Thermal stability, adsorption and rheological behaviors of sulfonated polyacrylamide/chromium triacetate/laponite nanocomposite weak gels

Soybean oil is beneficial to improve the compatibility between polylactide (PLA) and succinylated lignin (SAL), which leads to the preparation of a host of biobased composites containing PLA, SAL, and epoxidized soybean oil (ESO). The introduction of SAL and ESO enables the relatively homogeneous morphology and slightly better miscibility obtained from triply PLA/SAL/ESO composites after dynamic vulcanization compared with unmodified PLA. The rigidity of the composites is found to decline gradually due to the addition of flexible molecular chains. According to the reaction between SAL and ESO, the Tg of PLA/SAL/ESO composites is susceptible to the movement of flexible molecular chains. The rheological behaviors of PLA/SAL/ESO under different conditions, i.e., temperature and frequency, exhibit a competition between viscidity and elasticity. The thermal stability of the composites displays a slight decrease due to the degradation of SAL and then the deterioration of ESO. The elongation at break and notched impact strength of the composites with augmentation of ESO increase by 12% and 0.5 kJ/m2, respectively. The triply biobased PLA/SAL/ESO composite is thus deemed as a bio-renewable and environmentally friendly product that may find vast applications.

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Effects of Light-Activated Self-Healing Polymers on the Rheological Behaviors of Asphalt Binder Containing Recycled Asphalt Shingles

Transportation Research Record Journal of the Transportation Research Board ◽

10.1177/0361198118772726 ◽

2018 ◽

Vol 2672 (28) ◽

pp. 301-310 ◽

Cited By ~ 4

Author(s):

Sharareh Shirzad ◽

Marwa M. Hassan ◽

Max A. Aguirre ◽

Samuel Cooper ◽

Ioan I. Negulescu

Keyword(s):

Thermal Stability ◽

Uv Light ◽

Elastic Recovery ◽

Asphalt Binder ◽

Self Healing ◽

Recycled Asphalt ◽

Rheological Behaviors ◽

Recycled Asphalt Shingles ◽

New Generation ◽

Asphalt Shingles

A new generation of ultraviolet (UV) light-activated, self-healing polymers was evaluated with the aim to enhance the elastic recovery of the binder and to increase its self-healing abilities. This study had three main objectives: (a) to develop an optimized synthesis procedure for producing light-activated self-healing polymers, (b) to examine the thermal stability of the prepared self-healing polymers, and (c) to evaluate the effect of self-healing polymers on the rheological properties of asphalt binder containing binder extracted from recycled asphalt shingles (RAS). Fourier transform infrared (FT-IR) spectroscopy analysis confirmed the successful synthesis of UV-activated polymers in the laboratory. In addition, thermogravimetric analysis showed that the materials produced achieved the required thermal stability at high temperature. Measuring the viscosity of different binder blends with and without RAS and with and without self-healing polymers revealed that the additive decreased the viscosity of the binder blends containing RAS, thereby providing blends with a better workability. Furthermore, rheological results showed that the rutting resistance of the binder blends containing RAS was improved by increasing the percentage of self-healing polymer. Results also showed improved rheological behaviors at low service temperature with 5% self-healing polymer and with exposure to UV light.

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Study on PLA/PA11 Bio-Based Toughening Melt-Blown Nonwovens

Autex Research Journal ◽

10.2478/aut-2019-0002 ◽

2020 ◽

Vol 20 (1) ◽

pp. 24-31 ◽

Cited By ~ 2

Author(s):

Feichao Zhu ◽

Bin Yu ◽

Juanjuan Su ◽

Jian Han

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Average Diameter ◽

Poly Lactic Acid ◽

Mechanical And Thermal Properties ◽

Polyamide 11 ◽

Rheological Behaviors ◽

Dispersed Phases ◽

Thermal Stability Of ◽

Morphology And Mechanical Properties

AbstractWith aim to improve the mechanical and thermal properties of poly (lactic acid) (PLA) melt-blown nonwovens (MBs), polyamide 11 (PA11) was melt blended with PLA at the weight proportions of PLA/PA11 (95/5, 90/10, 85/15, 80/20), and the corresponding PLA/PA11 MBs were also manufactured. The crystallization, thermal and rheological behaviors of PLA/PA11 blends were investigated. PLA/PA11 MBs were also characterized by morphology and mechanical properties. The results indicated that PA11, as globular dispersed phases, formed confined crystals and could improve the thermal stability of PLA matrix. The viscosity of PLA/PA11 blends was slightly increased but the rheological behaviors of “shear-thinning” kept unchanged in comparison with PLA. The average diameter of PLA/PA11 MB fibers was slightly increased, whereas the toughness of PLA/PA11 MBs including the strength and elongation were efficiently enhanced compared with those of PLA MBs.

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Thermal Stability and Rheological Behaviors of High-Density Polyethylene/Fullerene Nanocomposites

Journal of Nanomaterials ◽

10.1155/2012/340962 ◽

2012 ◽

Vol 2012 ◽

pp. 1-6 ◽

Cited By ~ 5

Author(s):

Liping Zhao ◽

Ping'an Song ◽

Zhenhu Cao ◽

Zhengping Fang ◽

Zhenghong Guo

Keyword(s):

Thermal Stability ◽

High Density Polyethylene ◽

High Density ◽

Rheological Behaviors

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The Ordered Phase Formation in Ti-Al-Ga Alloys

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100069193 ◽

1970 ◽

Vol 28 ◽

pp. 440-441

Author(s):

Shiro Fujishiro ◽

Harold L. Gegel

Keyword(s):

Thermal Stability ◽

High Temperature ◽

Titanium Alloys ◽

Growth Kinetics ◽

Stoichiometric Composition ◽

Good Potential ◽

Alpha Titanium ◽

Cold Rolled ◽

Kinetics Of ◽

Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

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Microstructure studies of tungsten silicide schottky contacts on Gaas

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100126445 ◽

1987 ◽

Vol 45 ◽

pp. 328-329

Author(s):

Yih-Cheng Shih ◽

E. L. Wilkie

Keyword(s):

Thermal Stability ◽

Field Effect Transistors ◽

Schottky Contact ◽

Schottky Contacts ◽

Excellent Thermal Stability ◽

Barrier Heights ◽

Gaas Substrates ◽

Film Adhesion ◽

Threshold Voltages ◽

Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

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Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100138634 ◽

1995 ◽

Vol 53 ◽

pp. 452-453

Author(s):

J. Liu ◽

N. D. Theodore ◽

D. Adams ◽

S. Russell ◽

T. L. Alford ◽

...

Keyword(s):

Thermal Stability ◽

Titanium Nitride ◽

Large Scale ◽

Standard Procedure ◽

Alloy Film ◽

Electron Beam Evaporation ◽

Copper Metallization ◽

Nominal Composition ◽

Ti Alloy ◽

Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

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