Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

2014 ◽  
Vol 43 (7) ◽  
pp. 2467-2478 ◽  
Author(s):  
Hongjun Ji ◽  
Qiang Wang ◽  
Mingyu Li ◽  
Chunqing Wang
2020 ◽  
Vol 12 (40) ◽  
pp. 44926-44933
Author(s):  
Pavan Pujar ◽  
Kishor Kumar Madaravalli Jagadeeshkumar ◽  
Muhammad Naqi ◽  
Srinivas Gandla ◽  
Hae Won Cho ◽  
...  

Heliyon ◽  
2020 ◽  
Vol 6 (7) ◽  
pp. e04410
Author(s):  
Maria Victoria Traffano-Schiffo ◽  
Tatiana Rocio Aguirre Calvo ◽  
María Victoria Avanza ◽  
Patricio R. Santagapita

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