Improvement of cross-machine directional thickness deviation for uniform pressure-sensitive adhesive layer in roll-to-roll slot-die coating process

2015 ◽  
Vol 16 (5) ◽  
pp. 937-943 ◽  
Author(s):  
Janghoon Park ◽  
Keehyun Shin ◽  
Changwoo Lee
Keyword(s):  
Adhesive Layer ◽  
Coating Process ◽  
Uniform Pressure ◽  
Pressure Sensitive Adhesive ◽  
Slot Die Coating ◽  
Roll To Roll ◽  
Pressure Sensitive ◽  
Slot Die ◽  
Thickness Deviation

scholarly journals Mechanics of an adhesive tape in a zero degree peel test: effect of large deformation and material nonlinearity

Soft Matter ◽  
2018 ◽  
Vol 14 (47) ◽  
pp. 9681-9692 ◽  
Author(s):  
Chung-Yuen Hui ◽  
Zezhou Liu ◽  
Helen Minsky ◽  
Costantino Creton ◽  
Matteo Ciccotti
Keyword(s):  
Large Deformation ◽  
Peel Test ◽  
Adhesive Layer ◽  
Material Nonlinearity ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Zero Degree ◽  
The Common ◽  
Backing Layer

The common pressure sensitive adhesive (PSA) tape is a composite consisting of a stiff backing layer and a soft adhesive layer.

A one-step roll-to-roll process of stable AgNW/PEDOT:PSS solution using imidazole as a mild base for highly conductive and transparent films: optimizations and mechanisms

2015 ◽  
Vol 3 (22) ◽  
pp. 5859-5868 ◽  
Author(s):  
Seyul Kim ◽  
So Yeon Kim ◽  
Moon Hyun Chung ◽  
Jeonghun Kim ◽  
Jung Hyun Kim
Keyword(s):  
Optical Properties ◽  
Electrical And Optical Properties ◽  
Transparent Films ◽  
Slot Die Coating ◽  
Roll To Roll ◽  
Transparent Conducting ◽  
Slot Die ◽  
Coating Method ◽  
One Step

An AgNW/PEDOT:PSS coated, transparent, conducting, roll film (460 mm in width × 20 m in length) with good electrical and optical properties was produced using the roll-to-roll slot-die coating method.

scholarly journals Transmittance Control of a Water-Repellent-Coated Layer on a Tensioned Web in a Roll-to-Roll Slot-Die Coating System

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4003
Author(s):  
Seongyong Kim ◽  
Minho Jo ◽  
Jongsu Lee ◽  
Changwoo Lee
Keyword(s):  
Contact Angle ◽  
Solar Cells ◽  
Control Method ◽  
Dominant Factor ◽  
Water Repellent ◽  
Process Conditions ◽  
Slot Die Coating ◽  
Roll To Roll ◽  
Slot Die ◽  
Transparent Water

Solar cells are important alternatives to fossil fuels for energy generation in today’s world, where the demand for alternative, renewable sources of energy is increasing. However, solar cells, which are installed outdoors, are susceptible to pollution by environmental factors. A solution to overcome this limitation involves coating solar cell surfaces with functional coatings. In this study, we propose a transmittance control method for a tensioned web in a roll-to-roll, transparent, water-repellent film coating. First, we analyzed the effects of process conditions on the transmittance and contact angle of the transparent water-repellent film during roll-to-roll slot-die coating. It was confirmed that the tension was the most dominant factor, followed by the coating gap. Through the tension control, the transmittance was changed by 3.27%, and the contact angle of the DI water was changed by 17.7°. In addition, it was confirmed that the transmittance was changed by 0.8% and the contact angle of DI water by 3.9° via the coating gap control. Based on these results, a transmittance prediction model was developed according to the tension and coating gap, and was then verified experimentally. Finally, a water-repellent film with a high transmittance of 89.77% was obtained using this model.

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

2017 ◽  
Author(s):  
Naoya Saiki ◽  
Yuichiro Komasu ◽  
Kazuto Aizawa ◽  
Jun Maeda
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
Adhesive Layer ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Element Analysis ◽  
Uv Curable ◽  
Pressure Sensitive ◽  
Peeling Process

In this study, the peeling process of UV-curable pressure sensitive adhesive tape from bump wafer is investigated through the use of finite element analysis, observation of high speed video, and actual wafer back-grinding process testing. In our experiment, a large deformation of adhesive is observed at the edge of bottom of bump, appearing on the side of the bump opposite tape-peeling direction when observed with high speed microscope video. The largely deformed adhesive creates a string shaped elongation. The adhesive residue is caused by the fracture of the adhesive string. We investigated how to generate the adhesive string in the tape-peeling process through the use of finite element analysis. In this analysis, a cohesive element is introduced into the adhesive layer. The analytical result shows the adhesive string at the same position of experiment and the stress distribution is different between the string part and the other area of adhesive. The influence of peeling angle and bump size is also investigated by the same finite element model. As a result, higher peeling angle and smaller bump sizes shows a shorter adhesive string, which lowers the risk of adhesive residue.

Sign in / Sign up

Export Citation Format

Share Document