Experimental in-plane characterization of a cellular material composed by a cell with a normal re-entrant link and geometrical parameters effects on the structure mechanical properties

2018 ◽  
Vol 41 (1) ◽  
Author(s):  
Mourad Boukhatem ◽  
Toufik Benmansour ◽  
Valéry Valle ◽  
Mustapha Bouakba
Keyword(s):  
Mechanical Properties ◽  
Cellular Material ◽  
Geometrical Parameters ◽  
A Cell

Microstructural and fractographic characterization of B4C-Al cermets tested under dynamic and static loading

1989 ◽  
Vol 47 ◽  
pp. 562-563
Author(s):  
Gyeung Ho Kim ◽  
Mehmet Sarikaya ◽  
D. L. Milius ◽  
I. A. Aksay
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Static Loading ◽  
Carbon Deposition ◽  
Full Density ◽  
Unique Combination ◽  
Strong Component ◽  
Reaction Products

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.

Characterization of interfaces in CVD-coated nicalon fiber-reinforced SiC

1989 ◽  
Vol 47 ◽  
pp. 556-557
Author(s):  
K.L. More ◽  
R.A. Lowden
Keyword(s):  
Mechanical Properties ◽  
Fracture Toughness ◽  
Chemical Vapor ◽  
Chemical Vapor Infiltration ◽  
Frictional Stress ◽  
Fiber Reinforced ◽  
Pull Out ◽  
Carbon Coated ◽  
Fiber Matrix

The mechanical properties of fiber-reinforced composites are directly related to the nature of the fiber-matrix bond. Fracture toughness is improved when debonding, crack deflection, and fiber pull-out occur which in turn depend on a weak interfacial bond. The interfacial characteristics of fiber-reinforced ceramics can be altered by applying thin coatings to the fibers prior to composite fabrication. In a previous study, Lowden and co-workers coated Nicalon fibers (Nippon Carbon Company) with silicon and carbon prior to chemical vapor infiltration with SiC and determined the influence of interfacial frictional stress on fracture phenomena. They found that the silicon-coated Nicalon fiber-reinforced SiC had low flexure strengths and brittle fracture whereas the composites containing carbon coated fibers exhibited improved strength and fracture toughness. In this study, coatings of boron or BN were applied to Nicalon fibers via chemical vapor deposition (CVD) and the fibers were subsequently incorporated in a SiC matrix. The fiber-matrix interfaces were characterized using transmission and scanning electron microscopy (TEM and SEM). Mechanical properties were determined and compared to those obtained for uncoated Nicalon fiber-reinforced SiC.

PREPARATION AND CHARACTERIZATION OF REPROCESSED COMPOSITES OF POLYPROPYLENE REINFORCED BY WOOD FIBERS: PHYSICAL AND MECHANICAL PROPERTIES

2017 ◽  
Author(s):  
Thais Helena Sydenstricker Flores-Sahagun ◽  
Kelly Priscila Agapito ◽  
ROSA MARIA JIMENEZ AMEZCUA ◽  
Felipe Jedyn
Keyword(s):  
Mechanical Properties ◽  
Physical And Mechanical Properties ◽  
Wood Fibers

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

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