Enhanced Thermal Conductivity of the Underfill Materials Using Insulated Core/shell Filler Particles for High Performance Flip Chip Applications

2017 ◽  
Author(s):  
Tae-Ryong Kim ◽  
Kisu Joo ◽  
Boo Taek Lim ◽  
Sung-Soon Choi ◽  
Boung Ju Lee ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Flip Chip ◽  
Core Shell ◽  
Filler Particles ◽  
Enhanced Thermal Conductivity

scholarly journals Decoupling electron and phonon transport in single-nanowire hybrid materials for high-performance thermoelectrics

2021 ◽  
Vol 7 (20) ◽  
pp. eabe6000
Author(s):  
Lin Yang ◽  
Madeleine P. Gordon ◽  
Akanksha K. Menon ◽  
Alexandra Bruefach ◽  
Kyle Haas ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Transport ◽  
Electrical Transport ◽  
High Performance ◽  
Figure Of Merit ◽  
Phonon Transport ◽  
Core Shell ◽  
Nanowire Diameter ◽  
High Performing ◽  
Polycrystalline Thin Films

Organic-inorganic hybrids have recently emerged as a class of high-performing thermoelectric materials that are lightweight and mechanically flexible. However, the fundamental electrical and thermal transport in these materials has remained elusive due to the heterogeneity of bulk, polycrystalline, thin films reported thus far. Here, we systematically investigate a model hybrid comprising a single core/shell nanowire of Te-PEDOT:PSS. We show that as the nanowire diameter is reduced, the electrical conductivity increases and the thermal conductivity decreases, while the Seebeck coefficient remains nearly constant—this collectively results in a figure of merit, ZT, of 0.54 at 400 K. The origin of the decoupling of charge and heat transport lies in the fact that electrical transport occurs through the organic shell, while thermal transport is driven by the inorganic core. This study establishes design principles for high-performing thermoelectrics that leverage the unique interactions occurring at the interfaces of hybrid nanowires.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

scholarly journals Vertically Aligned and Interconnected Graphite and Graphene Oxide Networks Leading to Enhanced Thermal Conductivity of Polymer Composites

Polymers ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 1121 ◽  
Author(s):  
Ziming Wang ◽  
Yiyang Cao ◽  
Decai Pan ◽  
Sen Hu
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
High Performance ◽  
Three Dimensional ◽  
Freezing Temperature ◽  
Thermal Interface Materials ◽  
Vertically Aligned ◽  
Conductive Property ◽  
Efficient Heat Transfer ◽  
Enhanced Thermal Conductivity

Natural graphite flakes possess high theoretical thermal conductivity and can notably enhance the thermal conductive property of polymeric composites. Currently, because of weak interaction between graphite flakes, it is hard to construct a three-dimensional graphite network to achieve efficient heat transfer channels. In this study, vertically aligned and interconnected graphite skeletons were prepared with graphene oxide serving as bridge and support via freeze-casting method. Three freezing temperatures were utilized, and the resulting graphite and graphene oxide network was filled in a polymeric matrix. Benefiting from the ultralow freezing temperature of −196 °C, the network and its composite occupied a more uniform and denser structure, which lead to enhanced thermal conductivity (2.15 W m−1 K−1) with high enhancement efficiency and prominent mechanical properties. It can be significantly attributed to the well oriented graphite and graphene oxide bridges between graphite flakes. This simple and effective strategy may bring opportunities to develop high-performance thermal interface materials with great potential.

Flexible and enhanced thermal conductivity of a Al2O3@polyimide hybrid film via coaxial electrospinning

RSC Advances ◽  
2015 ◽  
Vol 5 (25) ◽  
pp. 19315-19320 ◽  
Author(s):  
Jianwen Xia ◽  
Guoping Zhang ◽  
Libo Deng ◽  
Haipeng Yang ◽  
Rong Sun ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Hybrid Film ◽  
Coaxial Electrospinning ◽  
Core Shell ◽  
Enhanced Thermal Conductivity

A core–shell Al2O3@PI fiber was prepared by coaxial electrospinning, which showed excellent properties of flexibility and in plane thermal conductivity.

AIN LGAs for High Performance Packaging Applications

1997 ◽  
Vol 14 (3) ◽  
pp. 5-7 ◽  
Author(s):  
N. Iwase ◽  
J. Ewanich
Keyword(s):  
Thermal Conductivity ◽  
Stress Reduction ◽  
High Performance ◽  
Flip Chip ◽  
Ground Plane ◽  
Aluminium Nitride ◽  
Thermal Coefficient ◽  
Switching Noise ◽  
High Fracture ◽  
Simultaneous Switching

Because they offer many properties favourable for IC package construction, ceramics have been in widespread use as an electronic package material since the early 1960s. In recent years, with trends towards higher speed semiconductors generating up to 30‐40 watts power, packaging materials must possess excellent thermal, electrical and mechanical properties. Aluminium nitride, with a thermal conductivity of 170 W/m.K., high fracture strength and a thermal coefficient of expansion match with silicon, has been used to manufacture multilayer LGA (land grid array) packages for high performance applications. A 725 AIN LGA has been manufactured and its performance characteristics have been compared with those of an alumina (with copper/tungsten slug) packaging alternative. Because of the high thermal conductivity of aluminium nitride, all designs can be made in a cavity‐up configuration, resulting in significant package body size reduction. The area under the cavity can be used for increasing I/O number and a ground plane can be inserted under the cavity, reducing simultaneous switching noise. Aluminium nitride is particularly beneficial for flip‐chip interconnection. Its close TCE match to silicon eliminates the stress reduction requirement for die underfill.

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