scholarly journals Integrated Extrusion–Shear Forming Process of the Solid-State Recycled AZ80 Magnesium Alloy via Hot Press Sintering

2020 ◽  
Vol 33 (3) ◽  
pp. 351-361
Author(s):  
Bing Li ◽  
Bugang Teng ◽  
Baoting Zhang
Keyword(s):  
Solid State ◽  
Magnesium Alloy ◽  
Hot Press ◽  
Forming Process ◽  
Az80 Magnesium Alloy ◽  
Hot Press Sintering

Preparation of Bi3.6Ho0.4Ti3O12 Ceramics by Hot-Press Sintering

2012 ◽  
Vol 508 ◽  
pp. 253-256
Author(s):  
Chuan Bin Wang ◽  
L. Fu ◽  
Qiang Shen ◽  
Lian Meng Zhang
Keyword(s):  
Solid State ◽  
Relative Density ◽  
Solid State Reaction ◽  
Applied Pressure ◽  
Pressureless Sintering ◽  
Hot Press ◽  
Phase Density ◽  
Densification Temperature ◽  
Hot Press Sintering ◽  
Calcined Temperature

Hot-Press Sintering, a Method that Could Effectively Decrease the Densification Temperature due to the Applied Pressure, Was Employed to Prepare a New Kind of Ho3+ Doped Bi4Ti3O12 Ceramics, Bi3.6Ho0.4Ti3O12. The Effect of Preparation Parameters on the Crystal Phase, Density and Microstructure of the Ceramics Were Investigated. at First, Single-Phased Bi3.6Ho0.4Ti3O12 Powders Were Synthesized from Bi2o3, Tio2 and Ho2o3 Raw Powders by Solid-State Reaction and the Optimum Calcined Temperature Should Be 900 °C. The as-Synthesized Powders Were Further Densified at 750-900 °C to Prepare Bi3.6Ho0.4Ti3O12 Ceramics. Dense (relative Density Was 99.4 %) Bi3.6Ho0.4Ti3O12 Ceramics with a Compact Texture Were then Obtained by Hot-Press at 850 °C, about 150-200 °C Lower as Compared with Pressureless Sintering.

Enhanced thermoelectric properties of BaZn2Sb2via a synergistic optimization strategy using co-doped Na and Sr

2016 ◽  
Vol 4 (31) ◽  
pp. 12119-12125 ◽  
Author(s):  
Ruijuan Yan ◽  
Wanyu Lv ◽  
Ke Wang ◽  
Kai Guo ◽  
Xinxin Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid State ◽  
Power Factor ◽  
Solid State Reaction ◽  
Solid State Reaction Method ◽  
Optimization Strategy ◽  
Hot Press ◽  
Reaction Method ◽  
Hot Press Sintering ◽  
Co Doped

Polycrystalline samples of Ba1−x−yNaxSryZn2Sb2 (0 ≤ x ≤ 0.1, 0 ≤ y ≤ 0.1) were prepared by a solid-state reaction method and hot press sintering with the aim of achieving synergistic optimization of the power factor and thermal conductivity.

Semi-Solid Moulding of AZ91D Magnesium Alloy

2016 ◽  
Vol 850 ◽  
pp. 790-801
Author(s):  
Hong Xu ◽  
Xin Zhang ◽  
Chang Shun Wang ◽  
Jin Chuan Hu ◽  
Cheng Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solid State ◽  
Magnesium Alloy ◽  
Magnesium Alloys ◽  
Metal Forming ◽  
Forming Process ◽  
Microstructural Characteristics ◽  
Az91d Magnesium Alloy ◽  
Key Points ◽  
Semi Solid

AZ91D magnesium alloy is one of the most widely used magnesium alloys in the production of metal forming, which use the characteristics from liquid state to solid state of metal to form. The present status of the research and application of the semi-solid forming for AZ91D magnesium alloys at present was reviewed in this paper, including the microstructural characteristics, the thixotropic and rheological behavior, the forming process of semi-solid for AZ91D magnesium alloys and the mechanical properties of the parts made of semi-solid magnesium alloys. The developing prospects and the key points of the semi-solid forming for AZ91D magnesium alloys were forecasted, and the industrial application of the alloy were also discussed.

Forming Analysis of AZ80 Magnesium Alloy Thick-Walled Tube Fabricated by Hydrostatic Shrinkage Extrusion

2019 ◽  
Vol 950 ◽  
pp. 80-84
Author(s):  
Yang Li ◽  
Ren Shu Yuan
Keyword(s):  
Magnesium Alloy ◽  
High Performance ◽  
Equivalent Stress ◽  
Extrusion Ratio ◽  
Forming Process ◽  
Az80 Magnesium Alloy ◽  
Forming Analysis ◽  
Series Of Experiments ◽  
Extrusion Technology ◽  
3D Software

In order to obtain high performance magnesium alloy thick-walled tubes, the magnesium alloy ingot was extruded by hydrostatic shrinkage extrusion technology. Through a series of experiments, it was found that the magnesium alloy tube was not formed in the extrusion ratio that is smaller than 2.11 . Deform-3D software was used to simulate the tube forming process under different extrusion ratios. It was noting that at the condition of the extrusion ratio of 2.11, the equivalent stress and strain of the extruded tube at the fixed sizing zone were obviously unevenly distributed, which was disappeared with the increase of the extrusion ratio. Compared with the homogenized magnesium alloy , the yield strength, the tensile strength and the elongation were improved when the tensile test was carried out on the extruded magnesium alloy thick-walled tube. These results clearly showed that the mechanical properties of magnesium alloy tubes were improved after hydrostatic extrusion.

scholarly journals Remarkable plasma-resistance performance by nanocrystalline Y2O3·MgO composite ceramics for semiconductor industry applications

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Hyeon-Myeong Oh ◽  
Young-Jo Park ◽  
Ha-Neul Kim ◽  
Kundan Kumar ◽  
Jae-Woong Ko ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Semiconductor Industry ◽  
High Plasma ◽  
Hot Press ◽  
Composite Ceramics ◽  
Plasma Resistance ◽  
Industry Applications ◽  
Hot Press Sintering ◽  
Resistance Performance ◽  
First Time

AbstractMotivated by recent finding of crystallographic-orientation-dependent etching behavior of sintered ceramics, the plasma resistance of nanocrystalline Y2O3-MgO composite ceramics (YM) was evaluated for the first time. We report a remarkably high plasma etching resistance of nanostructure YM surpassing the plasma resistance of commercially used transparent Y2O3 and MgAl2O4 ceramics. The pore-free YM ceramic with grain sizes of several hundred nm was fabricated by hot press sintering, enabling theoretical maximum densification at low temperature. The insoluble two components effectively suppressed the grain growth by mutual pinning. The engineering implication of the developed YM nanocomposite imparts enhanced mechanical reliability, better cost effectiveness with excellent plasma resistance property over their counterparts in plasma using semiconductor applications.

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