Preparation and study on thermal conductive composites of chlorinated polyethylene rubber reinforced by boron nitride particles

2016 ◽  
Vol 24 (7) ◽  
pp. 640-644 ◽  
Author(s):  
Junjie Shu ◽  
Ru Xia ◽  
Jiasheng Qian ◽  
Jibin Miao ◽  
Lifen Su ◽  
...  
RSC Advances ◽  
2017 ◽  
Vol 7 (69) ◽  
pp. 43380-43389 ◽  
Author(s):  
Feng Yuan ◽  
Weicheng Jiao ◽  
Fan Yang ◽  
Wenbo Liu ◽  
Zhonghai Xu ◽  
...  

The highly ordered thermoplastic polyurethane elastomer (TPU)/BNNSs composites are successfully prepared by the combination of filler modification and magnetic alignment.


Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2028
Author(s):  
Li-Hua Zhao ◽  
Yun Liao ◽  
Li-Chuan Jia ◽  
Zhong Wang ◽  
Xiao-Long Huang ◽  
...  

The development of highly thermally conductive composites with excellent electrical insulation has attracted extensive attention, which is of great significance to solve the increasingly severe heat concentration issue of electronic equipment. Herein, we report a new strategy to prepare boron nitride nanosheets (BNNSs) via an ion-assisted liquid-phase exfoliation method. Then, silver nanoparticle (AgNP) modified BNNS (BNNS@Ag) was obtained by in situ reduction properties. The exfoliation yield of BNNS was approximately 50% via the ion-assisted liquid-phase exfoliation method. Subsequently, aramid nanofiber (ANF)/BNNS@Ag composites were prepared by vacuum filtration. Owing to the “brick-and-mortar” structure formed inside the composite and the adhesion of AgNP, the interfacial thermal resistance was effectively reduced. Therefore, the in-plane thermal conductivity of ANF/BNNS@Ag composites was as high as 11.51 W m−1 K−1, which was 233.27% higher than that of pure ANF (3.45 W m−1 K−1). The addition of BNNS@Ag maintained tensile properties (tensile strength of 129.14 MPa). Moreover, the ANF/BNNS@Ag films also had good dielectric properties and the dielectric constant was below 2.5 (103 Hz). Hence, the ANF/BNNS@Ag composite shows excellent thermal management performance, and the electrical insulation and mechanical properties of the matrix are retained, indicating its potential application prospects in high pressure and high temperature application environments.


Polymer Korea ◽  
2018 ◽  
Vol 42 (2) ◽  
pp. 230-241 ◽  
Author(s):  
Ru Xia ◽  
Manman Sun ◽  
Bin Yang ◽  
Jiasheng Qian ◽  
Peng Chen ◽  
...  

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1628 ◽  
Author(s):  
Seokgyu Ryu ◽  
Hyunwoo Oh ◽  
Jooheon Kim

In this study, we describe the fabrication of thermally conductive composites based on a polyphthalamide (PPA) matrix by the exfoliation of hexagonal BN nanosheets (BNNs) via the melt-mixing method. Boron nitride (BN) particles were hydroxyl groups surface-treated with sodium hydroxide (NaOH). Compared with existing BN peeling experiments, we successfully produced BNNs that are simpler, more economical, and have an excellent aspect ratio. For the same weight content of BN and BNNs, PPA/BN composites surface-treated with high aspect ratio BNNs have a high in-plane and through-plane thermal conductivity because of the intercalation of the hydroxyl group surface treatments between BN and PPA, which not only increases the wettability but also provides a good heat transfer path. Moreover, wide and thin BNNs are evenly dispersed inside the PPA/BN composite to provide excellent heat transfer paths in both in-plane and through-plane directions.


2011 ◽  
Vol 391-392 ◽  
pp. 282-286 ◽  
Author(s):  
Jun Peng Li ◽  
Shu Hua Qi ◽  
Fan Xie

A new kind of thermally conductive composites reinforced by glass fibers with boron nitride (BN) as thermally conductive filler was prepared in heat press molding. Thermal conductivity of the composites was found to increase with increasing in filler content. But impact strength and flexural strength reach the top point, 385.05KJ/m2 and 912.6481MPa, with content of 50wt% and 20wt% respectively. The thermal conductivity of 0.8385 W/mK was obtained at 50wt% filler content. Experimental dates show that mixed matrix of epoxy (EP) and polyimide (PI) displays high thermal stability and can improve thermal stability compared to pure epoxy obviously at 50wt% PI content. Additionally, the obtained composites possess high surface resistivity and volume resistivity, which are suitable for substrate materials.


RSC Advances ◽  
2018 ◽  
Vol 8 (39) ◽  
pp. 21948-21967 ◽  
Author(s):  
Cuiping Yu ◽  
Jun Zhang ◽  
Wei Tian ◽  
Xiaodong Fan ◽  
Yagang Yao

This review covers the fabrication of h-BN and its application for thermally conductive networks.


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