Adhesive Mechanism of Al2O3/Cu Composite Film via Aerosol Deposition Process for Application of Film Resistor

2019 ◽  
Vol 15 (2) ◽  
pp. 227-237 ◽  
Author(s):  
Myung-Yeon Cho ◽  
Dong-Won Lee ◽  
Pil-Ju Ko ◽  
Sang-Mo Koo ◽  
Jaesik Kim ◽  
...  
Keyword(s):  
Composite Film ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Film Resistor

Dielectric properties of percolative BaTiO3/Ni composite film fabricated by aerosol deposition process

2016 ◽  
Vol 27 (8) ◽  
pp. 8567-8572 ◽  
Author(s):  
Jin Hyeon Kim ◽  
Hong-Ki Kim ◽  
Seung-Hwan Lee ◽  
Sung-Gap Lee ◽  
Jae-Sik Kim ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Composite Film ◽  
Aerosol Deposition ◽  
Deposition Process

Hybrid Aerosol Deposition Process for Ceramic Coatings

2018 ◽  
Vol 87 (2) ◽  
pp. 136-143 ◽  
Author(s):  
Kentaro SHINODA ◽  
Takanori SAEKI ◽  
Jun AKEDO
Keyword(s):  
Aerosol Deposition ◽  
Deposition Process ◽  
Ceramic Coatings

Formation of silver films for advanced electrical properties by using aerosol deposition process

2018 ◽  
Vol 57 (11S) ◽  
pp. 11UF05 ◽  
Author(s):  
Myung-Yeon Cho ◽  
Dong-Won Lee ◽  
Ik-Soo Kim ◽  
Won-Ho Lee ◽  
Je-Wook Yoo ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Silver Films

Experimental Production of Industrial Roller Coated by Hard α-Al2O3Film Using Aerosol Deposition Process

2016 ◽  
pp. 159-164
Author(s):  
Naoki Seto ◽  
Kazuteru Endo ◽  
Noriaki Honda ◽  
Nobuo Sakamoto ◽  
Shingo Hirose ◽  
...  
Keyword(s):  
Aerosol Deposition ◽  
Deposition Process ◽  
Experimental Production

scholarly journals Numerical modeling of aerosol deposition process

2019 ◽  
Vol 370 ◽  
pp. 269-287 ◽  
Author(s):  
A. Zabihi Yeganeh ◽  
M. Jadidi ◽  
C. Moreau ◽  
A. Dolatabadi
Keyword(s):  
Numerical Modeling ◽  
Aerosol Deposition ◽  
Deposition Process

Microstructural observation of a composite film of c-BN and h-BN phases

2000 ◽  
Vol 15 (11) ◽  
pp. 2292-2295 ◽  
Author(s):  
Young-Joon Park ◽  
Young-Joon Baik ◽  
Jae Hyoung Choi ◽  
Jeong Yong Lee ◽  
Jun-Hee Hahn
Keyword(s):  
Thin Film ◽  
Film Thickness ◽  
Composite Film ◽  
Ion Beam ◽  
Ion Bombardment ◽  
Deposition Process ◽  
Microstructural Observation ◽  
Ion Beam Assisted Deposition

BN films consisting of c-BN and h-BN phases were synthesized using an ion-beam-assisted deposition process. In contrast to conventional observations, the c-BN and h-BN phases did not form separate layers, but were distributed in the form of nano-sized grains throughout the film thickness. No distinctly aligned h-BN layer was observed before the c-BN phase. Such a mixed character of the film was attributed to a localized ion bombardment effect instead of the macro-stress. Possibly because of the presence of scattered h-BN phases, the thin film described here possessed a low hardness of about 20 GPa and a low stress of about 5 GPa, compared with other reported c-BN-containing films.

Production of Y‐Ba‐Cu‐0 Superconducting Thin Films by an Aerosol Chemical Vapor Deposition Process

1989 ◽  
Vol 169 ◽  
Author(s):  
A. Driessen ◽  
Q. Tang ◽  
L. Hilderink ◽  
Th.J.A. Popma
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Superconducting Film ◽  
Superconducting Thin Films ◽  
Metal Organic ◽  
Vacuum Method

AbstractThin film production by aerosol deposition is a simple, non‐vacuum method, which under certain conditions of the process parameters, can be considered as a chemical vapor deposition (CVD) process. In this paper we describe the formation of superconducting thin films by aerosol deposition in the CVD regime by using metal‐organic precursors. The best results were obtained with the metal β‐diketonates of Y, Ba and Cu dissolved in butylacetate. This solution was nebulized and sprayed on a heated Si‐substrate with a Zr02‐buffer layer at a temperature of 450 C. After deposition a final heat treatment at a temperature of 800 C was applied. The resulting superconducting film has a Tc>2ero of 75 K.

Metal-Core Printed Circuit Board With Alumina Layer by Aerosol Deposition Process

2008 ◽  
Vol 29 (9) ◽  
pp. 991-993 ◽  
Author(s):  
Hyun Min Cho ◽  
Hyeong Joon Kim
Keyword(s):  
Printed Circuit Board ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Circuit Board ◽  
Metal Core ◽  
Alumina Layer ◽  
Printed Circuit

Fabrication of Microstrip Band Pass Filters in GHz Region by Aerosol Deposition Process

2006 ◽  
Vol 301 ◽  
pp. 117-120
Author(s):  
Mihoko Momotani ◽  
Naoko Mori ◽  
Song Min Nam ◽  
Hirofumi Kakemoto ◽  
Satoshi Wada ◽  
...  
Keyword(s):  
High Frequency ◽  
Thick Films ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Passive Component ◽  
Band Pass Filter ◽  
Network Analyzer ◽  
Fabrication Technology ◽  
Pass Filter ◽  
Band Pass

In order to fabricate a microstrip band pass filter in GHz region as a passive component of RF modules, Al2O3 thick films were prepared on Cu metal substrates by AD (Aerosol Deposition) process. The dimensions of the filters were determined by the high frequency electromagnetic analysis. The filters were successfully fabricated on AD-derived Al2O3 thick films by employing sputtering, photolithography, electroplating and chemical etching processes. Their filtering characteristics were examined by a Network Analyzer. Through this work, we suggest that the AD process will be important the fabrication technology for integrated RF modules.

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