Effect of substrate temperature on the properties of P-doped a-Si:H films prepared at high deposition rate

1987 ◽  
Vol 97-98 ◽  
pp. 1387-1390
Author(s):  
Masato Ueda ◽  
Takeshi Imura ◽  
Yukio Osaka
2001 ◽  
Vol 664 ◽  
Author(s):  
S.R. Sheng ◽  
R. Braunstein ◽  
B.P. Nelson ◽  
Y. Xu

ABSTRACTThe electronic transport properties of high deposition rate a-Si:H films prepared by HWCVD have been investigated in detail by employing the microwave photomixing technique. The high deposition rates (up to 1 µm/min.) were achieved by adding a second filament, increasing deposition pressure, silane flow rate, and decreasing filament-to-substrate distance. The effect of the deposition rate on the resultant film properties with respect to the substrate temperature, deposition pressure and silane flow rate was studied. It was found that the film transport properties do not change monotonically with increasing deposition rate. The photoconductivity peaks at ∼70-90 Å/s, where both the drift mobility and lifetime peak, consistent with the deposition rate dependence of the range and depth of the potential fluctuations. High quality, such as a photoconductivity-to-dark-conductivity ratio of ∼105 and nearly constant low charged defect density, can be maintained at deposition rates up to ∼150 Å/s, beyond which the film properties deteriorate rapidly as a result of an enhanced effect of the long-range potential fluctuations due to a considerable increase in the concentration of the charged defects. Our present results indicate that medium silane flow rate, low pressure, and higher substrate temperature are generally required to maintain high quality films at high deposition rates.


2013 ◽  
Vol 591 ◽  
pp. 99-103 ◽  
Author(s):  
Hao Zhang ◽  
Shu Wang Duo ◽  
Xiang Min Xu ◽  
Huan Ke ◽  
Ting Zhi Liu ◽  
...  

CrN coatings have been deposited successfully by Closed Filed Unbalanced Magnetron Sputter Ion Plating (CFUMSIP). The effect of substrate temperature (TS) and bias voltage (VB) together on microstructure, morphologies and mechanical properties of CrN coatings were studied. The results showed that the deposition rate of CrN coatings declines with the increase of VB Under both room temperature (R.M.) and 300°C. The FCC-CrN disappeared gradually and orth-CrN arised with the increase of VB, and the TS promoted the transformation from FCC - CrN to orth - CrN. The surface morphology of CrN coatings with changed VBs was greatly different, and VB could further improve the mechanical properties of coatings. In this paper, the CrN coating with the parameters (TS =300°C, VB =-30V) had relatively high deposition rate and mechanical properties.


1996 ◽  
Vol 198-200 ◽  
pp. 1063-1066 ◽  
Author(s):  
B. Alhallani ◽  
R. Tews ◽  
G. Suchaneck ◽  
S. Röhlecke ◽  
A. Kottwitz ◽  
...  

2006 ◽  
Vol 527-529 ◽  
pp. 299-302
Author(s):  
Hideki Shimizu ◽  
Yosuke Aoyama

3C-SiC films grown on carbonized Si (100) by plasma-assisted CVD have been investigated with systematic changes in flow rate of monosilane (SiH4) and propane (C3H8) as source gases. The deposition rate of the films increased monotonously and the microstructures of the films changed from 3C-SiC single crystal to 3C-SiC polycrystal with increasing flow rate of SiH4. Increasing C3H8 keeps single crystalline structure but results in contamination of α-W2C, which is a serious problem for the epitaxial growth. To obtain high quality 3C-SiC films, the effects of C3H8 on the microstructures of the films have been investigated by reducing the concentration of C3H8. Good quality 3C-SiC single crystal on Si (100) is grown at low net flow rate of C3H8 and SiH4, while 3C-SiC single crystal on Si (111) is grown at low net flow rate of C3H8 and high net flow rate of SiH4. It is expected that 3C-SiC epitaxial growth on Si (111) will take placed at a higher deposition rate and lower substrate temperature than that on Si (100).


2021 ◽  
Vol 48 (6) ◽  
pp. 0602112
Author(s):  
庞祎帆 Pang Yifan ◽  
傅戈雁 Fu Geyan ◽  
王明雨 Wang Mingyu ◽  
龚燕琪 Gong Yanqi ◽  
余司琪 Yu Siqi ◽  
...  

1977 ◽  
Vol 13 (20) ◽  
pp. 608 ◽  
Author(s):  
K. Yoshida ◽  
Y. Furui ◽  
S. Sentsui ◽  
T. Kuroha

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