  
K. -W. Paik
Keyword(s):  
Thermal Conductivity ◽  
Flip Chip ◽  
Conductive Adhesives ◽  
Enhanced Thermal Conductivity

scholarly journals Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Polymers ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 147
Author(s):  
William Anderson Lee Sanchez ◽  
Chen-Yang Huang ◽  
Jian-Xun Chen ◽  
Yu-Chian Soong ◽  
Ying-Nan Chan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Decomposition Temperature ◽  
Infrared Images ◽  
Hybrid Filler ◽  
Thermal Infrared Images ◽  
The Impact ◽  
Enhanced Thermal Conductivity

In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

scholarly journals Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 31575-31580
Author(s):  
Kaiyi Tian ◽  
Senyuan Yang ◽  
Jiaxuan Niu ◽  
Hanxiang Wang
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Enhanced Thermal Conductivity
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